Workpiece processing device and method

Patent metadata

Field	Value
Publication number	US-11504869-B2
Application number	US-202117187538-A
Country	US
Kind code	B2
Filing date	Feb 26, 2021
Priority date	Mar 6, 2019
Publication date	Nov 22, 2022
Grant date	Nov 22, 2022

Abstract

A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

First claim

The invention claimed is:

1. A workpiece processing device for processing a workpiece having an outwardly-convex curved-surface-shape surface that is non-cylindrical shape surface, comprising:
a workpiece supporting unit, including a rotary table, configured to support the workpiece so that the workpiece is rotatable around a first axis;
a cutting unit having a blade configured to cut, the surface of the workpiece supported by the workpiece supporting unit;
a sensor unit, including a sensor, configured to measure the surface of the workpiece; and
a processor, including processing circuitry operatively connected to the workpiece supporting unit, the cutting unit, and the sensor unit, configured to:
calculate the outwardly-convex curved-surface-shape surface that is non-cylindrical shape surface of the workpiece on a plane perpendicular to the first axis based on a measurement result of the surface of the workpiece; and
rotate the workpiece around the first axis based on the calculated outwardly-convex curved-surface-shape surface that is non-cylindrical shape surface of the workpiece and a cutting position at which a groove is formed on the surface of the workpiece so that the cutting position matches a vertex in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and relatively move the workpiece supporting unit and the cutting unit, thereby forming a groove at the cutting position, the processor being configured to form the groove at the cutting position in a state that an incision direction of the blade and the first axis being capable of deviating from each other.

2. The workpiece processing device according to claim 1 , wherein the processor is further configured to:
calculate a normal line to the surface of the workpiece at the cutting position based on the outwardly-convex curved-surface-shape surface that is non-cylindrical shape surface of the workpiece, and
rotate the workpiece around the first axis so that the normal line is parallel to a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and relatively move the workpiece supporting unit and the cutting unit, thereby forming a groove at the cutting position.

3. The workpiece processing device according to claim 1 , wherein the processor is further configured to:
calculate a tangent line to the surface of the workpiece at the cutting position based on the outwardly-convex curved-surface-shape surface that is non-cylindrical shape surface of the workpiece, and
rotate the workpiece around the first axis so that the tangent line is perpendicular to a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and relatively move the workpiece supporting unit and the cutting unit, thereby forming a groove at the cutting position.

4. The workpiece processing device according to claim 1 , further comprising
a fixing surface on which the workpiece is fixed in the workpiece supporting unit, the fixing surface configured to be movable to adjust a cut-feeding direction of the blade.

Assignees

• Tokyo Seimitsu Co Ltd

Inventors

• Iida Takahiro
• Nishikawa Teruhiko
• Shimizu Tasuku

Classifications

• B23Q15/26

  of angular position · CPC title

• B24B51/00 Primary

  Arrangements for automatic control of a series of individual steps in grinding a workpiece (if applicable to other machine tools, G05B takes precedence) · CPC title

• B26D5/00

  Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting · CPC title

• B26D7/01

  Means for holding or positioning work · CPC title

• B24B19/02

  for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements · CPC title