Die carrier package and method of forming same

Patent metadata

Field	Value
Publication number	US-11502009-B2
Application number	US-202117165005-A
Country	US
Kind code	B2
Filing date	Feb 2, 2021
Priority date	Oct 30, 2018
Publication date	Nov 15, 2022
Grant date	Nov 15, 2022

Abstract

Various embodiments of a die carrier package and a method of forming such package are disclosed. The package includes one or more dies disposed within a cavity of a carrier substrate, where a first die contact of one or more of the dies is electrically connected to a first die pad disposed on a recessed surface of the cavity, and a second die contact of one or more of the dies is electrically connected to a second die pad also disposed on the recessed surface. The first and second die pads are electrically connected to first and second package contacts respectively. The first and second package contacts are disposed on a first major surface of the carrier substrate adjacent the cavity.

First claim

What is claimed is:

1. A method of forming a die carrier package, comprising:
forming a cavity in a first major surface of a carrier substrate, wherein the cavity comprises a recessed surface;
forming a patterned conductive layer on the recessed surface of the cavity and the first major surface of the carrier substrate, wherein the first patterned conductive layer comprises first and second package contacts disposed on the first major surface of the carrier substrate adjacent the cavity and first and second die pads disposed on the recessed surface of the cavity, wherein the first package contact is electrically connected to the first die pad by a first conductor and the second package contact is electrically connected to the second die pad by a second conductor;
disposing a die within the cavity, wherein the die is adapted to emit electromagnetic radiation from an active surface of the die;
electrically connecting a first die contact of the die to the first die pad of the patterned conductive layer, wherein the first die contact is disposed on the active surface of the die; and
electrically connecting a second die contact of the die to the second die pad of the patterned conductive layer, wherein the second die contact is disposed on a major surface of the die that faces the recessed surface and is opposed to the active surface;
wherein the first and second conductors of the patterned conductive layer extend between the recessed surface of the cavity and the first major surface of the carrier substrate adjacent the cavity.

2. The method of claim 1 , wherein forming the patterned conductive layer comprises:
disposing a first metal layer on at least a portion of the recessed surface of the cavity and the first major surface of the carrier substrate;
patterning a portion of the first metal layer;
disposing a second metal layer on the patterned first metal layer; and
patterning a portion of the second metal layer such that the patterned portion of the first metal layer is registered with the patterned portion of the second metal layer.

3. The method of claim 1 , further comprising disposing solder bumps on each of the first and second package contacts.

4. The method of claim 1 , further comprising disposing an encapsulant over the die and within the cavity.

5. The method of claim 1 , wherein electrically connecting the first die contact to the first die pad comprises wire-bonding the first die contact to the first die pad.

6. The method of claim 1 , further comprising disposing an insulative layer on the first major surface of the carrier substrate prior to forming the cavity in the first major surface of the carrier substrate.

7. The method of claim 6 , further comprising disposing a photoresist layer on the insulative layer prior to forming the cavity in the first major surface of the carrier substrate.

8. The method of claim 7 , further comprising etching the photoresist layer and the insulative layer prior to forming the cavity in the first major surface of the carrier substrate.

9. The method of claim 1 , further comprising disposing an insulative layer on one or more portions of the carrier substrate prior to forming the patterned conductive layer.

10. The method of claim 9 , wherein forming the patterned conductive layer comprises disposing a metal layer onto the insulative layer.

11. The method of claim 10 , wherein disposing the metal layer comprises sputtering the metal layer onto the insulative layer.

12. The method of claim 1 , wherein forming the patterned conductive layer comprises:
disposing a first metal layer on at least a portion of the recessed surface of the cavity and the first major surface of the carrier substrate;
patterning a portion of the first metal layer;
disposing a dielectric layer on the patterned first metal layer;
disposing a second metal layer on the dielectric layer and the patterned first metal layer; and
patterning a portion of the second metal layer such that the patterned portion of the first metal layer is registered with the patterned portion of the second metal layer.

13. A method comprising:
disposing a die carrier package on a first major surface of device substrate, wherein the package comprises:
a die that comprises an active surface facing the device substrate, wherein the die is adapted to emit light through the first and second major surfaces of the device substrate, wherein the die is disposed within a cavity of a carrier substrate of the package, wherein the die further comprises a first die contact disposed on the active surface of the die and a second die contact disposed on a major surface of the die that faces a recessed surface of the cavity of the die carrier package and that is opposed to the active surface, wherein the first die contact is electrically connected to a first package contact disposed on a first major surface of the carrier substrate of the package adjacent the cavity and the second die contact is electrically connected to a second package contact disposed on the first major surface of the carrier substrate of the package adjacent the cavity, wherein the first and second package contacts are disposed between the first major surface of the carrier substrate and the first and second major surfaces of the device substrate; and

disposing a detector on the first major surface of the device substrate, wherein the detector is adapted to detect at least a portion of the light emitted by the die.

14. The method of claim 13 , further comprising hermetically sealing the device substrate to a housing such that the die carrier package and the detector are disposed within the housing.

15. The method of claim 14 , wherein hermetically sealing the device substrate comprises laser bonding the device substrate to the housing.

16. The method of claim 15 , further comprising forming an external electrode on a second major surface of the device substrate.

17. The method of claim 14 , further comprising electrically connecting the first and second package contacts to a patterned conductive layer disposed on the first major surface of the device substrate.

18. A method comprising:
forming cavities in a first major surface of a carrier substrate wafer that comprises a plurality of carrier substrates, wherein the first major surface of the carrier substrate wafer forms a first major surface of each carrier substrate, wherein each cavity comprises a recessed surface;
forming a patterned conductive layer on the recessed surface of each cavity and the first major surface of the carrier substrate wafer, wherein the first patterned conductive layer comprises first and second package contacts disposed on the first major surface of each carrier substrate adjacent the cavity and first and second die pads disposed on the recessed surface of the cavity, wherein the first package contact is electrically connected to the first die pad by a first conductor and the second package contact is electrically connected to the second die pad by a second conductor;
disposing a die within each cavity, wherein each die is adapted to emit electromagnetic radiation from an active surface of the die;
electrically connecting a first die contact of each die to the first die pad of the patterned conductive layer of each carrier substrate, wherein the first die contact is disposed on the active surface of the die; and
electrically connecting a second die contact of each die to the second die pad of the patterned conductive layer of each carrier substrate, wherein the second die contact is disposed on a major surface of the

Assignees

• Medtronic Inc

Inventors

• Boone Mark R
• Henschel Mark E

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/01

  Manufacture or treatment · CPC title

• H10W72/075

  of bond wires · CPC title