Hermetically-sealed package and method of forming same

Patent metadata

Field	Value
Publication number	US-10463285-B2
Application number	US-201715477904-A
Country	US
Kind code	B2
Filing date	Apr 3, 2017
Priority date	Apr 3, 2017
Publication date	Nov 5, 2019
Grant date	Nov 5, 2019

Abstract

Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing, a substrate hermetically sealed to the housing, and a light source disposed on a first major surface of the substrate. The package further includes a detector disposed on the first major surface of the substrate and having a detecting surface. The package also includes a masking layer disposed on at least one of the first major surface and a second major surface of the substrate, where the masking layer includes a first aperture aligned with an emission axis of the light source in a direction orthogonal to the first major surface of the substrate. The masking layer further includes a second aperture aligned with a detection axis of the detector in a direction orthogonal to the first major surface of the substrate.

First claim

What is claimed is:

1. A hermetically-sealed package, comprising:
a housing comprising an inner surface and an outer surface;
a substrate hermetically sealed to the housing and comprising a first major surface and a second major surface;
a light source disposed on the first major surface of the substrate and comprising an emitting surface, wherein the light source is adapted to emit light through the first and second major surfaces of the substrate;
a detector disposed on the first major surface of the substrate and comprising a detecting surface, wherein the detector is adapted to detect at least a portion of the light emitted by the light source; and
a masking layer disposed on at least one of the first major surface and the second major surface of the substrate, wherein the masking layer comprises a first aperture aligned with an emission axis of the light source in a direction orthogonal to the first major surface of the substrate, wherein the masking layer further comprises a second aperture aligned with a detection axis of the detector in a direction orthogonal to the first major surface of the substrate.

2. The package of claim 1 , wherein the masking layer is disposed on the first major surface, wherein the light source is disposed within the first aperture and the detector is disposed within the second aperture.

3. The package of claim 2 , further comprising an insulation layer disposed such that masking layer is between the insulation layer and the first major surface of the substrate.

4. The package of claim 1 , wherein the masking layer is disposed on the second major surface.

5. The package of claim 1 , wherein the masking layer comprises a dielectric material.

6. The package of claim 1 , wherein the masking layer comprises an electrically conductive material.

7. The package of claim 1 , wherein the masking layer comprises a light absorbing material.

8. The package of claim 7 , wherein the masking layer is adapted to absorb visible light.

9. The package of claim 7 , wherein the masking layer is adapted to absorb near infrared light.

10. The package of claim 1 , wherein the masking layer comprises columnar TiN.

11. The package of claim 1 , further comprising an antenna disposed on the second major surface of the substrate.

12. The package of claim 11 , wherein the antenna is disposed on a first portion of the second major surface of the substrate, wherein the light source is disposed such that the emission axis is aligned with a second portion of the second major surface of the substrate in a direction orthogonal to the first major surface of the substrate.

13. The package of claim 11 , wherein the antenna comprises a first interstitial portion, wherein the detector is aligned with the first interstitial portion in a direction orthogonal to the first major surface of the substrate.

14. The package of claim 11 , wherein the masking layer comprises an antenna seed layer disposed between the antenna and the second major surface of the substrate, wherein the antenna seed layer comprises a roughened surface.

Assignees

• Medtronic Inc

Inventors

• Boone Mark R
• Kuhn Jonathan L

Classifications

• A61N1/39 Primary

  Heart defibrillators · CPC title

• A61N1/37518

  Anchoring of the implants, e.g. fixation · CPC title

• A61N1/059

  Anchoring means · CPC title

• A61N1/0587

  Epicardial electrode systems; Endocardial electrodes piercing the pericardium · CPC title

• A61N1/0563

  specially adapted for defibrillation or cardioversion · CPC title