Pedestal support design for precise chamber matching and process control

Patent metadata

Field	Value
Publication number	US-11501957-B2
Application number	US-202017011977-A
Country	US
Kind code	B2
Filing date	Sep 3, 2020
Priority date	Sep 3, 2020
Publication date	Nov 15, 2022
Grant date	Nov 15, 2022

Abstract

Process chambers and methods for calibrating components of a processing chamber while the chamber volume is under vacuum are described. The process chamber includes a motor shaft connected to the process chamber with a plurality of motor bolts. A support plate is positioned under the chamber floor to accommodate for deflection of the chamber floor due to vacuum conditions within the chamber volume. A bellows assembly extending from the chamber floor to the support plate maintains vacuum conditions within the chamber.

First claim

What is claimed is:

1. A process chamber comprising:
a chamber body having a chamber floor and sidewalls defining an interior volume, the chamber floor having a top surface and a bottom surface defining a thickness of the chamber floor and an opening through the thickness of the chamber floor;
a support plate having a top surface and a bottom surface defining a support plate thickness, the top surface of the support plate in contact with the bottom surface of the chamber floor, the support plate having an opening extending through the support plate thickness and aligned with the opening through the thickness of the chamber floor;
a support post extending through the support plate and the chamber floor, the support post having a rotational axis, a bottom end outside the interior volume and a top end inside the interior volume of the chamber body;
a motor connected to the bottom surface of the support plate and configured to rotate the support post around the rotational axis and move the support post along a length of the rotational axis;
a bellows configured to allow the support post to extend therethrough and separate a vacuum environment in the interior volume from an atmospheric environment outside the chamber body while allowing movement of the chamber floor; and
at least one alignment pin configured to maintain positioning of the support plate relative to the chamber floor, each of the at least one alignment pin being disposed within an aperture formed in the top surface of the support plate and an aperture formed in the bottom surface of the chamber floor, the at least one alignment pin being positioned within an outer peripheral portion of the chamber floor, the outer peripheral portion of the chamber floor being substantially unaffected by deflection when the interior volume is under a vacuum environment.

2. The process chamber of claim 1 , wherein the bellows is configured to allow the chamber floor to deflect under vacuum without affecting alignment of the support post.

3. The process chamber of claim 1 , wherein the support post further comprises a plurality of support arms connected to the support post, each of the support arms having support pedestal with a substrate support surface.

4. The process chamber of claim 1 , wherein there are at least three alignment pins.

5. The process chamber of claim 1 , wherein the outer peripheral portion is defined as the outer 25% of a distance from a center of the opening in the chamber floor to the sidewalls.

6. The process chamber of claim 1 , wherein when the interior volume is under a vacuum environment, a center portion of the chamber floor deflects toward the interior volume increasing a gap between the bottom surface of the chamber floor and the top surface of the support plate within the center portion, the gap remaining at atmospheric conditions.

7. The process chamber of claim 1 , wherein the bellows comprises a top plate and a bottom plate, the top plate connected to the chamber floor and the bottom plate connected to one or more of the support plate or the motor.

8. The process chamber of claim 7 , further comprising a bellows flange connected to the top plate of the bellows, the bellows flange having a diameter larger than a diameter of the top plate, the bellows flange connected to the top surface of the chamber floor.

9. The process chamber of claim 8 , further comprising at least one O-ring between the bellows flange and one or more of the top surface of the chamber floor or the top plate of the bellows.

10. A processing method comprising:
aligning a top surface of one or more substrate support surfaces located within a chamber volume with a chamber lid to establish a process gap, the one or more substrate support surfaces connected to a support post that extends through an opening in a chamber floor and an opening in a support plate attached to a bottom surface of the chamber floor; and
creating a vacuum environment within the chamber volume causing a center portion of the chamber floor to deflect toward the chamber volume increasing a gap between the bottom surface of the chamber floor and a top surface of the one or more substrate support surfaces within the center portion, the gap remaining at atmospheric conditions.

11. The processing method of claim 10 , wherein the process gap is between 1 mm and 2 mm.

12. The processing method of claim 10 , wherein a motor is connected to the bottom surface of the support plate and configured to rotate the support post around a rotational axis of the support post and move the support post along a length of the rotational axis.

13. The processing method of claim 10 , wherein a bellows configured to allow the support post to extend therethrough and separate the vacuum environment in the chamber volume from an atmospheric environment outside the chamber volume while allowing movement of the chamber floor.

14. The processing method of claim 13 , wherein the bellows is configured to allow the chamber floor to deflect under vacuum without affecting alignment of the support post.

15. The processing method of claim 13 , wherein at least one alignment pin configured to maintain positioning of the support plate relative to the chamber floor, each of the at least one alignment pin being disposed within an aperture formed in a top surface of the support plate and an aperture formed in a bottom surface of the chamber floor.

16. The processing method of claim 15 , wherein the at least one alignment pin is positioned within an outer peripheral portion of the chamber floor, the outer peripheral portion of the chamber floor being substantially unaffected by deflection when the chamber volume is under a vacuum environment.

17. A process chamber comprising:
a chamber body having a chamber floor and sidewalls defining an interior volume, the chamber floor having a top surface and a bottom surface defining a thickness of the chamber floor and an opening through the thickness of the chamber floor;
a support plate having a top surface and a bottom surface defining a support plate thickness, the top surface of the support plate in contact with the bottom surface of the chamber floor, the support plate having an opening extending through the support plate thickness and aligned with the opening through the thickness of the chamber floor;
a support post extending through the support plate and the chamber floor, the support post having a rotational axis, a bottom end outside the interior volume and a top end inside the interior volume of the chamber body;
a motor connected to the bottom surface of the support plate and configured to rotate the support post around the rotational axis and move the support post along a length of the rotational axis;
a bellows configured to allow the support post to extend therethrough and separate a vacuum environment in the interior volume from an atmospheric environment outside the chamber body while allowing movement of the chamber floor; and,
a plurality of process stations located in the interior volume of the chamber body, the plurality of process stations being configured to perform one or more deposition processes;
wherein the bellows configured to allow the support post to extend therethrough and separate the vacuum environment in the interior volume from an atmospheric environment outside the chamber body while allowing movement of the chamber floor;
wherein the bellows is configured to allow the chamber floor to deflect under vacuum without affecting alignment of the support post;
wherein at least one alignment pin configured to maintain positioning of t

Assignees

• Applied Materials Inc

Inventors

• Krishna Gopu
• Polyak Alexander S
• Baluja Sanjeev

Classifications

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P72/7626

  characterised by the construction of the shaft · CPC title

• H10P72/7621

  characterised by supporting two or more semiconductor substrates · CPC title

• H10P72/0454

  surrounding a central transfer chamber · CPC title