Cable management for cryogenic system

Patent metadata

Field	Value
Publication number	US-11499764-B2
Application number	US-201916560917-A
Country	US
Kind code	B2
Filing date	Sep 4, 2019
Priority date	Sep 4, 2019
Publication date	Nov 15, 2022
Grant date	Nov 15, 2022

Abstract

A cooled system includes an enclosure having an outer surface and an inner surface comprising a cooled enclosed area, multiple cable brackets thermally coupled to the outer surface of the enclosure, each cable bracket including a first surface conforming to the outer surface of the enclosure and an opening therethrough sized to hold a cable and conduct heat from the cable to the outer surface of the enclosure.

First claim

The invention claimed is:

1. A cooled system comprising:
an enclosure having an outer surface and an inner surface comprising a cooled enclosed area;
multiple cable brackets formed as at least one block of thermally conductive material thermally coupled to the outer surface of the enclosure, each cable bracket comprising:
a first surface conforming to the outer surface of the enclosure; and
an opening therethrough sized to hold a cable and conduct heat from the cable to the outer surface of the enclosure.

2. The cooled system of claim 1 wherein the openings of the brackets are sized to thermally contact the cable on all sides of the cable and run through a length of each bracket.

3. The cooled system of claim 1 wherein the brackets are coupled to the outer surface of the enclosure by screws.

4. The cooled system of claim 3 wherein the brackets each comprise:
a first portion having the first surface and a first open portion; and
a second portion having a second open portion positioned to mate with the first open portion to form the opening sized to hold the cable in response to the first and second portions being coupled together by the screws.

5. The cooled system of claim 1 wherein each opening has a cross section corresponding to a ribbon cable.

6. The cooled system of claim 1 wherein each opening has a circular cross section corresponding to a round electrical cable.

7. The cooled system of claim 1 wherein each opening comprises multiple openings having cross sections corresponding to multiple electrical cables.

8. The cooled system of claim 1 wherein the enclosure comprises multiple flat rectangular panels coupled on long edges to form the enclosure comprising a polyhedron.

9. The cooled system of claim 8 wherein the panels and brackets are formed of thermally conductive material.

10. The cooled system of claim 8 and further comprising a cable supported in the opening of each bracket spaced apart from one of the flat rectangular panels and that extends into the cooled enclosure to provide a signal to an element within the cooled enclosure.

11. The cooled system of claim 10 wherein multiple panels have sets of cable brackets, wherein at least two sets of cable brackets have openings corresponding to and supporting different types of cables.

12. The cooled system of claim 10 wherein the enclosure encloses multiple elements comprising an oven, an RF generator, or control electronics, or any combination thereof.

13. The cooled system of claim 1 wherein the enclosed area comprises first and second cooled areas that are cooled by a cryogenic cooler.

14. The cooled system of claim 13 wherein the second cooled area is cooled to a temperature of approximately 4 K and the first cooled area is cooled to a temperature warmer than the second cooled area.

15. A method comprising:
holding a cable in multiple spaced apart brackets formed as at least one block of thermally conductive material having openings therethrough sized to hold the cable and conduct heat from the cable to a first side of a heat conducting panel, the brackets spacing the cable from the panel;
providing electricity via the cable to a device on a second side, opposite the first side, of the heat conducting panel; and
transferring heat generated by the electricity in the cable to the heat conducting panel via thermal conduction through the multiple spaced apart brackets.

16. The method of claim 15 and further comprising coupling multiple heat conducting panels on edges to form a polyhedral enclosure, wherein at least two of the heat conducting panels contain sets of spaced apart brackets holding cables of different types.

17. The method of claim 16 and further comprising cooling the device to a temperature of approximately 4 K.

18. The method of claim 16 and further comprising placing the enclosure into a vacuum.

Assignees

• Quantinuum Llc

Inventors

• Dally Adam
• Nichols Charles Spencer
• Langness Chad

Classifications

• H02G3/32

  using mounting clamps · CPC title

• H01B7/428

  Heat conduction · CPC title

• H01B7/42

  with arrangements for heat dissipation or conduction · CPC title

• H01B12/16 Primary

  characterised by cooling · CPC title

• F17C3/085

  Cryostats · CPC title