Thermal mitigation for USB power delivery
US-11515676-B2 · Nov 29, 2022 · US
with arrangements for heat dissipation or conduction · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01B7/42 |
| Official title | with arrangements for heat dissipation or conduction |
| Display label | with arrangements for heat dissipation or conduction |
| Total patents | 97 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2016 | 1 |
| 2017 | 1 |
| 2018 | 3 |
| 2019 | 7 |
| 2020 | 16 |
| 2021 | 11 |
| 2022 | 21 |
| 2023 | 15 |
| 2024 | 12 |
| 2025 | 10 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-11515676-B2 · Nov 29, 2022 · US
US-11499764-B2 · Nov 15, 2022 · US
US-2022314907-A1 · Oct 6, 2022 · US
US-11458913-B2 · Oct 4, 2022 · US
US-11453300-B2 · Sep 27, 2022 · US
US-2022301741-A1 · Sep 22, 2022 · US
US-2022301740-A1 · Sep 22, 2022 · US
US-11447081-B2 · Sep 20, 2022 · US
US-2022277871-A1 · Sep 1, 2022 · US
US-2022246323-A1 · Aug 4, 2022 · US
US-2022234530-A1 · Jul 28, 2022 · US
US-2022230782-A1 · Jul 21, 2022 · US
US-11380460-B2 · Jul 5, 2022 · US
US-2022199283-A1 · Jun 23, 2022 · US
US-2022192064-A1 · Jun 16, 2022 · US
US-2022190578-A1 · Jun 16, 2022 · US
US-2022161743-A1 · May 26, 2022 · US
US-2022161742-A1 · May 26, 2022 · US
US-2022041073-A1 · Feb 10, 2022 · US
US-2022045492-A1 · Feb 10, 2022 · US
Answers are generated from the same data shown on this page.