Heated floor panels

Patent metadata

Field	Value
Publication number	US-11499724-B2
Application number	US-201916453220-A
Country	US
Kind code	B2
Filing date	Jun 26, 2019
Priority date	Jul 3, 2018
Publication date	Nov 15, 2022
Grant date	Nov 15, 2022

Abstract

A heater panel includes a core and a heater/dielectric layer including a positive thermal coefficient (PTC) heater layer between a pair of dielectric layers. A structural facing is included, wherein the heater/dielectric layer is bonded directly between the core and the structural facing. A second structural facing can be bonded to the core opposite the heater/dielectric layer. An impact layer can be bonded to the structural facing, e.g., the first structural facing described above, opposite the heater/dielectric layer. The heater layer can be formed by direct writing a heating element pattern onto a dielectric layer bonded to the core.

First claim

What is claimed is:

1. A heater panel comprising:
a core;
a heater/dielectric layer including a positive thermal coefficient (PTC) heater layer between a pair of dielectric layers; and
a structural facing, wherein the heater/dielectric layer is bonded directly between the core and the structural facing, wherein the core, heater/dielectric layer, and structural facing are contoured out of plane, wherein the PTC heater layer is direct written onto one of the dielectric layers that is already contoured out of plane prior to printing the PTC heater layer.

2. The heater panel as recited in claim 1 , wherein the core includes at least one of a honeycomb structure and/or a foam material.

3. The heater panel as recited in claim 1 , wherein the structural facing is a first structural facing, and further comprising a second structural facing bonded to the core opposite the heater/dielectric layer.

4. The heater panel as recited in claim 3 , wherein the first structural facing and the second structural facing each include carbon fiber impregnated with a resin, wherein the resin includes at least one of a thermoplastic material and/or a thermoset material.

5. The heater panel as recited in claim 1 , further comprising an impact layer bonded to the structural facing opposite the heater/dielectric layer.

6. The heater panel as recited in claim 5 , wherein the impact layer includes at least one of a monolithic metal, a monolithic polymer, a resin-impregnated metal, and/or a resin- impregnated polymer fabric.

7. The heater panel as recited in claim 1 , wherein the heater layer is formed by direct writing a heating element pattern onto a dielectric layer bonded to the core.

8. The heater panel as recited in claim 1 , wherein the structural facing is a first structural facing and further comprising: a second structural facing bonded to the core opposite the heater/dielectric layer; and an impact layer bonded to the first structural facing opposite the heater/dielectric layer.

9. A method of making a heater panel comprising:
direct writing a positive thermal coefficient (PTC) heater layer onto a first dielectric layer wherein the first dielectric layer is curved prior to and during direct writing;
bonding a second dielectric layer to the PTC heater layer and to the first dielectric layer to make a heater/dielectric layer;
bonding a first dielectric layer to a core; and
bonding a structural facing to the heater/dielectric layer so the heater/dielectric layer is bonded directly between the core and the structural facing, wherein the core, heater/dielectric layer, and structural facing are contoured out of plane.

10. The method as recited in claim 9 , wherein the core includes at least one of a honeycomb structure and/or a foam material.

11. The method as recited in claim 9 , wherein the structural facing is a first structural facing, and further comprising bonding a second structural facing to the core opposite the heater/dielectric layer.

12. The method as recited in claim 11 , wherein the first structural facing and the second structural facing each include carbon fiber impregnated with a resin, wherein the resin includes at least one of a thermoplastic material and/or a thermoset material.

13. The method as recited in claim 9 , further comprising bonding an impact layer to the structural facing opposite the heater/dielectric layer.

14. The method as recited in claim 13 , wherein the impact layer includes at least one of a monolithic metal, a monolithic polymer, a resin-impregnated metal, and/or a resin-impregnated polymer fabric.

15. The method as recited in claim 9 , wherein direct writing the PTC heater layer onto the first dielectric layer includes direct writing a heating element pattern onto the first dielectric layer with the first dielectric layer already bonded to the core.

16. The method as recited in claim 15 , wherein direct writing the PTC heater layer includes direct writing a heating element pattern along a three-dimensional contour.

17. The method as recited in claim 9 , further comprising direct writing a close out layer to the heater/dielectric layer for bonding the structural facing to thereto.

Assignees

• Goodrich Corp

Inventors

• Hu Jin
• Ching Nathaniel
• Slane Casey
• Botura Galdemir Cezar

Classifications

• B64C1/18

  Floors · CPC title

• B32B2605/18

  Aircraft · CPC title

• B32B15/046

  of foam · CPC title

• H05B3/28 Primary

  heating conductor embedded in insulating material · CPC title

• Y02B30/00

  Energy efficient heating, ventilation or air conditioning [HVAC] · CPC title