Pattern forming method, electronic wiring substrate, optical device, and pattern forming apparatus
US-2015201491-A1 · Jul 16, 2015 · US
US9630701B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9630701-B2 |
| Application number | US-201414191873-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 27, 2014 |
| Priority date | Aug 21, 2013 |
| Publication date | Apr 25, 2017 |
| Grant date | Apr 25, 2017 |
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A method for providing an electrical connection for conductive ink includes direct writing a bus bar onto areas of a desired electrical connection of the conductive ink. The conductive ink is screen printed onto a dielectric film to create a conductive circuit. An aircraft heated floor panel includes at least one floor panel of an aircraft. The one floor panel includes a conductive circuit having a conductive ink including a bus bar directly written onto areas of a desired electrical connection of the conductive ink. The conductive ink is screen printed onto a dielectric film to create a conductive circuit.
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What is claimed is: 1. A method for providing an electrical connection for conductive ink, the method comprising: direct writing a bus bar onto areas of a desired electrical connection of the conductive ink, wherein the conductive ink is screen printed onto a dielectric film to create a conductive circuit, wherein the step of direct writing further includes forming a conformal layer of the bus bar on the conductive ink, and wherein forming the conformal layer of the bus bar on the conductive ink includes forming the conformal layer on a top surface, an edge and a side surface of the conductive ink. 2. A method as recited in claim 1 , further including soldering a wire to the bus bar to electrically connect the wire to the conductive ink. 3. A method as recited in claim 1 , wherein the conductive ink includes silver particles in an epoxy resin. 4. A method as recited in claim 1 , further including applying the conductive circuit to at least one panel skin of an aircraft floor panel. 5. A method as recited in claim 1 , wherein the bus bar is a metal bus bar. 6. A method as recited in claim 5 , wherein the metal bus bar is a copper bus bar. 7. A method as recited in claim 1 , wherein the bus bar is an alloy bus bar. 8. A heated floor panel comprising: at least one floor panel of an aircraft including a conductive circuit having a conductive ink including a bus bar directly written onto areas of a desired electrical connection for the conductive ink, wherein the conductive ink is screen printed onto a dielectric film to create a conductive circuit, wherein the bus bar is a conformal layer of bus bar on the conductive ink that conforms to a top surface, an edge and a side surface of the conductive ink. 9. A heated floor panel as recited in claim 8 , wherein a wire is soldered onto the bus bar to electrically connect the wire and the conductive circuit. 10. A heated floor panel as recited in claim 8 , wherein the conductive ink includes silver particles in an epoxy resin. 11. A heated floor panel as recited in claim 8 , wherein the bus bar is a metal bus bar. 12. A heated floor panel as recited in claim 11 , wherein the metal bus bar is a copper bus bar. 13. A heated floor panel as recited in claim 8 , wherein the bus bar is an alloy bus bar.
heating conductor mounted on insulating base {(for transparent areas H05B3/84, H05B3/86)} · CPC title
in walls, floors, ceilings · CPC title
Improvement of the adhesion between the insulating substrate and the metal · CPC title
by screen printing or stencil printing · CPC title
using serpentine layout · CPC title
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