Surface features for locating net substrate buttons to enable self-piercing riveting (SPR) on brittle and low toughness materials

US11499581B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11499581-B2
Application numberUS-201815926378-A
CountryUS
Kind codeB2
Filing dateMar 20, 2018
Priority dateMar 20, 2018
Publication dateNov 15, 2022
Grant dateNov 15, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A dimpled substrate for use in an assembly having joined substrates is provided that defines at least one preformed interior cavity, at least one preformed exterior profile adjacent the interior cavity and defining a wall therebetween, and at least one locating feature configured to identify a location of the at least one preformed exterior profile. In one form, the locating feature is disposed in the preformed exterior profile or adjacent to the preformed exterior profile. Alternatively, the locating feature is a notch formed into the dimpled substrate away from the preformed exterior profile.

First claim

Opening claim text (preview).

What is claimed is: 1. A dimpled substrate for use in an assembly having joined substrates, the dimpled substrate defining: at least one preformed interior cavity defined in an upper surface of the dimpled substrate; at least one preformed exterior profile extending from a lower surface of the dimpled substrate adjacent the interior cavity and defining a wall therebetween, the lower surface and the exterior profile defining an exterior portion of the dimpled substrate; and at least one locating feature formed into or protruding out of the exterior portion of the dimpled substrate and configured to identify a location of the at least one preformed exterior profile. 2. The dimpled substrate according to claim 1 , wherein the locating feature is disposed on the preformed exterior profile. 3. The dimpled substrate according to claim 1 , wherein the locating feature is disposed adjacent to the preformed exterior profile. 4. The dimpled substrate according to claim 1 , wherein the locating feature is a notch formed into the dimpled substrate away from the preformed exterior profile. 5. The dimpled substrate according to claim 1 , wherein the wall defines a variable thickness. 6. The dimpled substrate according to claim 1 , wherein the locating feature is selected from the group consisting of surface texturing, laser marking, laser projection, ink application, dimpling, chemical etching, a notch located on an edge of the substrate, a hole through the substrate adjacent to the preformed exterior profile, an indent, a bead, and an embossment. 7. The dimpled substrate according to claim 1 , wherein the locating feature is configured to identify the location of the preformed exterior profile for a vision system. 8. The dimpled substrate according to claim 1 , wherein the dimpled substrate is an aluminum casting or an aluminum extrusion. 9. The dimpled substrate according to claim 1 , wherein the dimpled substrate is a composite material. 10. An assembly comprising: an upper substrate; a dimpled substrate defining: a preformed interior cavity defined in an upper surface of the dimpled substrate; a preformed exterior profile extending from a lower surface of the dimpled substrate adjacent the preformed interior cavity and defining a wall therebetween, the lower surface and the preformed exterior profile defining an exterior portion of the dimpled substrate; and a locating feature formed into or protruding out of the exterior portion of the dimpled substrate and configured to identify a location of the preformed exterior profile; and a self-piercing rivet extending through the upper substrate and into the preformed interior cavity of the dimpled substrate. 11. The assembly according to claim 10 , wherein the wall defines a variable thickness. 12. The assembly according to claim 10 , wherein the preformed interior cavity is not plastically deformed after installation of the self-piercing rivet. 13. The assembly according to claim 10 , wherein the locating feature is disposed on the preformed exterior profile. 14. The assembly according to claim 10 , wherein the locating feature is disposed adjacent to the preformed exterior profile. 15. The assembly according to claim 10 , wherein the locating feature is a notch formed into the dimpled substrate away from the preformed exterior profile. 16. The assembly according to claim 10 , wherein the locating feature is selected from the group consisting of surface texturing, laser marking, laser projection, ink application, dimpling, chemical etching, a notch located on an edge of the substrate, a hole through the substrate adjacent to the preformed exterior profile, an indent, a bead, and an embossment.

Assignees

Inventors

Classifications

  • F16B5/04Primary

    by means of riveting (rivets F16B19/04) · CPC title

  • comprising metal as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042)} · CPC title

  • Dimensional properties · CPC title

  • Control devices specially adapted to riveting machines not restricted to one of the preceding subgroups · CPC title

  • 2 layers · CPC title

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Frequently asked questions

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What does patent US11499581B2 cover?
A dimpled substrate for use in an assembly having joined substrates is provided that defines at least one preformed interior cavity, at least one preformed exterior profile adjacent the interior cavity and defining a wall therebetween, and at least one locating feature configured to identify a location of the at least one preformed exterior profile. In one form, the locating feature is disposed…
Who is the assignee on this patent?
Ford Global Tech Llc
What technology area does this patent fall under?
Primary CPC classification F16B5/04. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Nov 15 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).