Composition and method for conducting a material removing operation

Patent metadata

Field	Value
Publication number	US-11499072-B2
Application number	US-202017004931-A
Country	US
Kind code	B2
Filing date	Aug 27, 2020
Priority date	Aug 30, 2019
Publication date	Nov 15, 2022
Grant date	Nov 15, 2022

Abstract

A composition suitable for chemical mechanical polishing a substrate can comprise abrasive particles, a multi-valent metal borate, at least one oxidizer and a solvent. The composition can polish a substrate with a high material removal rate and a very smooth surface finish.

First claim

What is claimed is:

1. A composition comprising: abrasive particles; a multi-valent metal borate; at least one oxidizing agent; and a solvent.

2. The composition of claim 1 , wherein the multi-valent metal borate includes iron(III)borate, copper(II)borate, cobalt(II)borate, bismuth(III)borate, aluminum(III)borate, cerium(III)borate, chromium(III)borate, ruthenium(III)borate, titanium(III)borate, lead(II)borate, or any combination thereof.

3. The composition of claim 2 , wherein the multi-valent metal borate consists essentially of iron(III)borate.

4. The composition of claim 1 , wherein the at least one oxidizing agent includes a permanganate, a peroxydisulfate, a peroxide, a chlorite, a perchlorate, a hypochlorite, a nitrite, a hyponitrite, an iodate, a periodate, a chromate, manganese oxide, or any combination thereof.

5. The composition of claim 4 , wherein the at least one oxidizing agent consists essentially of a permanganate.

6. The composition of claim 1 , wherein an amount of the multi-valent metal borate is at least 0.01 wt % and not greater than 20 wt % based on the total weight of the composition.

7. The composition of claim 1 , wherein an amount of the at least one oxidizing agent is at least 0.01 wt % and not greater than 20 wt based on the total weight of the composition.

8. The composition of claim 1 , wherein the abrasive particles include zirconia or alumina.

9. The composition of claim 1 , wherein an amount of the abrasive particles is at least 0.1 wt % and not greater than 10 wt % based on the total weight of the composition.

10. The composition of claim 1 , wherein the composition is adapted for chemical mechanical polishing of a substrate.

11. The composition of claim 10 , wherein the substrate includes a metal, a metal alloy, a group III-V compound, a group IV-IV compound, or a polymer.

12. The composition of claim 11 , wherein the substrate includes silicon carbide.

13. A method of polishing a substrate, comprising:
providing a polishing composition, wherein the polishing composition comprises abrasive particles, a multi-valent metal borate, at least one oxidizing agent and water;
bringing the polishing composition in contact with the substrate; and
polishing the substrate.

14. The method of claim 13 , wherein the multi-valent metal borate includes iron(III)-borate.

15. The method of claim 13 , wherein the substrate includes a metal, a metal alloy, a polymer, a group III-V compound, or a IV-IV compound.

16. The method of claim 13 , wherein the pH is adjusted to a pH of at least 1 and not greater than 5.

Assignees

• Saint Gobain Ceramics

Inventors

• Fu Lin
• Sherlock Jason A
• Bui Long Huy
• Ward Douglas E

Classifications

• C01G25/02

  Oxides · CPC title

• C01B35/127 Primary

  of heavy metals · CPC title

• C09G1/02 Primary

  containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)} · CPC title

• B24B1/00

  Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes · CPC title

• C01G45/1207

  Permanganates ([MnO4)-] or manganates ([MnO4)2-] · CPC title