Multi-component epoxy resin compound with leakage indicator, and curing component for the epoxy resin compound

US11499003B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11499003-B2
Application numberUS-201816754888-A
CountryUS
Kind codeB2
Filing dateNov 12, 2018
Priority dateNov 23, 2017
Publication dateNov 15, 2022
Grant dateNov 15, 2022

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A curing composition is useful for a multi-component epoxy resin compound and includes at least one first polyamine, at least one second polyamine, and at least one polyphenol from the group of bisphenols and novolac resins as an accelerator. Upon contact with atmospheric oxygen, the curing composition discolors within a few days and therefore leakages can be visually identified.

First claim

Opening claim text (preview).

The invention claimed is: 1. A curing composition for a multi-component epoxy resin compound, comprising: 5 to 20 wt. % of at least one first polyamine, 15 to 50 wt. % of at least one second polyamine, and from 1 to 40 wt. % of at least one polyphenol selected from the group consisting of bisphenols, wt. % being based on the weight of organic parts of the curing composition, wherein the at least one first polyamine corresponds to the following general formula (I): in which R 1 and R 2 denote, independently of one another, —H or —CH 3 , or together denote an optionally substituted C 3 to C 8 hydrocarbon chain which is connected to form a cycle, and R 3 denotes —H, —CH 3 , —CH 2 —CH 2 —NH 2 or —CH 2 —CH 2 —NH—CH 2 —CH 2 —NH 2 , and wherein the at least one second polyamine corresponds to the following general formula (II) or (HI): in which R 1 and R 2 denote, independently of one another, H or —CH 3 , and X denotes NH, O or S. 2. The curing composition according to claim 1 , wherein the at least one first polyamine is selected from the group consisting of 1,2-diaminocyclohexane, 1,2-diaminocyclohexene, diethylenetriamine, triethylenetetramine, and mixtures thereof. 3. The curing composition according to claim 1 , wherein the at least one second polyamine is selected from the group consisting of 1,3-bis(aminomethyl)cyclohexane, aminoethylpiperazine, and mixtures thereof. 4. The curing composition according to claim 1 , wherein the at least one polyphenol further comprises a novolac resin which corresponds to the following formula (IV): in which R 1 and R 2 each denotes, independently of one another, H or —CH 3 ; R 3 , R 4 , R 5 and R 6 each denotes, independently of one another, H, —CH 3 or an aliphatic functional group; and n is 0 to 20. 5. The curing composition according to claim 1 , wherein the at least one polyphenol further comprises a novolac resin which corresponds to the following formula (V): in which R 1 denotes H, R 2 denotes C 1 to C 10 alkyl, m is 0, 1 or 2, and n is 0 to 20. 6. The curing composition according to claim 1 , wherein the at least one polyphenol comprises a bisphenol from the group consisting of bisphenol A, bisphenol F, and mixtures thereof. 7. The curing composition according to claim 1 , wherein the curing composition further comprises: additional monoamines and/or polyamines, and/or a curing agent for epoxy resins selected from the group consisting of Mannich bases, polyamidoamines, phenalkamines, and mixtures thereof. 8. The curing composition according to claim 1 , wherein the curing composition further comprises: an additive selected from the group consisting of diluents, solvents, accelerants, silanes, thickeners, inorganic tillers, and mixtures thereof. 9. A multi-component epoxy resin compound comprising: an epoxy resin component (A) containing at least one curable epoxy resin and optionally a reactive diluent, at least one curing component (B) comprising the curing composition according to claim 1 , wherein the epoxy resin component and the at least one curing component are separate from one another. 10. The multi-component epoxy resin compound according to claim 9 , further comprising: an additive selected from the group consisting of co-accelerants, adhesion promoters, reactive diluents, thickeners, fillers, and mixtures thereof. 11. A method for detecting leaks, comprising: detecting discoloration of a mixture of a polyphenol and a first and a second polyamine in the curing composition according to claim 1 , wherein the curing composition visibly discolors within 10 days upon contact with atmospheric oxygen. 12. The curing composition according to claim 1 , wherein said polyphenol further comprises a novolac resin as an accelerator.

Assignees

Inventors

Classifications

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11499003B2 cover?
A curing composition is useful for a multi-component epoxy resin compound and includes at least one first polyamine, at least one second polyamine, and at least one polyphenol from the group of bisphenols and novolac resins as an accelerator. Upon contact with atmospheric oxygen, the curing composition discolors within a few days and therefore leakages can be visually identified.
Who is the assignee on this patent?
Hilti Ag
What technology area does this patent fall under?
Primary CPC classification C08G59/5026. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 15 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).