Electronic module having a groove anchoring terminal pins

Patent metadata

Field	Value
Publication number	US-11495525-B2
Application number	US-202117190592-A
Country	US
Kind code	B2
Filing date	Mar 3, 2021
Priority date	Mar 3, 2021
Publication date	Nov 8, 2022
Grant date	Nov 8, 2022

Abstract

A module has electronic components mounted to a Printed Circuit Board (PCB) with multiple patterned conductive layers connecting to conductive slot metal around a conductive slot. A groove is cut through a top molding encapsulant above and into the conductive slot but does not cut through a bottom molding encapsulant. A terminal pin is inserted into the groove and pushed down into the conductive slot. When heated, embedded solder previously applied to the conductive slot metal flows between the end of the terminal pin and the conductive slot metal to form a solder bond. An end of the PCB past the conductive slot has no metal traces, preventing shorts. Epoxy can be placed into the groove around the terminal pin or a hole formed in the terminal pin to increase strength of the anchored terminal pin. The molding around the groove protects terminal pins from shorting from the side.

First claim

We claim:

1. A module with internally-anchored pins comprising:
a Printed Circuit Board (PCB) having insulating board layers sandwiched between conductive layers that are patterned to form wiring traces;
a plurality of components mounted to the PCB, the plurality of components including at least one semiconductor device;
a plurality of conductive slots in the PCB, each conductive slot being surrounded by conductive slot metal that is electrically connected to the wiring traces in the conductive layers of the PCB;
an encapsulant around the PCB and the plurality of components;
a groove formed through a top portion of the encapsulant and formed over the plurality of conductive slots;
a plurality of terminal pins, each terminal pin in the plurality of terminal pins inserted into the groove and into a conductive slot in the plurality of conductive slots;
a plurality of embedded solder joints between the plurality of terminal pins and the conductive slot metal in the plurality of conductive slots;
wherein a top end of each terminal pin extends above the groove and above the encapsulant and is exposed for bonding the module to an external system;
wherein a lower end of each terminal pin is attached to the conductive slot metal by one of the plurality of solder joints, wherein the lower end of each terminal pin is embedded within the module and protected from external shorting by the encapsulant,
whereby the plurality of terminal pins are internally anchored to the PCB by the plurality of embedded solder joints and protected from external side shorts.

2. The module with internally-anchored pins of claim 1 wherein the groove extends a full length of the encapsulant, the groove dividing the top portion of the encapsulant into a center portion and an end portion;
wherein the end portion of the encapsulant acts as a side barrier to protect the plurality of terminal pins from contacting external conductors on a side of the module.

3. The module with internally-anchored pins of claim 1 wherein an end PCB portion of the PCB between the plurality of conductive slots and a side edge of the PCB has no metal wiring traces formed therein;
wherein the end PCB portion without metal wiring traces reduces shorting to external conductors on a side of the module.

4. The module with internally-anchored pins of claim 1 wherein the plurality of embedded solder joints is formed by a process of applying embedded solder to the conductive slot metal before the encapsulant is formed around the PCB, and heating after the encapsulant is formed and the plurality of terminal pins are inserted into the groove and plurality of conductive slots.

5. The module with internally-anchored pins of claim 1 further comprising:
encapsulant channel slots formed on all side edges of the PCB, wherein the encapsulant channel slots are filled with the encapsulant to form a molding interlock between the top portion of the encapsulant and a bottom portion of the encapsulant;
wherein the encapsulant channel slots are aligned to singulation lines;
wherein a panel PCB is separated into a plurality of the PCB for the module by sawing the panel PCB along the singulation lines.

6. The module with internally-anchored pins of claim 5 further comprising a conductor-free corner region of the PCB having no wiring traces, the conductor-free corner region having a corner touching an intersection of two of the singulation lines that are perpendicular to each other.

7. The module with internally-anchored pins of claim 6 wherein the encapsulant is a plastic molding and the top portion is a top molding.

8. The module with internally-anchored pins of claim 7 wherein the PCB comprises at least four conductive layers and at least three insulating board layers.

9. The module with internally-anchored pins of claim 8 wherein the plurality of components comprise at least one semiconductor Integrated Circuit (IC).

10. The module with internally-anchored pins of claim 9 wherein the plurality of components include top components mounted to a top surface of the PCB encapsulated by the top portion of the encapsulant, and bottom components mounted to a bottom surface of the PCB encapsulated by a bottom portion of the encapsulant.

11. The module with internally-anchored pins of claim 1 wherein each terminal pin has a lower hole in a terminal pin;
wherein the plurality of embedded solder joints further comprises solder within the lower hole in the terminal pin.

12. The module with internally-anchored pins of claim 1 further comprising:
epoxy disposed within the groove between the plurality of terminal pins and the encapsulant.

13. The module with internally-anchored pins of claim 12 wherein each terminal pin has an upper hole in a terminal pin;
wherein epoxy is disposed within the upper hole in the terminal pin.

14. The module with internally-anchored pins of claim 1 wherein each terminal pin has a 90-degree bend in an upper portion that extends above the groove, wherein the plurality of terminal pins are surface-mount pins for surface-mounting the module to an external system.

15. The module with internally-anchored pins of claim 1 wherein the groove further comprises a bevel formed on a top surface of the encapsulant, wherein a cross-sectional area of the bevel formed on the top surface is larger than a cross-sectional area of the groove below the top surface.

16. A pin-protecting module comprising:
a Printed Circuit Board (PCB) having at least two conductive layers that are patterned;
Integrated Circuit (IC) components mounted on the PCB;
a top molding that covers a top surface of the PCB;
a bottom molding that covers a bottom surface of the PCB;
a molding interlock that at least partially covers sides of the PCB and connects to the top molding and to the bottom molding;
a conductive slot formed in the PCB;
conductive slot metal formed around a perimeter of the conductive slot, the conductive slot metal electrically connected to at least one of the conductive layers in the PCB;
a groove formed in the top molding, the groove formed above and aligned to the conductive slot;
a terminal pin having a lower end placed in the conductive slot, an upper end above the top molding, the upper end of the terminal pin exposed for electrical connection to an external system, the terminal pin having a middle disposed within the groove; and
an embedded solder joint between the lower end of the terminal pin and the conductive slot metal;
wherein the lower end and the middle of the terminal pin are protected from physical contact with an external shorting conductor by the top molding surrounding the groove.

17. The pin-protecting module of claim 16 further comprising:
a PCB end formed between the conductive slot and the molding interlock, the PCB end having no metal traces patterned in the at least two conductive layers of the PCB;
wherein the PCB end insulates the lower end of the terminal pin from the external shorting conductor.

18. A method for manufacturing a module comprising:
receiving a panel Printed Circuit Board (PCB) having encapsulant channel slots along singulation lines and having conductive slots along groove lines, and having electronic components mounted thereon;
encapsulating the panel PCB with a top molding and a bottom molding that connect together at molding interlocks formed within the encapsulant channel slots;
cutting the panel PCB along the groove lines and along the singulation lines, wherein the groove lines are cut to a reduced depth that cuts through the top molding witho

Assignees

• Hong Kong Applied Science & Tech Research Inst Co Ltd

Inventors

• Olleres Lourdito M
• Chow Shi Wo

Classifications

• H10W70/658

  for devices provided for in groups H10D8/00 - H10D48/00 · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W74/016

  using moulds · CPC title

• H10W74/014

  using batch processing · CPC title