Coil electronic component

Patent metadata

Field	Value
Publication number	US-11495398-B2
Application number	US-201816003901-A
Country	US
Kind code	B2
Filing date	Jun 8, 2018
Priority date	Oct 18, 2017
Publication date	Nov 8, 2022
Grant date	Nov 8, 2022

Abstract

A coil electronic component includes a body including an insulator; a coil portion embedded in the body; aggregates dispersed in the insulator, where the aggregates each comprise a plurality of magnetic particles, coating layers formed on surfaces of the aggregates using an insulating material, and external electrodes connected to the coil portion.

First claim

What is claimed is:

1. A coil electronic component comprising:
a body including an insulator;
a coil portion embedded in the body;
aggregates dispersed in the insulator, where the aggregates each comprise a plurality of magnetic particles contacting each other;
coating layers formed on respective surfaces of the aggregates such that at least two of adjacent coating layers are spaced apart from each other; and
external electrodes connected to the coil portion, wherein at least one of the coating layers is an atomic layer deposition (ALD) layer.

2. The coil electronic component of claim 1 , wherein at least one of the aggregates has a porous structure.

3. The coil electronic component of claim 1 , wherein at least one of the coating layers has a thickness of 1 μm or less.

4. The coil electronic component of claim 1 , wherein at least one of the coating layers is formed of alumina.

5. The coil electronic component of claim 1 , wherein the insulator and at least one of the coating layers are formed of different materials.

6. The coil electronic component of claim 5 , wherein the insulator includes an insulating resin, and at least one of the coating layers is formed of ceramic.

7. The coil electronic component of claim 5 , wherein the insulator and at least one of the coating layers are formed of different ceramic materials.

8. The coil electronic component of claim 1 , wherein the insulator and at least one of the coating layers are formed in an integral structure using the same material.

9. The coil electronic component of claim 8 , wherein the insulator and at least one of the coating layers are formed of alumina.

10. The coil electronic component of claim 1 , wherein the magnetic particles are electrically conductive.

11. The coil electronic component of claim 10 , wherein the magnetic particles comprise an Fe-based alloy.

12. The coil electronic component of claim 1 , wherein at least one of the coating layers is formed of an insulating material.

13. A coil component comprising:
a body having a coil part embedded therein; and
an external electrode connected to the coil part,
wherein the body contains a plurality of magnetic particles in an insulator,
at least two of the plurality of magnetic particles contact each other, and
the at least two of the plurality of magnetic particles and another one or more of the plurality of magnetic particles are respectively coated with insulating materials such that at least two of adjacent insulating materials are spaced apart from each other, and at least one of the insulating materials is an atomic layer deposition (ALD) layer.

14. The coil component of claim 13 , wherein at least a portion of the plurality of magnetic particles form an aggregate.

15. The coil component of claim 13 , wherein at least one of the insulating materials has a thickness of 1 μm or less.

16. The coil component of claim 13 , wherein at least one of the insulating materials is formed of alumina.

17. The coil component of claim 14 , wherein the aggregate has a porous structure.

18. The coil component of claim 13 , wherein the insulator and at least one of the insulating materials are formed in an integral structure using the same material.

Assignees

• Samsung Electro Mech

Inventors

• Lee Young Il
• Ryu Han Wool
• Kwon Sang Kyun

Classifications

• C23C16/45525

  Atomic layer deposition [ALD] · CPC title

• H01F41/0246

  Manufacturing of magnetic circuits by moulding or by pressing powder (magnetic cores made by moulding or by pressing powder H01F27/255; soft magnetic particles H01F1/20, H01F1/36) · CPC title

• C23C16/403

  of aluminium, magnesium or beryllium · CPC title

• H01F27/29

  Terminals; Tapping arrangements {for signal inductances} · CPC title

• H01F17/0013

  with stacked layers · CPC title