3D-printed article with transitional metastructures

Patent metadata

Field	Value
Publication number	US-11495202-B2
Application number	US-201916557464-A
Country	US
Kind code	B2
Filing date	Aug 30, 2019
Priority date	Aug 30, 2019
Publication date	Nov 8, 2022
Grant date	Nov 8, 2022

Abstract

A single-step method of generating a three dimensional (3D) printed article includes: selecting a first metastructure and a second metastructure; designing and constructing a first transitional metastructure that transitions from the first metastructure to the second metastructure; depositing a first layer comprising the first metastructure; seamlessly connecting the first and first transitional metastructures by depositing a first transitional layer comprising the first transitional metastructure on the first layer; and seamlessly connecting the first transitional and second metastructures by depositing a second layer comprising the second metastructure on the first transitional layer.

First claim

What is claimed is:

1. A single-step method of generating a three dimensional (3D) printed article, the method comprising:
selecting a first metastructure and a second metastructure;
designing and constructing a first transitional metastructure that transitions from the first metastructure to the second metastructure;
depositing a first layer comprising the first metastructure;
seamlessly connecting the first and first transitional metastructures by depositing a first transitional layer comprising the first transitional metastructure on the first layer; and
seamlessly connecting the first transitional and second metastructures by depositing a second layer comprising the second metastructure on the first transitional layer, wherein
the first metastructure is an auxetic metastructure with a negative Poisson ratio, and
the second metastructure is an acoustic metastructure comprising a first phononic bandgap structure.

2. The method of claim 1 , wherein
designing and constructing the first transitional metastructure uses machine learning based on a layer thickness, a volume fill factor, and materials of each of the first metastructure and the second metastructure.

3. The method of claim 2 , wherein
a minimum thickness of the first transitional metastructure is the highest prioritized parameter of the machine learning.

4. The method of claim 1 , further comprising:
depositing a plurality of first layers;
depositing a plurality of second layers; and
depositing a plurality of first transitional layers, wherein
each first transitional layer is disposed between adjacent first and second layers, and
the first transitional metastructure of each first transitional layer seamlessly connects to adjacent first and second metastructures.

5. The method of claim 1 , further comprising:
selecting a third metastructure;
designing and constructing a second transitional metastructure that transitions from the second metastructure to the third metastructure;
seamlessly connecting the second and second transitional metastructures by depositing a second transitional layer comprising the second transitional metastructure on the second layer; and
seamlessly connecting the second transitional and third metastructures by depositing a third layer comprising the third metastructure on the second transitional layer.

6. The method of claim 1 , wherein
the second metastructure further comprises a second phononic bandgap structure, and
the first transitional metastructure transitions from the first metastructure to a closer one of the first phononic bandgap structure and the second phononic bandgap structure.

7. The method of claim 1 , wherein
the first layer, the second layer, and the first transitional layer are connected without using post-processing lamination or post-processing bonding.

8. The method of claim 1 , wherein
the first layer, the second layer, and the first transitional layer are converted and combined into a computer aided design (CAD) file as a single seamless 3D article and the CAD file is uploaded to a 3D printer.

Assignees

• Konica Minolta Business Solutions Usa Inc

Inventors

• Amano Jun

Classifications

• B22F10/18

  by mixing binder with metal in filament form, e.g. fused filament fabrication [FFF] · CPC title

• B22F10/28

  Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

• B33Y10/00 Primary

  Processes of additive manufacturing · CPC title

• G10K11/168 Primary

  Plural layers of different materials, e.g. sandwiches · CPC title

• B33Y50/00

  Data acquisition or data processing for additive manufacturing · CPC title