Adhesive formulation

US11492525B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11492525-B2
Application numberUS-201816640760-A
CountryUS
Kind codeB2
Filing dateJul 20, 2018
Priority dateSep 12, 2017
Publication dateNov 8, 2022
Grant dateNov 8, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An adhesive composition including an epoxy-based adhesive polymer and a phosphorous element-containing compound; a process for making the adhesive composition; a process for increasing the corrosion resistance property of the adhesive composition; and a process for bonding a metal substrate with the adhesive composition to increase the corrosion resistance of the substrate by at least 40 percent.

First claim

Opening claim text (preview).

What is claimed is: 1. An adhesive composition comprising (I) 40-65 wt % of an epoxy-based adhesive polymer; and (II) a phosphorous element-containing compound, which is a mixture of phosphoethyl methacrylate monoester, phosphoethyl methacrylate diester, phosphoric acid, and methyl methacrylate; and (III) an epoxy curing catalyst. 2. The adhesive composition of claim 1 , wherein the epoxy-based adhesive polymer is a mixture comprising: (a) a curable epoxy compound or a combination of two or more curable epoxy compounds; (b) one or more reactive urethane group- and/or urea group-containing polymers having a number average molecular weight of up to 35,000, at least one polyether and/or diene rubber segment having a weight of at least 1,000 atomic mass units, and capped isocyanate groups, (c) at least one epoxy curing catalyst, and (d) a curing agent. 3. The adhesive composition of claim 1 , wherein the epoxy-based adhesive polymer is bisphenol A diglycidylether. 4. The adhesive composition of claim 1 , wherein the epoxy-based adhesive polymer is a urea toughening polymer. 5. The composition of claim 1 , wherein the amount of epoxy-based adhesive polymer is from about 40 weight percent to about 60 weight percent. 6. The composition of claim 1 , wherein the amount of phosphorous element-containing compound is up to about 20 weight percent. 7. The composition of claim 1 , wherein the amount of phosphorous element-containing compound is from about 0.1 weight percent to about 5 weight percent.

Assignees

Inventors

Classifications

  • characterised by using adhesives · CPC title

  • multi-component adhesive · CPC title

  • C09J163/00Primary

    Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

  • of synthetic resin · CPC title

  • Phosphorus-containing compounds · CPC title

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Frequently asked questions

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What does patent US11492525B2 cover?
An adhesive composition including an epoxy-based adhesive polymer and a phosphorous element-containing compound; a process for making the adhesive composition; a process for increasing the corrosion resistance property of the adhesive composition; and a process for bonding a metal substrate with the adhesive composition to increase the corrosion resistance of the substrate by at least 40 percent.
Who is the assignee on this patent?
Ddp Specialty Electronic Materials Us Llc, Ddp Specialty Electronic Mat Us 8 Llc
What technology area does this patent fall under?
Primary CPC classification C09J163/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 08 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).