BAW resonator, RF filter, multiplexer and method of manufacturing a BAW resonator

Patent metadata

Field	Value
Publication number	US-11482985-B2
Application number	US-201917042689-A
Country	US
Kind code	B2
Filing date	Feb 27, 2019
Priority date	Mar 29, 2018
Publication date	Oct 25, 2022
Grant date	Oct 25, 2022

Abstract

A BAW resonator with an improved lateral energy confinement is provided. The resonator has a bottom electrode in a bottom electrode layer, a top electrode in a top electrode layer and a piezoelectric layer between the bottom electrode layer and the top electrode layer. The piezoelectric layer comprises piezoelectric materials of different piezoelectric polarities.

First claim

The invention claimed is:

1. A bulk acoustic wave (BAW) resonator comprising
a bottom electrode layer with a bottom electrode;
a top electrode layer with a top electrode above the bottom electrode layer; and
a piezoelectric layer with a first piezoelectric material and a second piezoelectric material, wherein:
the first piezoelectric material and the second piezoelectric material have different piezoelectric polarities,
a first segment of the first piezoelectric material is arranged between a first segment of the second piezoelectric material and a second segment of the second piezoelectric material,
the first segment of the second piezoelectric material is arranged between the first segment of the first piezoelectric material and a second segment of the first piezoelectric material or a third segment of the second piezoelectric material,
the second segment of the second piezoelectric material is arranged between the first segment of the first piezoelectric material and a third segment of the first piezoelectric material or a fourth segment of the second piezoelectric material, and a top portion of the second segment of the first piezoelectric material or of the third segment of the second piezoelectric material and a top portion of the fourth segment of the second piezoelectric material are below a top portion of the first segment of the first piezoelectric material.

2. The BAW resonator of claim 1 , further comprising a growth layer between the bottom electrode layer and the piezoelectric layer.

3. The BAW resonator of claim 2 , where an interface between the growth layer and the piezoelectric layer has a first section below the first piezoelectric material and a second section below the second piezoelectric material.

4. The BAW resonator of claim 3 , wherein the growth layer in the first section comprises material selected from an Oxide, a Nitride, Ru, RuO x , MOPVE-AlN, and SiO 2 .

5. The BAW resonator of claim 3 , wherein the growth layer in the second section comprises material selected from an Oxide, a Nitride, Ru, RuO x , MOPVE-AlN, and SiO 2 .

6. A radio frequency (RF) filter comprising the BAW resonator of claim 1 .

7. A multiplexer comprising the RF filter of claim 6 .

8. The BAW resonator of claim 1 , wherein the second piezoelectric material is a lateral energy barrier.

9. The BAW resonator of claim 1 , wherein the second piezoelectric material is provided to generate an interference signal.

10. The BAW resonator of claim 1 , wherein the first piezoelectric material and the second piezoelectric material have opposite polarities.

11. The BAW resonator of claim 1 , wherein the second piezoelectric material terminates an active region of the resonator.

12. The BAW resonator of claim 1 , wherein the first piezoelectric material comprises segments of a single frame or segments of two or more frames of which one is nested in another.

13. The BAW resonator of claim 1 , wherein at least one of the first piezoelectric material or the second piezoelectric material comprises AlN.

14. The BAW resonator of claim 1 , wherein at least one of the first piezoelectric material or the second piezoelectric material comprises a material selected from Sc-doped AlN and Al 1-x Sc x N with 0≤x≤0.3.

15. The BAW resonator of claim 1 , further comprising a cut out or a trench in the piezoelectric layer.

16. The BAW resonator of claim 1 , further comprising a trench in the piezoelectric layer enclosing an active region of the resonator.

17. The BAW resonator of claim 1 , wherein at least one of the second segment of the first piezoelectric material or the third segment of the first piezoelectric material is disposed entirely outside of an active region of the resonator.

18. The BAW resonator of claim 1 , wherein at least a portion of the first segment of the first piezoelectric material is laterally adjacent to at least a portion of the second segment of the first piezoelectric material, to at least a portion of the third segment of the second piezoelectric material, and to at least a portion of the fourth segment of the second piezoelectric material.

19. The BAW resonator of claim 1 , wherein the first segment of the first piezoelectric material is isolated from at least one of the second segment of the first piezoelectric material or the third segment of the first piezoelectric material.

20. A method of manufacturing a bulk acoustic wave (BAW) resonator, comprising:
providing a bottom electrode layer;
structuring a bottom electrode in the bottom electrode layer;
depositing a first piezoelectric material and a second piezoelectric material in a piezoelectric layer on or above the bottom electrode layer, wherein:
the first piezoelectric material and the second piezoelectric material have different piezoelectric polarities,
a first segment of the first piezoelectric material is arranged between a first segment of the second piezoelectric material and a second segment of the second piezoelectric material,
the first segment of the second piezoelectric material is arranged between the first segment of the first piezoelectric material and a second segment of the first piezoelectric material or a third segment of the second piezoelectric material,
the second segment of the second piezoelectric material is arranged between the first segment of the first piezoelectric material and a third segment of the first piezoelectric material or a fourth segment of the second piezoelectric material, and
a top portion of the second segment of the first piezoelectric material or of the third segment of the second piezoelectric material and a top portion of the fourth segment of the second piezoelectric material are below a top portion of the first segment of the first piezoelectric material; and

depositing a top electrode layer on or above the piezoelectric layer.

21. The method of claim 20 , further comprising selectively removing material selected from the first piezoelectric material and the second piezoelectric material.

22. The method of claim 21 , wherein the selective removal comprises fully removing a selected segment of the first piezoelectric material or a selected segment of the second piezoelectric material.

23. The method of claim 20 , further comprising depositing a growth layer with a first section and a second section.

24. The method of claim 20 , further comprising selectively removing material selected from the second piezoelectric material.

25. A bulk acoustic wave (BAW) resonator, comprising:
a bottom electrode layer with a bottom electrode;
a top electrode layer with a top electrode above the bottom electrode layer; and
a piezoelectric layer with a first piezoelectric material and a second piezoelectric material, wherein:
the first piezoelectric material and the second piezoelectric material have different piezoelectric polarities,
a first segment of the first piezoelectric material is arranged between a first segment of the second piezoelectric material and a second segment of the second piezoelectric material,
the first segment of the second piezoelectric material is arranged between the first segment of the first piezoelectric material and a second segment of the first piezoelectric material or a third segment of the second piezoelectric material,
the second segment of the second piezoelectric material is arranged between the first segment of the first piezoelectric material and a third segment of the first

Assignees

• RF360 Europe GmbH

Inventors

• Fries Franz Sebastian
• Huck Christian
• Schiek Maximilian
• Aigner Willi

Classifications

• H03H3/02

  for the manufacture of piezoelectric or electrostrictive resonators or networks (H03H3/08 takes precedence) · CPC title

• H03H9/02125

  of parasitic elements · CPC title

• H03H9/583

  comprising a plurality of piezoelectric layers acoustically coupled · CPC title

• H03H9/562

  comprising a ceramic piezoelectric layer · CPC title

• H03H9/205 Primary

  having multiple resonators (crystal tuning forks H03H9/21) · CPC title