Device comprising an acoustic layer and via interconnect
US-2026101673-A1 · Apr 9, 2026 · US
Aigner Willi is listed as an inventor on 29 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Aigner Willi |
| Total patents | 29 |
| First publication | Feb 4, 2021 |
| Latest publication | Apr 9, 2026 |
Publications ranked by popularity score, then publication date.
US-2026101673-A1 · Apr 9, 2026 · US
US-2026074671-A1 · Mar 12, 2026 · US
US-12506459-B2 · Dec 23, 2025 · US
US-2025383578-A1 · Dec 18, 2025 · US
US-2025355291-A1 · Nov 20, 2025 · US
US-12456958-B2 · Oct 28, 2025 · US
US-2025189830-A1 · Jun 12, 2025 · US
US-12301211-B2 · May 13, 2025 · US
US-2025096772-A1 · Mar 20, 2025 · US
US-2024413808-A1 · Dec 12, 2024 · US
Latest publications not already listed above.
US-2024235514-A1 · Jul 11, 2024 · US
US-12009802-B2 · Jun 11, 2024 · US
US-2024106408-A1 · Mar 28, 2024 · US
US-11942915-B2 · Mar 26, 2024 · US
US-2024088871-A1 · Mar 14, 2024 · US
US-2024039510-A1 · Feb 1, 2024 · US
US-2023361757-A1 · Nov 9, 2023 · US
US-11742823-B2 · Aug 29, 2023 · US
US-2023058875-A1 · Feb 23, 2023 · US
US-2022376673-A1 · Nov 24, 2022 · US
US-11482985-B2 · Oct 25, 2022 · US
US-2022271727-A1 · Aug 25, 2022 · US
US-2022052664-A1 · Feb 17, 2022 · US
US-2021367577-A1 · Nov 25, 2021 · US
US-2021297059-A1 · Sep 23, 2021 · US
US-2021203303-A1 · Jul 1, 2021 · US
US-2021126614-A1 · Apr 29, 2021 · US
US-2021058050-A1 · Feb 25, 2021 · US
US-2021036684-A1 · Feb 4, 2021 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| RF360 Europe GmbH | 17 |
| Rf360 Singapore Pte Ltd | 9 |
| Qualcomm Inc | 3 |
| RF360 Singapore | 1 |
| Rf360 Singapore Pte Ltd | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H03H9/175 | 19 |
| H03H3/02 | 18 |
| H03H9/02015 | 17 |
| H03H2003/025 | 15 |
| H03H9/02118 | 10 |