Substrate holding device, substrate polishing apparatus, and method of manufacturing the substrate holding device

Patent metadata

Field	Value
Publication number	US-11478895-B2
Application number	US-201916655639-A
Country	US
Kind code	B2
Filing date	Oct 17, 2019
Priority date	Oct 14, 2015
Publication date	Oct 25, 2022
Grant date	Oct 25, 2022

Abstract

Provided is a substrate holding device used in a substrate polishing apparatus that polishes a substrate using a polishing pad. The substrate holding device includes: a retainer ring configured to hold a peripheral edge of the substrate; and a drive ring fixed to the retainer ring so as to rotate together with the retainer ring. The surface of the retainer ring at the polishing pad side has a convex portion at a position other than an innermost circumference following a shape of the drive ring.

First claim

What is claimed is:

1. A substrate holding device comprising:
a retainer ring including an inner retainer ring configured to hold a peripheral edge of a substrate and an outer retainer ring provided outside the inner retainer ring in a substrate polishing apparatus that polishes the substrate using a polishing pad; and
a drive ring fixed to the retainer ring to rotate together with the retainer ring,
wherein a surface of the drive ring at an inner retainer ring side or an outer retainer ring side has a convex portion, and
a surface of the inner retainer ring or a surface of the outer retainer ring at a polishing pad side is deformed due to a shape of the drive ring to have a convex portion.

2. The substrate holding device of claim 1 , wherein the drive ring is made of a metal and the retainer ring is made of a plastic.

3. The substrate holding device of claim 1 , wherein the retainer ring has a rigidity lower than that of the drive ring such that the retainer ring is deformable.

4. A substrate holding device comprising:
a retainer ring configured to hold a peripheral edge of a substrate in a substrate polishing apparatus that polishes the substrate using a polishing pad;
a drive ring fixed to the retainer ring to rotate together with the retainer ring; and
a ring-type annular member configured, substantially over an entire circumference thereof, to be sandwiched between the drive ring and the retainer ring,
wherein a surface of the retainer ring at a polishing pad side is deformed due to the annular member to have a convex portion.

5. The substrate holding device of claim 4 , wherein the retainer ring includes an inner retainer ring configured to hold the peripheral edge of the substrate and an outer retainer ring provided outside the inner retainer ring, and
a surface of the inner retainer ring or a surface of the outer retainer ring at the polishing pad side has the convex portion following the shape of the annular member.

6. The substrate holding device of claim 4 , wherein the surface of the retainer ring at the polishing pad side has the convex portion due to a length of the annular member.

7. The substrate holding device of claim 6 , wherein the drive ring is formed with a first inserted portion into which the annular member is inserted,
the retainer ring is formed with a second inserted portion into which the annular member is inserted, and
the surface of the retainer ring at the polishing pad side has the convex portion because the annular member has the length that is linger than a sum of a length of the first inserted portion and a length of the second inserted portion.

Assignees

• Ebara Corp

Inventors

• Togashi Shingo
• Yasuda Hozumi
• Fukushima Makoto
• Nabeya Osamu

Classifications

• B24B37/32 Primary

  Retaining rings · CPC title

• B24B37/20

  Lapping pads for working plane surfaces · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10P52/402

  of semiconductor materials · CPC title

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title