Integrated abrasive polishing pads and manufacturing methods

Patent metadata

Field	Value
Publication number	US-11471999-B2
Application number	US-201816042016-A
Country	US
Kind code	B2
Filing date	Jul 23, 2018
Priority date	Jul 26, 2017
Publication date	Oct 18, 2022
Grant date	Oct 18, 2022

Abstract

Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

First claim

The invention claimed is:

1. A polishing article, comprising:
a sub-polishing element comprising a first reaction product of a first precursor; and
a plurality of polishing elements extending from the sub-polishing element, the plurality of polishing elements comprising a second reaction product of a second precursor, the second precursor comprising functionalized abrasive particles, the functionalized abrasive particles comprising alkene terminated groups, wherein the functionalized abrasive particles comprise a reaction product of metal oxide nanoparticles and a silane compound, a cyanate compound, a sulfonic acid compound, a phosphoric acid compound, a carboxylic acid compound, or combinations thereof, wherein less than about 50% of bonding sites on surfaces of the functionalized abrasive particles are chemically bonded to a polymerizable compound.

2. The polishing article of claim 1 , wherein portions of the plurality of polishing elements are disposed in the sub-polishing element, and wherein a base polymer material of the sub-polishing element and a polymer pad material of the plurality of polishing elements are chemically bonded at interfaces thereof.

3. The polishing article of claim 1 , wherein the functionalized abrasive particles, or agglomerations thereof, have a mean diameter of between about 10 nm and about 5 micron.

4. The polishing article of claim 1 , wherein a concentration of functionalized abrasive particles in the second precursor is between about 1 weight % and about 50 weight %.

5. The polishing article of claim 1 , wherein the second reaction product comprises a polymer pad material and functionalized abrasive particles disposed in and chemically bonded to the polymer pad material.

6. The polishing article of claim 1 , wherein the second precursor comprises functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

7. The polishing article of claim 1 , wherein the second precursor comprises functionalized abrasive particles, or agglomerations thereof, having a mean diameter of between about 10 nm and about 300 nm.

8. The polishing article of claim 1 , wherein the second precursor further comprises a mixture of one or more functional polymers, functional oligomers, monomers, reactive diluents, or combinations thereof.

9. The polishing article of claim 8 , wherein the plurality of polishing elements have a medium or high modulus of elasticity and the sub-polishing element has a low or medium modulus of elasticity, and wherein the modulus of elasticity of the plurality of polishing elements is different from the modulus of elasticity of the sub-polishing element.

10. The polishing article of claim 1 , wherein the plurality of polishing elements and the sub-polishing element each comprise a material selected from the group consisting of polyamides, polycarbonates, polyesters, polyether ketones, polyethers, polyoxymethylenes, polyethersulfone, polyetherimides, polyimides, polyolefins, polysiloxanes, polysulfones, polyphenylenes, polyphenylene sulfides, polyurethanes, polystyrene, polyacrylonitriles, polyacrylates, polymethlymethacrylates, polyurethane acrylates, polyester acrylates, polyether acrylates, epoxy acrylates, polycarbonates, polyesters, melamines, polysulfones, polyvinyl materials, acrylonitrile butadiene styrene (ABS), halogenated polymers, block copolymers and random copolymers thereof.

11. The polishing article of claim 1 , wherein
the sub-polishing element is formed by dispensing and curing a plurality of droplets of the first precursor,
the plurality of polishing elements are formed by dispensing and curing a plurality of droplets of the second precursor,
of the abrasive particles, and
forming the plurality of polishing elements chemically bonds the functionalized abrasive particles to a polymer material of the plurality of polishing elements.

12. A polishing article, comprising:
a sub-polishing element comprising a first reaction product of a first precursor; and
a plurality of polishing elements extending from the sub-polishing element, the plurality of polishing elements comprising a second reaction product of a second precursor, the second reaction product comprising a polymer pad material and abrasive particles disposed in and chemically bonded to the polymer pad material, wherein the second precursor comprises functionalized abrasive particles comprising alkene terminated groups, wherein the functionalized abrasive particles comprise a reaction product of metal oxide nanoparticles and a silane compound, a cyanate compound, a sulfonic acid compound, a phosphoric acid compound, a carboxylic acid compound, or combinations thereof, wherein less than about 50% of bonding sites on surfaces of the functionalized abrasive particles are chemically bonded to a polymerizable compound.

13. The polishing article of claim 12 , wherein portions of the plurality of polishing elements are disposed in the sub-polishing element, and wherein a base polymer material of the sub-polishing element and the polymer pad material of the plurality of polishing elements are chemically bonded at interfaces thereof.

14. The polishing article of claim 12 , wherein the functionalized abrasive particles, or agglomerations thereof, have a mean diameter of between about 10 nm and about 5 micron.

Assignees

• Applied Materials Inc

Inventors

• Kumar Ashavani
• Chockalingam Ashwin
• Ganapathiappan Sivapackia
• Bajaj Rajeev
• Fu Boyi
• Redfield Daniel
• Patibandla Nag B
• Cornejo Mario Dagio
• SINHA Amritanshu
• Zhao Yan
• Arnepalli Ranga Rao
• Redeker Fred C

Classifications

• H10P52/402

  of semiconductor materials · CPC title

• B29C64/112

  using individual droplets, e.g. from jetting heads · CPC title

• B24D11/04

  Zonally-graded surfaces · CPC title

• B33Y80/00

  Products made by additive manufacturing · CPC title

• B24B37/26

  characterised by the shape of the lapping pad surface, e.g. grooved · CPC title