Topside heatsinking antenna launcher for an integrated circuit package

Patent metadata

Field	Value
Publication number	US-11456227-B2
Application number	US-201916716720-A
Country	US
Kind code	B2
Filing date	Dec 17, 2019
Priority date	Dec 17, 2019
Publication date	Sep 27, 2022
Grant date	Sep 27, 2022

Abstract

A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.

First claim

What is claimed is:

1. A semiconductor device comprising:
a semiconductor device package comprising a semiconductor device die and one or more antenna feeds on a topside major surface of the semiconductor device package;
a waveguide, mounted on the topside surface of the semiconductor device package, and communicatively coupled to the one or more antenna feeds;
a heat sink, coupled to a side of the waveguide, and thermally coupled to the semiconductor device die through the waveguide;
a printed circuit board (PCB), wherein
the semiconductor device package is mounted on a first surface of the PCB at a bottom-side major surface of the semiconductor device package, and
the waveguide and the heat sink are mounted on the first surface of the PCB.

2. The semiconductor device of claim 1 further comprising:
a thermal interface material (TIM) configured to mechanically, thermally, and electromagnetically couple the waveguide to the semiconductor device die.

3. The semiconductor device of claim 2 wherein the TIM comprises an elastomer configured to mechanically isolate the waveguide from the semiconductor device package.

4. The semiconductor device of claim 2 wherein the TIM comprises a material that is electrically conductive.

5. The semiconductor device of claim 2 , wherein
the waveguide comprises one or more through holes in regions above the antenna feeds, and
the TIM comprises one or more holes in regions between the antenna feeds and the waveguide through holes.

6. The semiconductor device of claim 2 , wherein
the waveguide comprises one or more through holes in regions above the antenna feeds, and
the TIM is a solid sheet of material.

7. The semiconductor device of claim 2 , wherein
the waveguide comprises one or more through holes in regions above the antenna feeds, and
the TIM comprises a first type of material in regions proximate to the antenna feeds and the waveguide through holes and a second type of material in regions not proximate to the antenna feeds and the waveguide through holes.

8. The semiconductor device of claim 1 wherein the waveguide comprises a cavity in which the semiconductor device package is coupled to the waveguide.

9. The semiconductor device of claim 1 , wherein
the waveguide comprises a rectangular footprint surrounding the semiconductor device package, and
the heat sink is mounted to one or more perimeter sides of the waveguide.

10. The semiconductor device of claim 1 wherein the heat sink comprises radiator fins configured to dissipate heat from the semiconductor device die.

11. The semiconductor device of claim 1 wherein the waveguide and the heat sink are formed from a single piece of material.

12. The semiconductor device of claim 1 wherein the waveguide comprises one or more of aluminum, copper, stainless steel, metalized plastic, and a thermally conductive material.

13. The semiconductor device of claim 1 wherein the heat sink comprises one or more of aluminum, copper, stainless steel, and a thermally conductive material.

Assignees

• Nxp Usa Inc

Inventors

• Vincent Michael B
• De Graauw Antonius Johannes Matheus
• Carluccio Giorgio
• Syed Waqas Hassan
• Spella Maristella

Classifications

• H10W40/037

  Assembling together parts thereof · CPC title

• H10W40/226 Primary

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H01P1/264

  Waveguide terminations (H01P1/262 takes precedence) · CPC title

• H01Q21/064

  using horn or slot aerials (slotted waveguides arrays H01Q21/005) · CPC title

• H01Q1/2283 Primary

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title