Integrated circuit package with radio frequency coupling structure

Patent metadata

Field	Value
Publication number	US-10103447-B2
Application number	US-201414303713-A
Country	US
Kind code	B2
Filing date	Jun 13, 2014
Priority date	Jun 13, 2014
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

An integrated circuit package comprises an electrically conductive material, a first electrically isolating layer having a first side in contact with the electrically conductive material and a second side opposite to the first side, a second electrically isolating layer stacked at the second side with at least the first electrically isolating layer and arranged at a package side, and an integrated antenna structure arranged between the first electrically isolating layer and the second electrically isolating layer. The electrically conductive material is encapsulated by a dielectric material, arranged to partly overlap the integrated antenna structure, separated from the integrated antenna structure by at least the first electrically isolating layer and arranged to reflect a radio frequency signal received by the electrically conductive material through at least the first electrically isolating layer to the package side.

First claim

The invention claimed is:

1. A radio frequency device comprising:
an integrated circuit package comprising a radio frequency coupling structure arranged inside the integrated circuit package, the radio frequency coupling structure comprising:
an electrically conductive material, the electrically conductive material having a cavity surrounded by side walls of the electrically conductive material, the cavity having at least one opening;
a first electrically isolating layer having a first side in contact with the side walls of the electrically conductive material and with the opening of the cavity facing the first side of the first electrically isolating layer such that only the side walls of the electrically conductive material are in direct contact with the first electrically isolating layer, and the first electrically isolating layer having a second side opposite to the first side;
a second electrically isolating layer stacked at the second side with at least the first electrically isolating layer and having a third side arranged at a package side of the integrated circuit package;
an integrated antenna structure for at least one of transmitting and receiving a radio frequency signal, the integrated antenna structure being arranged between the first electrically isolating layer and the second electrically isolating layer with the opening of the cavity facing the integrated antenna structure;
the electrically conductive material being encapsulated by a dielectric material, the electrically conductive material being arranged to partly overlap the integrated antenna structure and being separated from the integrated antenna structure by at least the first electrically isolating layer, the electrically conductive material being arranged to reflect the radio frequency signal received by the electrically conductive material through at least the first electrically isolating layer to the package side; and
a printed circuit board (PCB), the package side of the integrated circuit package being mounted on the PCB, wherein the PCB has a hollow radio frequency waveguide formed therein via a hole extending through the entire thickness of the PCB, the hole having lateral walls covered by an electrically conductive layer, the hole extending to an area of the radio frequency coupling structure partly overlapping the integrated antenna structure, and wherein the integrated circuit package is electrically coupled to the radio frequency waveguide and the radio frequency waveguide is configured to guide the radio frequency signal out of a plane parallel to a surface of the first electrically isolating layer at the first side.

2. An integrated circuit package according to claim 1 , the cavity being filled with a dielectric material.

3. An integrated circuit package according to claim 1 , the integrated antenna structure being surrounded by electrical conductive vias extending through at least the first electrically isolating layer and being electrically connected to the electrically conductive material.

4. An integrated circuit package according to claim 1 , the electrically conductive material being electrically connected to a reference potential.

5. A integrated circuit package according to claim 1 , the integrated antenna structure being an integrated planar antenna of one of the group consisting of: a single-ended microstrip antenna, a differential microstrip antenna, a rectangular patched single-ended antenna, a rectangular patched differential antenna, a square patched single-ended antenna, a square patched differential antenna.

6. An integrated circuit package according to claim 1 , the integrated antenna structure being electrically coupled to an integrated circuit die arranged to at least one of generate the radio frequency signal for transmission via the integrated antenna structure and receive the radio frequency signal as received via the integrated antenna structure.

7. An integrated circuit package according to claim 6 , the integrated circuit die being arranged inside the integrated circuit package and having a surface in direct contact with the first side.

8. An integrated circuit package according to claim 6 , the integrated circuit die comprising a circuit of the group of circuits consisting of: a transmitter, a receiver, and a transceiver, the circuit being electrically coupled to the integrated antenna structure.

9. An integrated circuit package according to claim 6 , the integrated circuit die being manufactured using a semiconductor technology of the group of semiconductor technologies comprising: a silicon, a silicon germanium, a gallium arsenide, a gallium nitride semiconductor technology, or a combination thereof.

10. An integrated circuit package according to claim 6 , the integrated antenna structure further being arranged for at least one of transmitting and receiving the radio frequency signal in a first predetermined frequency band and the integrated circuit package further comprising:
a second radio frequency coupling structure being arranged inside the integrated circuit package, and comprising:
a second electrically conductive material arranged inside the integrated circuit package in contact with the first side;
a second integrated antenna structure for at least one of transmitting and receiving a second radio frequency signal in a second predetermined frequency band, the second integrated antenna structure being arranged between the first electrically isolating layer and the second electrically isolating layer, and the second integrated antenna structure being electrically coupled to the integrated circuit die to at least one of generate the further radio frequency signal for transmission via the further integrated antenna structure and receive the further radio frequency signal as received via the further integrated antenna structure; and
the second electrically conductive material being arranged to partly overlap the second integrated antenna structure and being separated from the second integrated antenna structure by at least the first electrically isolating layer, the second electrically conductive material being arranged to reflect the second radio frequency signal received by the second electrically conductive material through at least the first electrically isolating layer to the package side.

11. An integrated circuit package as claimed in claim 1 , the integrated antenna structure being arranged for at least one of transmitting and receiving the radio frequency signal in a first predetermined frequency band and the integrated circuit package further comprising:
a second radio frequency coupling structure being arranged inside the integrated circuit package, and comprising:
a second electrically conductive material arranged inside the integrated circuit package in contact with the first side;
a second integrated antenna structure for at least one of transmitting and receiving a second radio frequency signal in a second predetermined frequency band, the second integrated antenna structure being arranged between the first electrically isolating layer and the second electrically isolating layer; and
the second electrically conductive material being arranged to partly overlap the second integrated antenna structure and being separated from the second integrated antenna structure by at least the first electrically isolating layer, the second electrically conductive material being arranged to reflect the second radio frequency signal received by the second electrically conductive material through at least the first electrically isolating layer to the package side.

12. An integrated circuit package as claimed in claim 11 , the second electrically conductive mate

Assignees

• Tong Ziqiang
• Reuter Ralf
• Nxp Usa Inc

Inventors

• Tong Ziqiang
• Reuter Ralf

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/019

  using temporary auxiliary substrates (H10W74/017 takes precedence) · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W72/241

  Dispositions, e.g. layouts · CPC title

• H10W44/255

  for operation at multiple different frequencies · CPC title