Heat exchanging arrangement and subsea electronic system

Patent metadata

Field	Value
Publication number	US-11448473-B2
Application number	US-202016851650-A
Country	US
Kind code	B2
Filing date	Apr 17, 2020
Priority date	Apr 23, 2019
Publication date	Sep 20, 2022
Grant date	Sep 20, 2022

Abstract

A heat exchanging arrangement for a subsea electronic system, the heat exchanging arrangement including a wall section; a corrugation formed in the wall section, the corrugation having two generally opposing internal corrugation surfaces; and at least one heat exchanging element forced against at least one of the internal corrugation surfaces. A subsea electronic system including a heat exchanging arrangement is also provided.

First claim

The invention claimed is:

1. A heat exchanging arrangement for a subsea electronic system, the heat exchanging arrangement comprising:
a wall section;
a corrugation formed in the wall section, the corrugation having two generally opposing internal corrugation surfaces; and
at least one heat exchanging element forced against at least one of the internal corrugation surfaces, the at least one heat exchanging element comprises an internal element structure for exposure to a dielectric fluid on an internal side of the wall section.

2. The heat exchanging arrangement according to claim 1 , wherein the at least one heat exchanging element is pushed against the at least one of the internal corrugation surface.

3. The heat exchanging arrangement according to claim 2 , wherein the at least one heat exchanging element comprises two heat exchanging elements, and wherein each heat exchanging element is forced against a respective internal corrugation surface.

4. The heat exchanging arrangement according to claim 3 , wherein the heat exchanging arrangement comprises a force device arranged to force the at least one heat exchanging element against the at least one internal corrugation surface.

5. The heat exchanging arrangement according to claim 4 , wherein the force device is arranged at least partly between the internal corrugation surface.

6. The heat exchanging arrangement according to claim 5 , wherein the force device comprises a spring.

7. The heat exchanging arrangement according to claim 6 , wherein the force device comprises an adjusting mechanism for adjusting the forcing of the at least one heat exchanging element.

8. The heat exchanging arrangement according to claim 1 , wherein the internal corrugation surfaces are substantially flat.

9. The heat exchanging arrangement according to claim 1 , wherein the internal corrugation surfaces are non-parallel, relative to each other.

10. The heat exchanging arrangement according to claim 1 , wherein the at least one heat exchanging element comprises a substantially flat element surface for mating with a respective internal corrugation surface.

11. The heat exchanging arrangement according to claim 1 , wherein the wall section and the corrugation are made of sheet metal or sheet steel.

12. A subsea electronic system comprising:
a watertight enclosure containing dielectric fluid;
at least one electronic device arranged inside the enclosure; and
a heat exchanging arrangement according to claim 1 ;
wherein the enclosure comprises the at least one wall section.

13. The subsea electronic system according to claim 12 , wherein the at last one wall section comprises a top wall section.

14. The subsea electronic system according to claim 12 , wherein, when the at least one electronic device is in use, the dielectric fluid circulates by natural convection.

15. The subsea electronic system according to claim 12 , wherein the enclosure comprises an upper part and a lower part, wherein the heat exchanging arrangement comprises a plurality of heat exchanging elements, and wherein a density of heat exchanging elements is higher in the upper part than in the lower part.

16. The heat exchanging arrangement according to claim 1 , wherein the at least one heat exchanging element comprises two heat exchanging elements, and wherein each heat exchanging element is forced against a respective internal corrugation surface.

17. The heat exchanging arrangement according to claim 1 , wherein the heat exchanging arrangement comprises a force device arranged to force the at least one heat exchanging element against the at least one internal corrugation surface.

18. The heat exchanging arrangement according to claim 17 , wherein the force device comprises a spring.

19. The subsea electronic system according to claim 13 , wherein, when the at least one electronic device is in use, the dielectric fluid circulates by natural convection.

20. The subsea electronic system according to claim 13 , wherein the enclosure comprises an upper part and a lower part, wherein the heat exchanging arrangement comprises a plurality of heat exchanging elements, and wherein a density of heat exchanging elements is higher in the upper part than in the lower part.

Assignees

• Abb Schweiz Ag

Inventors

• Laneryd Tor
• Gradinger Thomas
• Wagner Thomas
• Lendenmann Heinz

Classifications

• F28F9/26

  Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators (connecting different sections in water heaters F24H9/14 {, connecting headers with inlet or outlet fittings F28F9/0246}) · CPC title

• H05K7/20236

  by immersion · CPC title

• F28F2275/10

  by force joining · CPC title

• H05K5/067

  containing a dielectric fluid · CPC title

• H05K7/20263 Primary

  Heat dissipaters releasing heat from coolant · CPC title