Vapor chamber and manufacturing method thereof
US-2017122672-A1 · May 4, 2017 · US
Heat dissipation plate and method for manufacturing the same
US11448470B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11448470-B2 |
| Application number | US-202117412164-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 25, 2021 |
| Priority date | May 29, 2018 |
| Publication date | Sep 20, 2022 |
| Grant date | Sep 20, 2022 |
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- Title
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Abstract
Official abstract text for this publication.
A method for manufacturing a heat dissipation device that includes stamping a composite plate including a welding material to form a first plate having a plurality of angled grooves, depositing powder in the plurality of angled grooves of the first plate, contacting the first plate to a second plate, and welding the first plate and the second plate together, and sintering powder to obtain a capillary structure.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing a heat dissipation device, comprising: stamping a non-composite plate not including a welding material to form a first plate having a plurality of angled grooves, wherein each angled groove extends continuously between opposite longitudinal edges of the first plate and each angled groove is inclined with reference to the longitudinal edges; depositing powder in the plurality of angled grooves of the first plate; sintering the powder to obtain a capillary structure; contacting the first plate to a second plate; and welding the first plate and the second plate together. 2. The method according to claim 1 , further comprising providing a welding flux on the second plate before contacting the first plate to the second plate. 3. The method according to claim 1 , further comprising introducing a coolant in the plurality of angled grooves after welding the first plate and the second plate.
Assignees
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Classifications
for cooling by change of state · CPC title
Assembling together parts thereof · CPC title
by inflating partially united plates · CPC title
with inserted tubes · CPC title
- F28D1/0308Primary
the conduits being formed by paired plates touching each other (F28D1/0358 takes precedence) · CPC title
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- What does patent US11448470B2 cover?
- A method for manufacturing a heat dissipation device that includes stamping a composite plate including a welding material to form a first plate having a plurality of angled grooves, depositing powder in the plurality of angled grooves of the first plate, contacting the first plate to a second plate, and welding the first plate and the second plate together, and sintering powder to obtain a cap…
- Who is the assignee on this patent?
- Cooler Master Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification F28D1/0308. Mapped technology areas include Mechanical Engineering.
- When was this patent published?
- Publication date Tue Sep 20 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).