Three-dimensional heat conducting structure and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2016348985-A1
Application number	US-201514794028-A
Country	US
Kind code	A1
Filing date	Jul 8, 2015
Priority date	May 25, 2015
Publication date	Dec 1, 2016
Grant date	—

Abstract

In a three-dimensional heat conducting structure and its manufacturing method, the manufacturing method includes the steps of (a) providing a vapor chamber having at least one insert hole; (b) providing a heat pipe having an open end, and inserting the open end into the insert hole; (c) providing a support ring, and sheathing the support ring on a joint position of the heat pipe and the vapor chamber; and (d) providing a soldering means, and applying the soldering means between the support ring and the heat pipe.

First claim

What is claimed is:

1 . A three-dimensional heat conducting structure, comprising:
a vapor chamber, including a casing, and at least one insert hole formed on a side of the casing and communicated with the interior of the casing; at least one heat pipe, having an open end inserted into the insert hole and communicated with the interior of the casing; a support ring, sheathed on a joint position of the heat pipe and the vapor chamber, and a side of the support ring being attached onto an outer surface of the vapor chamber; and a solder, disposed between the support ring and the heat pipe, for combining the heat pipe onto the vapor chamber.

2 . The three-dimensional heat conducting structure as claimed in claim 1 , wherein the vapor chamber has a rim formed around the periphery of the insert hole and protruded from the outer surface of the vapor chamber outer surface, and an inner wall surface of the rim is attached to the outer surface of the heat pipe.

3 . The three-dimensional heat conducting structure as claimed in claim 2 , wherein the inner wall surface of the support ring is attached to the outer wall surface of the rim.

4 . The three-dimensional heat conducting structure as claimed in claim 1 , wherein the support ring is a ring made of a metal or heat-resistant non-metal material.

5 . The three-dimensional heat conducting structure as claimed in claim 1 , wherein the support ring has a chamfer disposed on a side adjacent to the heat pipe and the solder stays between the chamfer and the outer surface of the heat pipe without overflowing to a surface of the vapor chamber.

6 . A manufacturing method of a three-dimensional heat conducting structure, comprising the steps of:
(a) providing a vapor chamber having at least one insert hole; (b) providing a heat pipe having an open end, and inserting the open end into the insert hole; (c) providing a support ring, and sheathing the support ring on a joint position of the heat pipe and the vapor chamber; and (d) providing a soldering means, and applying the soldering means between the support ring and the heat pipe to combine the heat pipe onto the vapor chamber.

7 . The manufacturing method of a three-dimensional heat conducting structure as claimed in claim 6 , wherein in Step (a), the vapor chamber has a rim formed around the periphery of the insert hole and protruded from an outer surface of the vapor chamber.

8 . The manufacturing method of a three-dimensional heat conducting structure as claimed in claim 7 , wherein in Step (b), an inner wall surface of the support ring is attached to an outer wall surface of the rim.

9 . The manufacturing method of a three-dimensional heat conducting structure as claimed in claim 6 , wherein in Step (c), the support ring has a chamber disposed on a side adjacent to the heat pipe.

10 . The manufacturing method of a three-dimensional heat conducting structure as claimed in claim 9 , wherein in Step (d), the soldering means includes a solder, and the solder stays between the chamfer and the outer surface of the heat pipe without overflowing to a surface of the vapor chamber.

Assignees

• Cooler Master Co Ltd

Inventors

• Sun Chien-Hung
• Liu lei-lei

Classifications

• F28D15/04

  with tubes having a capillary structure · CPC title

• F28F2275/06

  by welding · CPC title

• F28D15/0275 Primary

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• F28D15/0266

  with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title

• B23K37/06

  for positioning the molten material, e.g. confining it to a desired area · CPC title