MEMS package, MEMS microphone and method of manufacturing the MEMS package

Patent metadata

Field	Value
Publication number	US-11447388-B2
Application number	US-202016789449-A
Country	US
Kind code	B2
Filing date	Feb 13, 2020
Priority date	Mar 22, 2019
Publication date	Sep 20, 2022
Grant date	Sep 20, 2022

Abstract

A MEMS package includes a MEMS chip, a package substrate which the MEMS chip is adhered and a thin-film filter which is adhered to the package substrate or the MEMS chip. The thin-film filter includes a thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, and a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface. The through holes are formed in an adhesive region of the thin-film part. The adhesive region is adhered to the package substrate or the MEMS chip.

First claim

What is claimed is:

1. A MEMS package comprising:
a MEMS chip;
a package substrate which the MEMS chip is adhered; and
a thin-film filter which is adhered to the package substrate or the MEMS chip,
wherein the thin-film filter comprises a thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, and
a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface,
wherein the through holes are formed in an adhesive region of the thin-film part,
wherein the adhesive region is adhered to the package substrate or the MEMS chip,
wherein the MEMS package further comprises:
an adhesive-layer-entering structure which a filter-adhesive layer, being used for an adhesion of the thin-film filter, enters the through holes.

2. The MEMS package according to claim 1 ,
wherein the filter-adhesive layer is adhered to the adhesive region of the thin-film part and inner wall surfaces of the respective through holes.

3. A MEMS package comprising:
a MEMS chip;
a package substrate which the MEMS chip is adhered; and
a thin-film filter which is adhered to the package substrate or the MEMS chip,
wherein the thin-film filter comprises a thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, and
a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface,
wherein the through holes are formed in an adhesive region of the thin-film part,
wherein the adhesive region is adhered to the package substrate or the MEMS chip,
wherein the MEMS package further comprises:
stripes-formed inner wall surfaces having stripe-like parts formed along with an intersecting direction intersecting the film surface, the stripes-formed inner wall surfaces are formed inside the respective through holes.

4. A MEMS package comprising:
a MEMS chip;
a package substrate which the MEMS chip is adhered; and
a thin-film filter which is adhered to the package substrate or the MEMS chip,
wherein the thin-film filter comprises a thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, and
a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface,
wherein the through holes are formed in an adhesive region of the thin-film part,
wherein the adhesive region is adhered to the package substrate or the MEMS chip,
wherein the through holes are further formed in a filter region except for the adhesive region of the thin-film part,
wherein the MEMS package further comprises stripes-formed inner wall surfaces having stripe-like parts formed along with an intersecting direction intersecting the film surface, the stripes-formed inner wall surfaces are formed respectively inside both the through holes formed in the adhesive region and the through holes formed in the filter region.

5. The MEMS package according to claim 1 ,
wherein the through holes are further formed in a filter region except for the adhesive region of the thin-film part,
wherein the MEMS package further comprises stripes-formed inner wall surfaces having stripe-like parts formed along with an intersecting direction intersecting the film surface, the stripes-formed inner wall surfaces are formed respectively inside both the through holes formed in the adhesive region and the through holes formed in the filter region.

6. The MEMS package according to claim 3 ,
wherein the stripe-like parts are formed as concave parts which are indented from inner wall surfaces of the through holes or convex parts which protrude from the inner wall surfaces of the through holes,
wherein the filter-adhesive layer enters the concave parts when the stripe-like parts are formed as the concave parts, or the filter-adhesive layer is in contact with protruding surfaces, of the convex parts, protrude from the inner wall surfaces when the stripe-like parts are formed as the convex parts.

7. The MEMS package according to claim 4 ,
wherein the stripe-like parts are formed as concave parts which are indented from inner wall surfaces of the through holes or convex parts which protrude from the inner wall surfaces of the through holes,
wherein the filter-adhesive layer enters the concave parts when the stripe-like parts are formed as the concave parts, or the filter-adhesive layer is in contact with protruding surfaces, of the convex parts, protrude from the inner wall surfaces when the stripe-like parts are formed as the convex parts.

8. The MEMS package according to claim 4 ,
wherein the through holes are formed in circular shapes in a plan view,
wherein the thin-film filter comprises a first through hole-group and a second through hole-group respectively having the through holes,
wherein the first through hole-group has a first through hole, arranged in a position which the interval to a peripheral end part of the thin-film part is set a first interval, and the through holes are arranged at a constant interval in a straight line,
wherein the second through hole-group has a second through hole, arranged in a position which the interval to the peripheral end part is set a second interval different from the first interval, and the through holes are arranged at a constant interval in a straight line,
wherein in the thin-film filter, a first line formed by the first through hole-group, and a second line formed by the second through hole-group, are arranged alternately.

9. The MEMS package according to claim 3 ,
wherein the stripe-like parts are arranged in almost the whole of the inner wall surface of the respective through holes.

10. The MEMS package according to claim 3 ,
wherein the stripe-like parts are formed in the length longer than 80% of a film thickness being a thickness of the thin-film part.

11. A MEMS microphone comprising:
a MEMS package; and
a cap which wraps the MEMS package,
wherein the MEMS package comprises a MEMS chip, a package substrate which the MEMS chip is adhered, and a thin-film filter which is adhered to the package substrate or the MEMS chip,
wherein the thin-film filter comprises a thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, and
a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface,
wherein the through holes are formed in an adhesive region of the thin-film part,
wherein the adhesive region is adhered to the package substrate or the MEMS chip,
the MEMS microphone further comprises:
an adhesive-layer-entering structure which a filter-adhesive layer, being used for an adhesion of the thin-film filter, enters the through holes.

Assignees

• Sae Magnetics Hk Ltd

Inventors

• Take Hiroshi
• Yoshida Makoto
• Binarao Anthony Reymund Melad
• Heng Cheng Bu

Classifications

• H04R19/04 Primary

  Microphones (H04R19/01 takes precedence) · CPC title

• B81B7/02 Primary

  containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) · CPC title

• B81B2201/10

  Microfilters, e.g. for gas or fluids · CPC title

• H04R19/005

  using semiconductor materials · CPC title

• H04R31/00

  Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)} · CPC title