Three-dimensional silicon-based comb probe

Patent metadata

Field	Value
Publication number	US-11439338-B2
Application number	US-201816204703-A
Country	US
Kind code	B2
Filing date	Nov 29, 2018
Priority date	Nov 29, 2018
Publication date	Sep 13, 2022
Grant date	Sep 13, 2022

Abstract

A three-dimensional (3D) comb probe structure includes a carrier, a plurality of combs arranged in the carrier and spaced apart from one another, a plurality of shanks forming the combs, each shank including a base portion and a stem portion extending from the base portion, wherein sets of the shanks are joined together by the base portions thereof to form a respective comb, and a plurality of sensing elements disposed along the stem portion of each of the shanks and electrically connected to electrical contacts disposed at respective ones of the base portions. The sensing elements can include nanopatterned features on surfaces thereof forming a non-random topography.

First claim

What is claimed is:

1. A three-dimensional (3D) comb probe structure comprising:
a carrier;
a plurality of combs arranged in the carrier and spaced apart from one another;
a plurality of shanks forming each comb of the plurality of combs, each shank of the plurality of shanks comprising a base portion and a stem portion extending from the base portion, a plurality of upper horizontal crossbars disposed on an upper surface of the base portion, and a plurality of vertical crossbars disposed on a surface of the stem portion and electrically connected to the plurality of upper horizontal crossbars, wherein the upper surface of the base portion is perpendicular to the surface of the stem portion and wherein a set of the plurality of shanks are joined together at the base portions thereof to form a respective one of the plurality of combs;
a plurality of sensing elements disposed along the stem portion of each of the shanks and electrically connected to the plurality of vertical crossbars;
a control chip disposed on the carrier and directly, electrically, connected to the plurality of upper horizontal crossbars, wherein the control chip is disposed parallel to the upper surface of the base portion; and
a solder bump on each upper horizontal crossbar of the plurality of upper horizontal crossbars, wherein the solder bumps form an array directly, electrically, connecting the control chip to each shank of the plurality of shanks forming each comb of the plurality of combs.

2. The 3D comb probe structure of claim 1 , wherein each sensing element of the plurality of sensing elements comprises:
a substrate that includes a semiconductor material; and
a base layer, formed of a conductive material, formed on the substrate and bearing a plurality of nano-patterned features increasing a surface area of the base layer of the sensing element.

3. The 3D comb probe structure of claim 2 , wherein the nano-patterned features are arranged in a non-random topography comprising repeating individually articulated features.

4. The 3D comb probe structure of claim 1 , wherein each comb of the plurality of combs is formed of a set of the plurality of shanks disposed in a one-dimensional array.

5. The 3D comb probe structure of claim 1 , wherein the carrier is configured to secure a number of the plurality of combs equal to a number of the plurality of shanks in each comb, such that the plurality of shanks of each comb are disposed in a two-dimensional array.

6. The 3D comb probe structure of claim 1 , wherein the plurality of sensing elements disposed along the stem portions of the plurality of shanks are arranged in a three-dimensional array.

7. The 3D comb probe structure of claim 1 , wherein the plurality of shanks are formed of silicon.

8. The 3D comb probe structure of claim 1 , wherein the plurality of sensing elements are formed on a single side of the stem portions.

9. The 3D comb probe structure of claim 1 , wherein the plurality of sensing elements are formed on opposite sides of the stem portions.

10. The 3D comb probe structure of claim 1 , wherein each shank of the plurality of shanks is formed of two identical sub-shanks, and each of the two sub-shanks comprises a patterned face including a respective set of the plurality of sensing elements and a non-patterned face, wherein the non-patterned faces of two sub-shanks are bonded directly together by an adhesive, such that the plurality of sensing elements are formed on exposed faces of the sub-shanks and a first exposed face of the exposed faces forms the surface of the stem portion and a second exposed face of the exposed faces forms an opposite surface of the stem portion.

11. A shank structure comprising:
a base portion;
a stem portion;
a plurality of sensing elements formed on a surface the stem portion; and
an input/output interface on a top surface of the base portion, wherein an upper surface of the base portion is perpendicular to the surface of the stem portion, the input/output interface comprising a plurality of upper horizontal crossbars and a solder bump on each upper horizontal crossbar of the plurality of upper horizontal crossbars, wherein the plurality of sensing elements are electrically connected to the input/output interface disposed on the top surface of the base portion by an interconnect wiring on a surface of the stem portion,
wherein a control chip is directly, electrically, connected to solder bump on the upper horizontal crossbar, wherein the control chip is disposed parallel to the upper surface of the base portion.

12. The shank structure of claim 11 , wherein the shank structure is disposed in a comb of shanks.

13. The shank structure of claim 11 , further comprising a first sub-shank and a second sub-shank, each comprising a set of the plurality of sensing elements disposed on a first side thereof, and second sides of the first sub-shank and the second sub-shank are bonded directly to one-another by an adhesive such that the plurality of sensing elements of the shank structure are on the first sides of the first sub-shank and the second sub-shank and one of the first sides of the first sub-shank forms the surface of the stem portion and another one of the first sides of the first sub-shank forms an opposite surface of the stem portion of the shank structure.

14. The shank structure of claim 11 , further comprising a plurality of nano-patterned features comprising non-random topography disposed on the plurality of sensing elements.

15. The shank structure of claim 11 , further comprising a biological functionalization material disposed on exposed surfaces of the plurality of sensing elements.

16. The shank structure of claim 11 , wherein the base portion comprises:
a processor; and
a memory.

Assignees

• IBM

Inventors

• Yu Roy R
• Kinser Emily R
• Deligianni Hariklia

Classifications

• A61B5/294 Primary

  for nerve conduction study [NCS] · CPC title

• A61B5/291 Primary

  for electroencephalography [EEG] · CPC title

• A61N1/0531

  Brain cortex electrodes · CPC title

• A61B5/24

  Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof · CPC title

• A61N1/0529 Primary

  Electrodes for brain stimulation · CPC title