Bolster plate
US-2017202079-A1 · Jul 13, 2017 · US
US10161898B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10161898-B2 |
| Application number | US-201715419524-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 30, 2017 |
| Priority date | Jan 30, 2017 |
| Publication date | Dec 25, 2018 |
| Grant date | Dec 25, 2018 |
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Methods for forming an electrode structure, which can be used as a biosensor, are provided in which the electrode structure has non-random topography located on one surface of an electrode base. In some embodiments, an electrode structure is obtained that contains no interface between the non-random topography of the electrode structure and the electrode base of the electrode structure. In other embodiments, electrode structures are obtained that have an interface between the non-random topography of the electrode structure and the electrode base of the electrode structure.
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What is claimed is: 1. A method of forming an electrode structure, said method comprising: providing a mold having a pattern that comprises both an electrode base shape and a nanotopography shape; forming a metallic seed layer on exposed surfaces of said mold having said electrode base shape and said nanotopography shape; electrodepositing a conductive metal-containing material on said metallic seed layer and within said mold to provide an electrode structure comprising said conductive metal-containing material and having said electrode base shape and said nanotopography shape; removing said mold from said electrode structure; and attaching a biological functionalization material to said electrode structure. 2. The method of claim 1 , wherein said providing said mold comprises: first patterning a substrate to provide said electrode base shape in said substrate; and second patterning said substrate containing said electrode base shape to provide said nanotopography shape into said substrate. 3. The method of claim 1 , wherein said metallic seed layer and said conductive metal-containing material comprise a same metal or metal alloy. 4. The method of claim 1 , further comprising: removing excess conductive metal-containing material formed atop said mold. 5. The method of claim 1 , wherein said removing said mold comprises contacting said mold with a chemical wet etchant. 6. The method of claim 1 , wherein said biological functionalization material is composed of an oligonucleotide, a nucleic acid, a peptide, a ligand, a protein, an enzyme, or any other material apt to bind with a complementary target biomolecule. 7. The method of claim 6 , wherein said biological functionalization material is composed of glucose oxidase or glucose dehydrogenase. 8. The method of claim 1 , wherein no interface is present between said electrode base shape and said nanotopography shape.
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