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Surface mount device placement to control a signal path in a printed circuit board
US11439015B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11439015-B2 |
| Application number | US-201916598126-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 10, 2019 |
| Priority date | Oct 10, 2019 |
| Publication date | Sep 6, 2022 |
| Grant date | Sep 6, 2022 |
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- Title
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Abstract
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Surface mount device (SMD) placement to control a signal path in a printed circuit board (PCB), including: adding, to a PCB, a plurality of signal path segments, each signal path segment of the plurality of signal path segments ending at corresponding pad of a plurality of pads, wherein a first pad of the plurality of pads is couplable to a second pad of the plurality of pads to create a first signal path and is couplable to a third pad of the plurality of pads to create a second signal path; and coupling, via a discrete SMD, the first pad and the second pad to create the first signal path comprising a first signal path segment of the plurality of signal path segments and a second signal path segment of the plurality of signal path segments.
First claim
Opening claim text (preview).
What is claimed is: 1. A printed circuit board (PCB) for surface mount device (SMD) placement to control a signal path in a PCB, comprising: a plurality of signal path segments, each signal path segment of the plurality of signal path segments ending at corresponding pad of a plurality of pads, wherein a first pad of the plurality of pads is couplable to a second pad of the plurality of pads to create a first signal path and is couplable to a third pad of the plurality of pads to create a second signal path; a discrete surface mount device coupling the first pad and the second pad to create the first signal path comprising a first signal path segment of the plurality of signal path segments and a second signal path segment of the plurality of signal path segments; and a plurality of vias, wherein each of the plurality of vias are separate from each of the plurality of pads. 2. The PCB of claim 1 , wherein the second signal path comprises the first signal path segment of the plurality of signal path segments and a third signal path segment of the plurality of signal path segments. 3. The PCB of claim 1 , wherein the third pad is uncoupled to any other signal path segment of the plurality of signal path segments. 4. The PCB of claim 1 , wherein the discrete SMD comprises a capacitor, a resistor, or an inductor. 5. The PCB of claim 1 , wherein the PCB comprises a radio frequency (RF) PCB. 6. The PCB of claim 1 , wherein the plurality of pads are arranged based on a dimension of the discrete SMD. 7. The PCB of claim 1 , wherein the discrete surface mount device is soldered to the first pad and the second pad. 8. An apparatus, comprising: a printed circuit board (PCB) for surface mount device (SMD) placement to control a signal path in a PCB, comprising: a plurality of signal path segments, each signal path segment of the plurality of signal path segments ending at corresponding pad of a plurality of pads, wherein a first pad of the plurality of pads is couplable to a second pad of the plurality of pads to create a first signal path and is couplable to a third pad of the plurality of pads to create a second signal path; a discrete surface mount device coupling the first pad and the second pad to create the first signal path comprising a first signal path segment of the plurality of signal path segments and a second signal path segment of the plurality of signal path segments; and a plurality of vias, wherein each of the plurality of vias are separate from each of the plurality of pads. 9. The apparatus of claim 8 , wherein the second signal path comprises the first signal path segment of the plurality of signal path segments and a third signal path segment of the plurality of signal path segments. 10. The apparatus of claim 8 , wherein the third pad is uncoupled to any other signal path segment of the plurality of signal path segments. 11. The apparatus of claim 8 , wherein the discrete SMD comprises a capacitor, a resistor, or an inductor. 12. The apparatus of claim 8 , wherein the PCB comprises a radio frequency (RF) PCB. 13. The apparatus of claim 8 , wherein the plurality of pads are arranged based on a dimension of the discrete SMD. 14. The apparatus of claim 8 , wherein the discrete surface mount device is soldered to the first pad and the second pad. 15. A system, comprising: an apparatus comprising a printed circuit board (PCB) for surface mount device (SMD) placement to control a signal path in a PCB, the PCB comprising: a plurality of signal path segments, each signal path segment of the plurality of signal path segments ending at corresponding pad of a plurality of pads, wherein a first pad of the plurality of pads is couplable to a second pad of the plurality of pads to create a first signal path and is couplable to a third pad of the plurality of pads to create a second signal path; a discrete surface mount device coupling the first pad and the second pad to create the first signal path comprising a first signal path segment of the plurality of signal path segments and a second signal path segment of the plurality of signal path segments; and a plurality of vias, wherein each of the plurality of vias are separate from each of the plurality of pads. 16. The system of claim 15 , wherein the second signal path comprises the first signal path segment of the plurality of signal path segments and a third signal path segment of the plurality of signal path segments. 17. The system of claim 15 , wherein the third pad is uncoupled to any other signal path segment of the plurality of signal path segments. 18. The system of claim 15 , wherein the discrete SMD comprises a capacitor, a resistor, or an inductor. 19. The system of claim 15 , wherein the PCB comprises a radio frequency (RF) PCB. 20. The system of claim 15 , wherein the discrete surface mount device is soldered to the first pad and the second pad.
Assignees
Inventors
Classifications
- H05K1/181Primary
associated with surface mounted components · CPC title
High frequency adaptations (H05K1/0216 takes precedence) · CPC title
Non-printed capacitor · CPC title
- H05K1/029Primary
having a programmable lay-out, i.e. adapted for choosing between a few possibilities · CPC title
with surface mounted components (H05K3/32 takes precedence) · CPC title
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Frequently asked questions
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- What does patent US11439015B2 cover?
- Surface mount device (SMD) placement to control a signal path in a printed circuit board (PCB), including: adding, to a PCB, a plurality of signal path segments, each signal path segment of the plurality of signal path segments ending at corresponding pad of a plurality of pads, wherein a first pad of the plurality of pads is couplable to a second pad of the plurality of pads to create a first …
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification H05K1/181. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 06 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).