Electronic device and method of manufacturing the same
US-2019057921-A1 · Feb 21, 2019 · US
Electronic module, method of manufacturing connector, and method of manufacturing electronic module
US11437340B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11437340-B2 |
| Application number | US-201715782011-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 19, 2017 |
| Priority date | May 19, 2017 |
| Publication date | Sep 6, 2022 |
| Grant date | Sep 6, 2022 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
An electronic module has a first electronic element 13 , a first connector 60 provided in one side of the first electronic element 13 , and having a first columnar part 62 extending to another side and a first groove part 64 provided in a one-side surface, and a second electronic element 23 provided in one side of the first connector 60 via a conductive adhesive agent provided inside a circumference of the first groove part 64 . The first connector 60 has a first concave part 67 on one side at a position corresponding to the first columnar part 62.
First claim
Opening claim text (preview).
The invention claimed is: 1. An electronic module comprising: a first electronic element; a second electronic element; a connector provided on a lower side of the second electronic element, the connector having an upper surface on which the second electronic element is provided; a columnar connector part extending from a lower surface of the connector; wherein the first electronic element is provided on a lower side of the columnar connector part, wherein the upper surface of the connector has a concave part at a position corresponding to the columnar connector part, the upper surface of the connector comprises an inclined surface included in the concave part, and a flat surface provided outside a circumference of the inclined surface, and a groove part is provided at a boundary between the inclined surface and the flat surface, and the columnar connector part is positioned lower than a bottom edge of the groove part.
Assignees
Inventors
Classifications
Multiple chips on leadframes · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title
changes in shapes · CPC title
Die-attach connectors and strap connectors · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11437340B2 cover?
- An electronic module has a first electronic element 13 , a first connector 60 provided in one side of the first electronic element 13 , and having a first columnar part 62 extending to another side and a first groove part 64 provided in a one-side surface, and a second electronic element 23 provided in one side of the first connector 60 via a conductive adhesive agent provided insid…
- Who is the assignee on this patent?
- Shindengen Electric Mfg
- What technology area does this patent fall under?
- Primary CPC classification H10W70/048. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 06 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).