Ozone wafer cleaning module having an ultraviolet lamp module with rotatable reflectors

Patent metadata

Field	Value
Publication number	US-11430671-B2
Application number	US-202016944026-A
Country	US
Kind code	B2
Filing date	Jul 30, 2020
Priority date	Jul 30, 2020
Publication date	Aug 30, 2022
Grant date	Aug 30, 2022

Abstract

A wafer cleaning module and a method for cleaning a wafer with the wafer cleaning module are disclosed. For example, the wafer cleaning module includes a wafer chuck to hold a wafer, an ozone source to provide ozone gas towards the wafer, and an ultraviolet (UV) lamp module to provide UV light. The UV lamp module includes a UV light source and a rotatable reflector around the UV light source. The rotatable reflector is movable to adjust an amount of UV light directed towards a surface of the wafer.

First claim

What is claimed is:

1. A substrate cleaning module, comprising:
a chuck to hold a substrate;
first and second quartz plates over the chuck and defining a gas passage, wherein the first quartz plate has an inner surface facing the gas passage and an outer surface opposite to the inner surface;
an ozone source to provide ozone gas towards the substrate through the gas passage; and
an ultraviolet (UV) lamp module laterally adjacent the outer surface of the first quartz plate to provide UV light, wherein the UV lamp module, comprises:
a UV light source; and
a rotatable reflector located around the UV light source, wherein the rotatable reflector is movable to adjust an amount of UV light directed towards a surface of the substrate.

2. The substrate cleaning module of claim 1 , further comprising:
quartz plates, wherein the ozone gas is provided between the quartz plates in a uniform curtain.

3. The substrate cleaning module of claim 1 , wherein the UV lamp module further comprises:
a motor, wherein the rotatable reflector is coupled to the motor and the motor is to rotate the rotatable reflector around the UV light source.

4. The substrate cleaning module of claim 1 , wherein the rotatable reflector has a cross-sectional curvature that is substantially similar to a cross-sectional curvature of the UV light source.

5. The substrate cleaning module of claim 1 , wherein the rotatable reflector partially covers an outer surface area of the UV light source.

6. The substrate cleaning module of claim 1 , wherein the rotatable reflector comprises silver or aluminum oxide.

7. The substrate cleaning module of claim 1 , wherein the rotatable reflector is controlled to be positioned at one of a plurality of different pre-defined positions based on a metal on a top layer of the substrate.

8. The substrate cleaning module of claim 1 , wherein the UV light source comprises a cylindrical shape having a center axis.

9. The substrate cleaning module of claim 8 , wherein the rotatable reflector partially covers the cylindrical shape of the UV light source and rotates around the center axis of the UV light source.

10. A substrate cleaning module, comprising:
a chuck to hold a substrate;
a first quartz plate and a second quartz plate located above the substrate, wherein the first quartz plate and the second quartz plate form a gas passage;
a first ultraviolet (UV) lamp module comprising a first reflector located adjacent to the first quartz plate;
a second UV lamp module comprising a second reflector located adjacent to the second quartz plate and opposite the first UV lamp module, wherein at least one of the first reflector or second reflector is rotatable, and wherein the first UV lamp module and the second UV lamp module are disposed on opposite sides of the gas passage; and
an ozone source to provide ozone gas through the gas passage formed by the first quartz plate and the second quartz plate towards the substrate.

11. The substrate cleaning module of claim 10 , wherein the first reflector and the second reflector are positioned to direct UV light emitted by the first UV lamp module and the second UV lamp module away from a top surface of the substrate.

12. The substrate cleaning module of claim 11 , wherein the first reflector and the second reflector are positioned such that a central axis of the first reflector and the second reflector are approximately parallel to the top surface of the substrate.

13. The substrate cleaning module of claim 10 , wherein at least one of the first reflector and the second reflector is positioned to direct UV light emitted by the first UV lamp module or the second UV lamp module away from a top surface of the substrate and at least one of the first reflector and the second reflector is positioned to direct the UV light emitted by the first UV lamp module or the second UV lamp module towards the top surface of the substrate.

14. The substrate cleaning module of claim 13 , wherein at least one of the first reflector and the second reflector is positioned such that a central axis of the first reflector or the second reflector is approximately parallel to the top surface of the substrate and a central axis of the other one of the first reflector or the second reflector is angled at approximately 45 degrees relative to the top surface of the substrate.

15. The substrate cleaning module of claim 10 , wherein the first reflector and the second reflector are positioned to direct UV light emitted by the first UV lamp module and the second UV lamp module towards a top surface of the substrate.

16. The substrate cleaning module of claim 15 , wherein the first reflector and the second reflector are positioned such that a central axis of the first reflector and the second reflector are angled approximately 45 degrees relative to the top surface of the substrate.

17. A method for cleaning a substrate in a substrate cleaning module having a first ultraviolet (UV) lamp module with a first rotatable reflector and a second UV lamp module with a second rotatable reflector, comprising:
receiving, by a controller, information of a type of material located on a top surface of the substrate;
rotating, by the controller, the first rotatable reflector and the second rotatable reflector into a position to control an amount of UV light directed towards the top surface of the substrate based on the information of the type of material;
providing, by the controller, ozone gas through a gas passage formed by first and second quartz plates to the top surface of the substrate, wherein the first and second UV lamp modules are laterally adjacent the first and second quartz plates, respectively; and
activating, by the controller, the first UV lamp module and the second UV lamp module to clean the top surface of the substrate.

18. The method of claim 17 , further comprising:
receiving, by the controller, information of a type of second material located on a top surface of a second substrate;
rotating, by the controller, the first rotatable reflector and the second rotatable reflector into a second position to control the amount of UV light directed towards the top surface of the second substrate based on the information of the type of second material;
providing, by the controller, the ozone gas towards the top surface of the second substrate; and
activating, by the controller, the first UV lamp module and the second UV lamp module to clean the top surface of the second substrate.

19. The method of claim 17 , wherein the rotating comprises moving the first rotatable reflector around a central axis of the first UV lamp module and moving the second rotatable reflector around a central axis of the second UV lamp module.

20. The method of claim 17 , wherein the position is based on an amount of surface modification desired for the type of material.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Lin Chen-Yang
• Liu Chung-Hsuan
• Sung Ku-Hsiang
• Lin Kuan-Wen
• Chen Chia-Jen
• Lee Hsin-Chang

Classifications

• H10P70/20

  Cleaning during device manufacture · CPC title

• H10P72/0406 Primary

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title

• H10P72/0436

  mainly by radiation · CPC title

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• B08B7/04

  by a combination of operations · CPC title