Method for producing hydrophobic heat insulation material

Patent metadata

Field	Value
Publication number	US-11427506-B2
Application number	US-201716339081-A
Country	US
Kind code	B2
Filing date	Jul 13, 2017
Priority date	Jul 29, 2016
Publication date	Aug 30, 2022
Grant date	Aug 30, 2022

Abstract

Process for producing a thermally insulating mixture comprising hydrophobic silica, in whicha) a pulverulent carrier material selected from the group consisting of precipitated silicas, SiO2 aerogels, pearlites and mixtures thereof is coated with a liquid silicon compound, where the liquid silicon compound has at least one alkyl group and a boiling point of less than 200° C., andb) the pulverulent carrier material that has thus been coated with the liquid silicon compound is mixed with a composition comprising a pulverulent hydrophilic fumed silica and the mixture is subjected to thermal treatment at more than 40° C. andc) any unreacted silicon compound is subsequently removed from the thermally treated mixture, thus giving the thermally insulating mixture comprising hydrophobic silica.

First claim

The invention claimed is:

1. A process for producing a thermally insulating mixture comprising hydrophobic silica, wherein:
a) a pulverulent carrier material selected from the group consisting of precipitated silicas, SiO 2 aerogels, perlites and mixtures thereof is coated with a liquid silicon compound, wherein the liquid silicon compound has at least one alkyl group and a boiling point of less than 200° C. and wherein coating is performed at a temperature of 0-40° C.;
b) the pulverulent carrier material that has been coated in step a) with the liquid silicon compound is mixed with a composition comprising a pulverulent hydrophilic fumed silica to form a mixture which is then is subjected to thermal treatment at more than 40° C., thereby forming a thermally treated mixture; and
c) any unreacted liquid silicon compound is subsequently removed from the thermally treated mixture obtained in step b), thus giving the thermally insulating mixture comprising hydrophobic silica.

2. The process of claim 1 , wherein the liquid silicon compound is present in an amount of 10-300 g per 100 g of pulverulent carrier material employed in step a).

3. The process of claim 1 , wherein the pulverulent carrier material coated with the liquid silicon compound is present in an amount of 1-50 g per 100 g of pulverulent hydrophilic fumed silica employed in step b).

4. The process of claim 1 , wherein the liquid silicon compound employed in step a) is present in an amount of 1-20 g per 100 g of the sum of the amounts of the pulverulent hydrophilic fumed silica employed in step b) and the pulverulent carrier material employed in step a).

5. The process of claim 1 , wherein the pulverulent carrier material has a quotient of DOA absorption/tamped density of 0.005-0.1 l/g, wherein the DOA absorption is reported in g per 100 g of carrier material and the tamped density in g/l.

6. The process of claim 1 , wherein the pulverulent carrier material has a DOA absorption of 200-300 g/100 g.

7. The process of claim 1 , wherein the pulverulent carrier material has a tamped density of 90-300 g/l.

8. The process of claim 1 , wherein the pulverulent hydrophilic fumed silica has a quotient of DOA absorption/tamped density of 0.02-0.1 l/g, wherein the DOA absorption is reported in g per 100 g of silica and the tamped density in g/l.

9. The process of claim 1 , wherein the quotient of DOA absorption/tamped density of the pulverulent hydrophilic fumed silica is greater than that of the pulverulent carrier material.

10. The process of claim 1 , wherein the pulverulent carrier material has been hydrophobized.

11. The process of claim 1 , wherein the pulverulent hydrophilic fumed silica has a DOA absorption of 200-300 g/100 g and a tamped density of 30-70 g/l.

12. The process of claim 1 , wherein the liquid silicon compound is selected from the group consisting of CH 3 —Si—Cl 3 , (CH 3 ) 2 —Si—Cl 2 , (CH 3 ) 3 —Si—Cl, C 2 H 5 —Si—Cl 3 , (C 2 H 5 ) 2 —Si—Cl 2 , (C 2 H 5 ) 3 —Si—Cl, C 3 H 8 —Si—Cl 3 , CH 3 —Si—(OCH 3 ) 3 , (CH 3 ) 2 —Si—(OCH 3 ) 2 , (CH 3 ) 3 —Si—OCH 3 , C 2 H 5 —Si—(OCH 3 ) 3 , (C 2 H 5 ) 2 —Si—(OCH 3 ) 2 , (C 2 H 5 ) 3 —Si—OCH 3 , C 8 H 15 —Si—(OC 2 H 5 ) 3 , C 8 H 15 —Si—(OCH 3 ) 3 , (H 3 C) 3 —Si—NH—Si(CH 3 ) 3 and mixtures thereof.

13. The process of claim 1 , wherein the composition comprising the hydrophilic fumed silica comprises an IR opacifier and/or inorganic fibres.

14. The process of claim 13 , wherein the silica is present at 60%-90% by weight and the IR opacifier is present at 10%-30% by weight, based on the composition comprising the hydrophilic fumed silica employed in step b).

15. The process of claim 1 , wherein the mixture is compacted prior to the thermal treatment.

16. The process of claim 15 , wherein the thermal treatment of the mixture is carried out not more than 3 hours after compaction thereof and wherein, between performing compaction and thermal treatment, the mixture is kept at a temperature in the range of 0-40° C.

17. The process of claim 15 , wherein the mixture is compacted to a granular material.

18. The process of claim 15 , wherein the mixture is compacted to a board.

19. The process of claim 14 , wherein the liquid silicon compound used in step a) is (H 3 C) 3 —Si—NH—Si(CH 3 ) 3 and the thermally insulating mixture is compacted to a granular material with a tamped density of 100-400 g/l.

20. A method for making a structure for insulation comprising
a) a pulverulent carrier material selected from the group consisting of precipitated silicas, SiO2 aerogels, perlites and mixtures thereof is coated with a liquid silicon compound, wherein the liquid silicon compound has at least one alkyl group and a boiling point of less than 200° C. and wherein coating is performed at a temperature of 0-40° C.;
b) the pulverulent carrier material that has been coated in step a) with the liquid silicon compound is mixed with a composition comprising a pulverulent hydrophilic fumed silica to form a mixture which is then is subjected to thermal treatment at more than 40° C., thereby forming a thermally treated mixture;
c) any unreacted liquid silicon compound is subsequently removed from the thermally treated mixture obtained in step b), thus giving the thermally insulating mixture comprising hydrophobic silica; and
d) compacting the thermally insulating mixture comprising hydrophobic silica into a board.

Assignees

• Evonik Operations Gmbh

Inventors

• Schultz Thorsten
• Geisler Matthias
• Olek Maciej
• Tschernjaew Juri
• Asbahr Hark-Oluf
• Gärtner Gabriele

Classifications

• C04B2111/28

  Fire resistance, i.e. materials resistant to accidental fires or high temperatures · CPC title

• C04B14/185

  expanded · CPC title

• E04B1/76

  specifically with respect to heat only (heat insulation in general F16L59/00) · CPC title

• C04B30/00

  Compositions for artificial stone, not containing binders · CPC title

• C04B20/1051 Primary

  Organo-metallic compounds; Organo-silicon compounds, e.g. bentone · CPC title