Using thermalizing material in an enclosure for cooling quantum computing devices

Patent metadata

Field	Value
Publication number	US-11425841-B2
Application number	US-201916561920-A
Country	US
Kind code	B2
Filing date	Sep 5, 2019
Priority date	Sep 5, 2019
Publication date	Aug 23, 2022
Grant date	Aug 23, 2022

Abstract

Devices, systems, methods, and computer-implemented methods to facilitate employing thermalizing materials in an enclosure for quantum computing devices are provided. According to an embodiment, a system can comprise a quantum computing device and an enclosure having the quantum computing device disposed within the enclosure. The system can further comprise a thermalizing material disposed within the enclosure, with the thermalizing material being adapted to thermally link a cryogenic device to the quantum computing device.

First claim

What is claimed is:

1. A system, comprising:
a quantum computing device;
an enclosure having the quantum computing device disposed within the enclosure, wherein the enclosure is leak-tight; and
at least one thermalizing material disposed within the enclosure, wherein the at least one thermalizing material is adapted to thermally link a cryogenic device to the quantum computing device, and wherein the at least one thermalizing material comprises a liquid thermalizing material, and at least a portion of the quantum computing device is immersed in the liquid thermalizing material.

2. The system of claim 1 , wherein the enclosure is coupled to the cryogenic device.

3. The system of claim 2 , wherein the cryogenic device is a dilution refrigerator, and wherein the enclosure is coupled to a mixing chamber plate of the dilution refrigerator.

4. The system of claim 1 , wherein the enclosure is a part of the cryogenic device.

5. The system of claim 1 , wherein the liquid thermalizing material comprises superfluid helium.

6. The system of claim 1 , wherein the enclosure comprises an enclosure opening to facilitate providing the liquid thermalizing material therein.

7. The system of claim 6 , further comprising:
a one-piece hollow body defining a fluid path; and
a valve coupled to the one-piece hollow body, wherein the enclosure opening comprises the valve, and wherein the fluid path traverses multiple stages of the cryogenic device.

8. The system of claim 7 , wherein the valve facilitates blocking the enclosure opening to facilitate evacuating excess liquid thermalizing material from the one-piece hollow body.

9. The system of claim 1 , wherein the enclosure comprises a connection to interact with the quantum computing device.

10. The system of claim 9 , wherein the connection comprises a hermetic microwave feedthrough into the enclosure, coupled to the quantum computing device.

11. The system of claim 9 , wherein the connection comprises a direct current feedthrough into the enclosure, coupled to the quantum computing device.

12. The system of claim 1 , wherein the at least one thermalizing material further comprises a solid thermalizing material.

13. The system of claim 12 , wherein the solid thermalizing material is in contact with the quantum computing device.

14. A method, comprising:
forming an enclosure, wherein the enclosure is leak-tight;
disposing a quantum computing device within the enclosure; and
providing a thermalizing material into the enclosure with the quantum computing device, wherein the thermalizing material is adapted to thermally link a cryogenic device to the quantum computing device, the thermalizing material comprises a liquid thermalizing material, and at least a portion of the quantum computing device is immersed in the liquid thermalizing material.

15. The method of claim 14 , further comprising coupling the enclosure to the cryogenic device.

16. The method of claim 14 , further comprising:
coupling a one-piece hollow body defining a fluid path to a valve disposed in an opening in the enclosure, wherein the providing the thermalizing material into the enclosure comprises providing the thermalizing material into the enclosure by employing the one-piece hollow body and the valve in an open state.

17. The method of claim 16 , further comprising:
changing the valve to be in a closed state; and
evacuating excess thermalizing material from the one-piece hollow body.

18. The method of claim 17 , wherein the one-piece hollow body traverses multiple temperature stages of the cryogenic device, and wherein the evacuating the excess thermalizing material from the one-piece hollow body prevents a thermal short between two or more of the multiple temperature stages.

19. The method of claim 14 , further comprising, connecting a microwave source to the quantum computing device via a cryogenic connector into the enclosure.

20. The method of claim 14 , wherein the liquid thermalizing material comprises superfluid helium.

Assignees

• IBM

Inventors

• Hart Sean
• Bogorin Daniela Florentina
• Bronn Nicholas Torleiv
• Gumann Patryk
• Olivadese Salvatore Bernardo

Classifications

• H05K7/20372

  Cryogenic cooling; Nitrogen liquid cooling · CPC title

• H05K7/20781

  within cabinets for removing heat from server blades · CPC title

• G06F1/20 Primary

  Cooling means · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• F25B9/12

  using 3He-4He dilution · CPC title