Inverted metamorphic multijunction solar cells having a permanent supporting substrate

US11424381B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11424381-B2
Application numberUS-202016897558-A
CountryUS
Kind codeB2
Filing dateJun 10, 2020
Priority dateMar 10, 2009
Publication dateAug 23, 2022
Grant dateAug 23, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure provides a method of manufacturing a solar cell that includes providing a semiconductor growth substrate; depositing on said growth substrate a sequence of layers of semiconductor material forming a solar cell; applying a metal contact layer over said sequence of layers; affixing the adhesive polyimide surface of a permanent supporting substrate directly over said metal contact layer and permanently bonding it thereto by a thermocompressive technique; and removing the semiconductor growth substrate.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a solar cell comprising: providing a semiconductor growth substrate; depositing on said growth substrate a sequence of layers of semiconductor material forming a solar cell, including a first solar subcell deposited on said substrate having a first band gap; a second solar subcell deposited over said first subcell having a second band gap smaller than said first band gap; a grading interlayer deposited over said second subcell composed of InGaAlAs and having a third band gap larger than said second band gap; a third solar subcell deposited over the grading interlayer and having a fourth band gap smaller than said second band gap such that said third subcell is lattice mismatched with respect to said second subcell; depositing a metal contact layer over said sequence of layers; affixing an adhesive surface of a permanent supporting substrate directly over said metal contact layer; permanently bonding the supporting substrate to the metal contact layer by a thermocompressive technique; removing the growth substrate. 2. A method as defined in claim 1 , further comprising depositing a coating layer composed of a polymer, a polyimide composition, or an epoxy based photoresist material over the metal contact layer by spinning-on, spraying, or brushing. 3. A method as defined in claim 2 , wherein the coating layer has a thickness of 20 to 25 microns. 4. A method as defined in claim 2 , further comprising curing the coating layer. 5. A method as defined in claim 4 , wherein the curing is performed by a soft bake, near UV exposure (350-400 nm), followed by post exposure bake at an annealing temperature of 205 degrees C. so that the coating layer is inert to subsequent chemical and thermal fabrication steps. 6. A method as defined in claim 1 , wherein the metal contact layer comprises a sequence of metal layers Ti/Au/Ag/Au or Ti/Pd/Ag. 7. A method as defined in claim 1 , wherein the metal contact layer is specularly reflective over the wavelength range of incoming light. 8. A method as defined in claim 2 , further comprising depositing a bonding layer over the coating layer. 9. A method as defined in claim 1 , wherein the thermocompressive technique utilizes a press for directly applying pressure and heat. 10. A method as defined in claim 1 , wherein the permanent supporting substrate is a glass substrate, the method further comprising bonding an adhesive polyimide layer to a surface of the support substrate at a curing temperature above 350° C., prior to the supporting substrate being affixed to the metal contact layer. 11. A method as defined in claim 1 , wherein the semiconductor substrate is removed, after the surrogate substrate has been attached, by at least one of grinding, etching, or epitaxial lift-off. 12. A method as defined in claim 1 , further comprising following removal of the semiconductor growth substrate forming grid electrodes on a surface of the layers of semiconductor material to form a top or light-incident surface of the solar cell. 13. A method as defined in claim 12 , further comprising attaching a cover glass over the grid electrodes.

Assignees

Inventors

Classifications

  • Solar cells from Group III-V materials · CPC title

  • Manufacturing or production processes characterised by the final manufactured product · CPC title

  • comprising nitride compounds, e.g. InGaN · CPC title

  • having three or more elements, e.g. GaAlAs, InGaAs or InGaAsP · CPC title

  • comprising only Group III-V materials, e.g. GaAs · CPC title

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What does patent US11424381B2 cover?
The present disclosure provides a method of manufacturing a solar cell that includes providing a semiconductor growth substrate; depositing on said growth substrate a sequence of layers of semiconductor material forming a solar cell; applying a metal contact layer over said sequence of layers; affixing the adhesive polyimide surface of a permanent supporting substrate directly over said metal c…
Who is the assignee on this patent?
Solaero Tech Corp
What technology area does this patent fall under?
Primary CPC classification H10F77/1248. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 23 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).