Magnetic memory element incorporating dual perpendicular enhancement layers

US11417836B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11417836-B2
Application numberUS-202117156562-A
CountryUS
Kind codeB2
Filing dateJan 23, 2021
Priority dateSep 14, 2010
Publication dateAug 16, 2022
Grant dateAug 16, 2022

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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The present invention is directed to a magnetic memory element including a magnetic free layer structure incorporating three magnetic free layers separated by two perpendicular enhancement layers (PELs) and having a variable magnetization direction substantially perpendicular to layer planes thereof; an insulating tunnel junction layer formed adjacent to the magnetic free layer structure; a first magnetic reference layer formed adjacent to the insulating tunnel junction layer opposite the magnetic free layer structure; a second magnetic reference layer separated from the first magnetic reference layer by a third perpendicular enhancement layer; an anti-ferromagnetic coupling layer formed adjacent to the second magnetic reference layer; and a magnetic fixed layer formed adjacent to the anti-ferromagnetic coupling layer. The first and second magnetic reference layers have a first invariable magnetization direction substantially perpendicular to layer planes thereof. The magnetic fixed layer has a second invariable magnetization direction substantially opposite to the first invariable magnetization direction.

First claim

Opening claim text (preview).

What is claimed is: 1. A magnetic memory element comprising: a magnetic free layer structure including: first, second, and third magnetic free layers having a variable magnetization direction substantially perpendicular to layer planes thereof, said first, second, and third magnetic free layers each comprising cobalt and iron; a first perpendicular enhancement layer (PEL) interposed between said first and second magnetic free layers and comprising one of magnesium, molybdenum, titanium, zirconium, vanadium, or aluminum; and a second PEL interposed between said second and third magnetic free layers; an insulating tunnel junction layer formed adjacent to said first magnetic free layer opposite said first PEL; a magnetic reference layer structure including: first and second magnetic reference layers having a first invariable magnetization direction substantially perpendicular to layer planes thereof, said first magnetic reference layer formed adjacent to said insulating tunnel junction layer opposite said first magnetic free layer; and a third PEL interposed between said first and second magnetic reference layers; an anti-ferromagnetic coupling layer formed adjacent to said second magnetic reference layer opposite said third PEL; and a magnetic fixed layer formed adjacent to said anti-ferromagnetic coupling layer opposite said second magnetic reference layer, said magnetic fixed layer having a second invariable magnetization direction substantially opposite to said first invariable magnetization direction. 2. The magnetic memory element according to claim 1 , wherein said magnetic free layer structure is deposited on top of said insulating tunnel junction layer. 3. The magnetic memory element according to claim 1 , wherein said first, second, and third magnetic free layers have a body-centered cubic lattice structure. 4. The magnetic memory element according to claim 1 , wherein said first, second, and third magnetic free layers each further comprise boron. 5. The magnetic memory element according to claim 1 , wherein said second PEL comprises one of titanium, zirconium, vanadium, aluminum, magnesium, or molybdenum. 6. A magnetic memory element comprising: a magnetic free layer structure including: first, second, and third magnetic free layers having a variable magnetization direction substantially perpendicular to layer planes thereof, said first, second, and third magnetic free layers each comprising cobalt and iron; a first perpendicular enhancement layer (PEL) interposed between said first and second magnetic free layers; and a second PEL interposed between said second and third magnetic free layers and comprising one of magnesium, molybdenum, titanium, zirconium, vanadium, or aluminum; an insulating tunnel junction layer formed adjacent to said first magnetic free layer opposite said first PEL; a magnetic reference layer structure including: first and second magnetic reference layers having a first invariable magnetization direction substantially perpendicular to layer planes thereof, said first magnetic reference layer formed adjacent to said insulating tunnel junction layer opposite said first magnetic free layer; and a third PEL interposed between said first and second magnetic reference layers; an anti-ferromagnetic coupling layer formed adjacent to said second magnetic reference layer opposite said third PEL; and a magnetic fixed layer formed adjacent to said anti-ferromagnetic coupling layer opposite said second magnetic reference layer, said magnetic fixed layer having a second invariable magnetization direction substantially opposite to said first invariable magnetization direction. 7. The magnetic memory element according to claim 6 , wherein said magnetic free layer structure is deposited on top of said insulating tunnel junction layer. 8. The magnetic memory element according to claim 6 , wherein said first, second, and third magnetic free layers have a body-centered cubic lattice structure. 9. The magnetic memory element according to claim 6 , wherein said first, second, and third magnetic free layers each further comprise boron. 10. The magnetic memory element according to claim 6 , wherein said first PEL comprises one of titanium, zirconium, vanadium, aluminum, magnesium, or molybdenum. 11. A magnetic memory element comprising: a magnetic free layer structure including: first, second, and third magnetic free layers having a variable magnetization direction substantially perpendicular to layer planes thereof, said first, second, and third magnetic free layers each comprising cobalt and iron; a first perpendicular enhancement layer (PEL) interposed between said first and second magnetic free layers and comprising one of beryllium or barium; and a second PEL interposed between said second and third magnetic free layers; an insulating tunnel junction layer formed adjacent to said first magnetic free layer opposite said first PEL; a magnetic reference layer structure including: first and second magnetic reference layers having a first invariable magnetization direction substantially perpendicular to layer planes thereof, said first magnetic reference layer formed adjacent to said insulating tunnel junction layer opposite said first magnetic free layer; and a third PEL interposed between said first and second magnetic reference layers; an anti-ferromagnetic coupling layer formed adjacent to said second magnetic reference layer opposite said third PEL; and a magnetic fixed layer formed adjacent to said anti-ferromagnetic coupling layer opposite said second magnetic reference layer, said magnetic fixed layer having a second invariable magnetization direction substantially opposite to said first invariable magnetization direction. 12. The magnetic memory element according to claim 11 , wherein said magnetic free layer structure is deposited on top of said insulating tunnel junction layer. 13. The magnetic memory element according to claim 11 , wherein said first, second, and third magnetic free layers have a body-centered cubic lattice structure. 14. The magnetic memory element according to claim 11 , wherein said first, second, and third magnetic free layers each further comprise boron. 15. The magnetic memory element according to claim 11 , wherein said second PEL comprises one of magnesium, molybdenum, titanium, zirconium, vanadium, aluminum, beryllium, or barium. 16. A magnetic memory element comprising: a magnetic free layer structure including: first, second, and third magnetic free layers having a variable magnetization direction substantially perpendicular to layer planes thereof, said first, second, and third magnetic free layers each comprising cobalt and iron; a first perpendicular enhancement layer (PEL) interposed between said first and second magnetic free layers; and a second PEL interposed between said second and third magnetic free layers and comprising one of beryllium or barium; an insulating tunnel junction layer formed adjacent to said first magnetic free layer opposite said first PEL; a magnetic reference layer structure including: first and second magnetic reference layers having a first invariable magnetization direction substantially perpendicular to layer planes thereof, said first magnetic reference layer formed adjacent to said insulating tunnel junction layer opposite said first magnetic free layer; and a third PEL interposed between said first and second magnetic reference layers; an anti-ferromagnetic coupling layer formed adjacent to said second magnetic reference layer opposite said third PEL; and a m

Assignees

Inventors

Classifications

  • Devices using spin-polarised carriers · CPC title

  • Spin-exchange coupled multilayers having at least one layer with perpendicular magnetic anisotropy · CPC title

  • the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ] · CPC title

  • Spin-exchange coupled multilayers wherein the magnetisation of the free layer is switched by a spin-polarised current, e.g. spin torque effect · CPC title

  • Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance · CPC title

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What does patent US11417836B2 cover?
The present invention is directed to a magnetic memory element including a magnetic free layer structure incorporating three magnetic free layers separated by two perpendicular enhancement layers (PELs) and having a variable magnetization direction substantially perpendicular to layer planes thereof; an insulating tunnel junction layer formed adjacent to the magnetic free layer structure; a fir…
Who is the assignee on this patent?
Avalanche Technology Inc
What technology area does this patent fall under?
Primary CPC classification G11C11/161. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 16 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).