Semiconductor memory devices and memory systems with enhanced error detection and correction

Patent metadata

Field	Value
Publication number	US-11416335-B2
Application number	US-202016934677-A
Country	US
Kind code	B2
Filing date	Jul 21, 2020
Priority date	Dec 18, 2019
Publication date	Aug 16, 2022
Grant date	Aug 16, 2022

Abstract

A semiconductor memory device includes a memory cell array, an error correction circuit, an input/output (I/O) gating circuit and a control logic circuit. The memory cell array is coupled to word-line and bit-lines and is divided into sub array blocks. The error correction circuit generates parity data based on main data using an error correction code (ECC). The control logic circuit controls the error correction circuit and the I/O gating circuit based on a command and address. The control logic circuit stores the main data and the parity data in (k+1) target sub array blocks in the second direction among the sub array blocks, and controls the I/O gating circuit such that a portion of the (k+1) target sub array blocks store both of a portion of the main data and a portion of the parity data.

First claim

What is claimed is:

1. A semiconductor memory device, comprising:
a memory cell array having a plurality of volatile memory cells therein, the memory cell array connected to word-lines and bit-lines and divided into a plurality of sub array blocks;
an error correction circuit configured to generate parity data from main data using an error correction code (ECC) represented by a generation matrix;
an input/output (I/O) gating circuit connected between the memory cell array and the error correction circuit; and
a control logic circuit configured to control the error correction circuit and the I/O gating circuit responsive to a command and address received from an external memory controller, the control logic circuit configured to: (i) store the main data and the parity data in (k+1) target sub array blocks among the sub array blocks, and (ii) control the I/O gating circuit such that each of at least two target sub array blocks of the (k+1) target sub array blocks store both a portion of the main data and a portion of the parity data, where k is an even integer greater than two.

2. The semiconductor memory device of claim 1 , wherein the main data includes a plurality of data bits arranged into a plurality of sub data units; wherein the ECC includes a plurality of column vectors divided into a plurality of code groups corresponding to the sub data units and the parity data; and wherein the column vectors have elements to restrict a location of a sub data unit in which a mis-corrected bit occurs in response to a generation of multiple error bits of the main data that are uncorrectable by the ECC.

3. The semiconductor memory device of claim 2 ,
wherein the (k+1) target sub array blocks include a first set of sub array blocks configured to store some of the data bits of the main data, and a second set of sub array blocks configured to store both a portion of the data bits of the main data and the portion of the parity data;
wherein the plurality of code groups include a first set of code groups corresponding to the first set of sub array blocks, and a first set of code groups corresponding to the second set of sub array blocks; and
wherein the multiple error bits include a first error bit, a second error bit and a third error bit.

4. The semiconductor memory device of claim 3 , wherein each of the first set of code groups include first column vectors; and wherein each of the first column vectors includes the same elements with respect to each other.

5. The semiconductor memory device of claim 3 ,
wherein the multiple error bits include a first error bit and a second error bit;
wherein when a first sub data unit among the plurality of sub data units is stored in a first sub array block among the first set of sub array blocks and the first error bit and the second error bit are included in the first sub data unit, then the column vectors of a code group corresponding to the first sub array block, among the first set of code groups elements, are configured to place the mis-corrected bit in the first sub data unit; and
wherein the external memory controller is configured to correct the first error bit, the second error bit and the mis-corrected bit in the first sub data unit.

6. The semiconductor memory device of claim 3 ,
wherein the multiple error bits include a first error bit and a second error bit; and
wherein, when a sub data unit among the plurality of sub data units is stored in a sub array block among the second set of sub array blocks and the first error bit and the second error bit are included in the sub data unit, the column vectors have elements to restrict a location of the sub data unit in which the mis-corrected bit occurs, which is generated by the first error bit and the second error bit, such that the mis-corrected bit is correctable by the external memory controller.

7. The semiconductor memory device of claim 1 , wherein the control logic circuit is configured to control the I/O gating circuit such that the I/O gating circuit stores parity bits of the parity data in a k/2_th sub array block, a (k/2+1)_th sub array block and a (k/2+3)_th sub array block among the (k+1) target sub array blocks.

8. The semiconductor memory device of claim 1 , wherein the error correction circuit includes:
a memory configured to store the ECC;
an ECC encoder connected to the memory, the ECC encoder configured to perform an ECC encoding operation on the main data using the ECC to generate the parity data in a write operation of the semiconductor memory device; and
an ECC decoder connected to the memory, the ECC decoder configured to perform an ECC decoding operation on the main data based on the parity data using the ECC in a read operation of the semiconductor memory device.

9. The semiconductor memory device of claim 1 , further comprising:
at least one buffer die; and
a plurality of memory dies stacked on the at least one buffer die and conveying data through a plurality of through silicon via (TSV) lines; and
wherein at least one of the plurality of memory dies includes the memory cell array and the error correction circuit.

10. The semiconductor memory device of claim 9 , wherein the at least one buffer die includes a via error correction circuit configured to correct transmission error included in data transmitted through the TSV lines.

11. A semiconductor memory device, comprising:
a memory cell array having a plurality of volatile memory bank arrays therein, which are connected to a plurality of word-lines and a plurality of bit-lines;
an error correction circuit configured to generate parity data based on main data using an error correction code (ECC) represented by a generation matrix, the error correction circuit configured to: (i) store the main data and the parity data in a target area of a target page in the memory cell array, which is designated by an address, (ii) interleave the main data and the parity data such that parity bits of the parity data are stored symmetrically with respect to a virtual center line in the target area, and (iii) vary sub data patterns based on a least significant bit (LSB) of the address designating the target page, the main data and the parity data stored in the target area constituting the sub data patterns;
an input/output (I/O) gating circuit connected between the memory cell array and the error correction circuit; and
a control logic circuit configured to control the error correction circuit based on a command and an address received from an external memory controller.

12. The semiconductor memory device of claim 11 ,
wherein the main data includes a plurality of data bits and the parity data includes a plurality of parity bits; wherein the ECC includes a plurality of column vectors corresponding to the data bits and the parity bits; and
wherein the column vectors have elements to restrict a location of a sub data pattern in which a mis-corrected bit occurs, which is generated by error bits of the main data and the error bits that are uncorrectable by the ECC.

13. The semiconductor memory device of claim 12 , wherein when a first sub data pattern among the sub data patterns includes the error bits, the column vectors have elements to place the mis-corrected bit in the first sub data pattern or one of other sub data patterns among the sub data patterns except the first sub data pattern.

14. The semiconductor memory device of claim 12 , wherein when a first sub data pattern among the sub data patterns includes the error bits, the column vectors have elements to restrict a location of the sub data unit in which the mis-corrected bit occurs, which is generated by the error bits

Assignees

• Samsung Electronics Co Ltd

Inventors

• Cho Sunghye
• Kim Chanki
• Lee Kijun
• Cha Sanguhn
• Lee Myungkyu

Classifications

• H10W90/722

  between stacked chips · CPC title

• H10W90/297

  characterised by the through-semiconductor vias [TSVs] in the stacked chips · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/247

  Dispositions of multiple bumps · CPC title

• H10W72/07254

  changes in dispositions · CPC title