Compound, photopolymerization initiator containing said compound, and photosensitive resin composition containing said photopolymerization initiator

Patent metadata

Field	Value
Publication number	US-11414382-B2
Application number	US-201916976798-A
Country	US
Kind code	B2
Filing date	Feb 28, 2019
Priority date	Mar 2, 2018
Publication date	Aug 16, 2022
Grant date	Aug 16, 2022

Abstract

This compound, which absorbs long-wavelength active energy rays and generates with high-efficiency radicals and strong bases, and which has excellent reaction efficiency in a base generating chain reaction, is represented by formula (1), where, in formula (1), R1, R2, R3, R5 and R6 independently represent a hydroxy group, an alkoxy group, or an organic group other than those substituents, the R4's independently represent an organic group including a thioether bond, and ‘A’ represents a substituent represented by formula (1-1) or (1-2), where, in formula (1-1), R7 and R8 independently represent a hydrogen atom, an alkyl group or a heterocyclic group, and where, in formula (1-2), R9 and R10 independently represent an amino group or a substituted amino group. A photopolymerization initiator can include said compound; and a photosensitive resin composition can include said photopolymerization initiator.

First claim

The invention claimed is:

1. A compound having a following chemical formula (1):

wherein in formula (1), R 1 represents a hydroxy group, an alkoxy group or an organic group other than the aforementioned substituents; R 2 , R 3 , R 5 and R 6 each independently represent hydrogen atom, halogen atom, hydroxy group, alkoxy group, mercapto group, sulfide group, silyl group, silanol group, nitro group, nitroso group, cyano group, sulfino group, sulfo group, sulfonato group, phosphino group, phosphinyl group, phosphono group, phosphonato group, amino group, ammonio group or an organic group other than the aforementioned substituents, each of R 2 , R 3 , R 5 and R 6 plurally existing may be the same or different from each other; R 2 and R 3 on the same benzene ring may be connected to form a ring structure and R 5 and R 6 on the same benzene ring may be connected to form a ring structure; R 4 each independently represents a hydrogen atom or an organic group having a thioether bond, and at least one of R 4 is the organic group having a thioether bond; the organic group having a thioether bond represented by R 4 and R 3 or R 5 may be connected to form a ring structure; A is a substituent having a formula (1-1) or (1-2):

wherein in formula (1-1), R 7 and R 8 each independently represent a hydrogen atom or an alkyl group or a hetero cyclic group, or R 7 and R 8 may be connected to form a cyclic group; in formula (1-2), R 9 and R 10 each independently represent an amino group or a substituted amino group.

2. The compound according to claim 1 , wherein one of R 4 is an alkyl group having a thioether bond or an aryl group having a thioether bond, and the other is the hydrogen atom, an alkyl group having a thioether bond or an aryl group having a thioether bond.

3. The compound according to claim 1 , wherein R 1 is the hydroxy group.

4. A photopolymerization initiator containing the compound according to claim 1 .

5. A photosensitive resin composition containing the photopolymerization initiator according to claim 4 and a polymer precursor capable of being polymerized by irradiation or by both of irradiation and heating in presence of a photopolymerization initiator.

6. The photosensitive resin composition according to claim 5 , wherein the polymer precursor comprises at least one selected from the group consisting of a compound having a substituent selected from the group consisting of an epoxy group, an isocyanate group, an oxetane group, an acryloyl group, a methacryloyl group, a maleimide group and a thiirane group; a polysiloxane precursor; a polyimide precursor; and a polybenzoxazole precursor.

7. The photosensitive resin composition according to claim 6 , wherein the polymer precursor comprises the compound having an epoxy group.

8. The photosensitive resin composition according to claim 6 , wherein the polymer precursor comprises the compound having an acryloyl group and the polysiloxane precursor.

9. A cured product comprising the photosensitive resin composition according to claim 5 .

Assignees

• Nippon Kayaku Kk

Inventors

• TERADA Kiwamu
• Kuwabara Hirokazu

Classifications

• G03F7/031

  Organic compounds not covered by group G03F7/029 · CPC title

• C07D295/205

  Radicals derived from carbonic acid · CPC title

• C08F2/50

  with sensitising agents · CPC title

• C07D213/75

  Amino or imino radicals, acylated by carboxylic or carbonic acids, or by sulfur or nitrogen analogues thereof, e.g. carbamates · CPC title

• G03F7/0387

  Polyamides or polyimides · CPC title