Component carrier and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-11412618-B2
Application number	US-202017247883-A
Country	US
Kind code	B2
Filing date	Dec 29, 2020
Priority date	Dec 29, 2020
Publication date	Aug 9, 2022
Grant date	Aug 9, 2022

Abstract

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack. A component in the cavity has a stepped profile at at least one of its main surfaces. A resin clamping structure laterally engages the component and extends up to a step of the stepped profile. A method of manufacturing such a component carrier is also provided.

First claim

The invention claimed is:

1. A component carrier, comprising: a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; a cavity formed in the stack; a component in the cavity, wherein the component has a stepped profile at least one of its main surfaces; and a resin clamping structure laterally engaging the component and extending up to a step of the stepped profile, wherein the resin clamping structure laterally engages an entire first sidewall and a first sub-portion of a horizontal surface of the component and laterally engages an entire second sidewall and a second sub-portion of a horizontal surface of the component.

2. The component carrier according to claim 1 , wherein the component has a first stepped profile on at least one of a main surface and a first side surface.

3. The component carrier according to claim 2 , wherein the component has a second stepped profile on at least one of a lower main surface and a second side surface.

4. The component carrier according to claim 1 , wherein the resin clamping structure laterally extends up to a first step of the first stepped profile and up to a second step of the second stepped profile.

5. The component carrier according to claim 1 , wherein the stepped profile is formed by a main surface of a main body of the component and a confined sheet structure on only part of the main surface of the main body.

6. The component carrier according to claim 5 , wherein the main body is made of a material other than a material of the sheet structure.

7. The component carrier according to claim 5 , wherein the main body and the sheet structure are integrally formed from a metal.

8. The component carrier according to claim 1 , wherein the stepped profile is formed by a chamfered edge of a main body of the component.

9. The component carrier according to claim 1 , wherein the resin clamping structure laterally engages an entire sidewall and a sub-portion of a horizontal surface of the component.

10. The component carrier according to claim 1 , wherein the resin clamping structure is substantially C-shaped.

11. The component carrier according to claim 1 , wherein the resin clamping structure is free of fibers.

12. The component carrier according to claim 1 , wherein the at least one electrically insulating layer structure has sidewalls delimiting at least part of the cavity and comprises fibers.

13. The component carrier according to claim 1 , wherein the resin clamping structure is inserted into the cavity by laminating at least one further at least partially uncured electrically insulating layer structure on the stack and the component in the cavity.

14. The component carrier according to claim 1 , wherein the cavity has a non-polygonal outline.

15. A method of manufacturing a component carrier, the method comprising: providing a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; forming a cavity in the stack; inserting a component in the cavity, wherein the component has a stepped profile at least one of its main surfaces; and laterally engaging the component by a resin clamping structure extending up to a step of the stepped profile, wherein the resin clamping structure laterally engages an entire first sidewall and a first sub-portion of a horizontal surface of the component and laterally engages an entire second sidewall and a second sub-portion of a horizontal surface of the component.

Assignees

• At & S Austria Tech & Systemtechnik Ag

Inventors

• Liebfahrt Sabine
• Lutschounig Ferdinand
• Reitmaier Bernhard
• Platzer Julia
• Frewein Markus

Classifications

• H05K1/188 Primary

  manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component · CPC title

• H05K2201/10393

  Clamping a component by an element or a set of elements · CPC title

• H05K2203/1469

  Circuit made after mounting or encapsulation of the components · CPC title

• H05K1/185

  associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards · CPC title

• H05K2201/068

  wherein the coefficient of thermal expansion is important · CPC title