Integrated assemblies

Patent metadata

Field	Value
Publication number	US-11411118-B2
Application number	US-202017017426-A
Country	US
Kind code	B2
Filing date	Sep 10, 2020
Priority date	Sep 10, 2020
Publication date	Aug 9, 2022
Grant date	Aug 9, 2022

Abstract

Some embodiments include integrated memory. The integrated memory includes a first series of first conductive structures and a second series of conductive structures. The first conductive structures extend along a first direction. The second conductive structures extend along a second direction which crosses the first direction. Pillars of semiconductor material extend upwardly from the first conductive structures. Each of the pillars includes a lower source/drain region, an upper source/drain region, and a channel region between the lower and upper source/drain regions. The lower source/drain regions are coupled with the first conductive structures. Insulative material is adjacent sidewall surfaces of the pillars. The insulative material includes ZrO x , where x is a number greater than 0. The second conductive structures include gating regions which are spaced from the channel regions by at least the insulative material. Storage elements are coupled with the upper source/drain regions.

First claim

We claim:

1. A transistor, comprising:
an active region comprising a post structure comprising semiconductor material, the post structure having opposing sidewalls extending along an entirety of a height of the post structure and including a channel region between a first source/drain region and a second source/drain region, an entirety of each of the first source/drain region and the second source/drain region being within the post structure;
an insulative material adjacent the active region and extending along an entirety of the opposing sidewalls, the insulative material comprising ZrO where the chemical formula indicates primary constituents rather than a specific stoichiometry; and
a conductive gating material spaced from the active region by at least the insulative material and being operatively proximate the active region.

2. The transistor of claim 1 comprising one or more elements from Group 3 of the periodic table within the ZrO, with Group 3 being understood to include the lanthanide elements and the actinide elements in addition to Sc and Y.

3. The transistor of claim 1 comprising yttrium within the ZrO.

4. The transistor of claim 3 wherein the yttrium is present to a concentration within a range of from about 0.5 at % to about 0.05 at %.

5. The transistor of claim 1 wherein the semiconductor material comprises at least one element selected from Group 13 of the periodic table in combination with at least one element selected from Group 16 of the periodic table.

6. The transistor of claim 1 wherein the semiconductor material comprises oxide semiconductor material.

7. The transistor of claim 1 wherein the semiconductor material comprises InGaZnO, where the chemical formula indicates primary constituents rather than a specific stoichiometry.

8. The transistor of claim 1 wherein the conductive gating material includes one or more of TiN, Ru and TaN, where the chemical formulas indicate primary constituents rather than a specific stoichiometry.

9. The transistor of claim 1 wherein the conductive gating material includes ruthenium.

10. The transistor of claim 1 wherein the conductive gating material consists of ruthenium.

11. The transistor of claim 1 wherein the conductive gating material is operatively proximate the channel region.

12. The transistor of claim 11 wherein the semiconductor material is within the channel region, and is also within the source/drain regions.

13. The transistor of claim 11 wherein the semiconductor material is within the channel region, and wherein a material different from the semiconductor material is within one or both of the source/drain regions.

14. The transistor of claim 1 wherein the insulative material has a thickness within a range of from about 1 nm to about 10 nm.

15. The transistor of claim 1 wherein the insulative material is a first insulative material and wherein the semiconductor material laterally surrounds a second insulative material within the post structure.

16. The transistor of claim 1 wherein the semiconductor material laterally surrounds a void.

17. The transistor of claim 1 wherein the semiconductor material is one of two pillars, wherein the post structure is a common post comprising the two pillars, and wherein a conductive column is between said two pillars.

18. The transistor of claim 1 wherein the semiconductor material is one of two pillars, wherein the post structure is a common post comprising the two pillars, and wherein a void is between said two pillars.

19. An integrated assembly, comprising:
a conductive structure;
a pillar of semiconductor material extending upwardly from the conductive structure; the pillar having a pair of opposing sidewall surfaces along a cross-section, the sidewall surfaces extending along an entirety of a height of the pillar; the pillar including a lower source/drain region, an upper source/drain region, and a channel region between the lower and upper source/drain regions;
an insulative material adjacent an entirety of the opposing sidewall surfaces, the insulative material comprising ZrO where the chemical formula indicates primary constituents rather than a specific stoichiometry; and
a conductive gating material operatively proximate the channel region and spaced from the channel region by at least the insulative material.

20. The integrated assembly of claim 19 wherein the semiconductor material comprises at least one element selected from Group 13 of the periodic table in combination with at least one element selected from Group 16 of the periodic table.

21. The integrated assembly of claim 19 wherein the semiconductor material comprises InGaZnO, where the chemical formula indicates primary constituents rather than a specific stoichiometry.

22. The integrated assembly of claim 19 comprising a storage element coupled with the upper source/drain region; and wherein the lower source/drain region is coupled with the conductive structure.

23. The integrated assembly of claim 19 wherein the insulative material includes one or more of SiO, AlO, InO, SiON, HfO and TaO in addition to the ZrO, where the chemical formulas indicate primary constituents rather than a specific stoichiometry.

24. The integrated assembly of claim 19 wherein the insulative material includes AlO in addition to the ZrO, where the chemical formulas indicate primary constituents rather than a specific stoichiometry.

25. The integrated assembly of claim 24 wherein the insulative material comprises a first layer adjacent a second layer, with the first layer comprising the AlO and the second layer comprising the ZrO.

26. The integrated assembly of claim 25 comprising yttrium throughout the first and second layers.

27. The integrated assembly of claim 26 wherein the yttrium is present to a concentration within a range of from about 0.5 at % to about 0.05 at %.

28. The integrated assembly of claim 25 wherein the first layer is directly against the semiconductor material.

29. The integrated assembly of claim 25 wherein the second layer is directly against the semiconductor material.

30. The integrated assembly of claim 25 wherein the insulative material has an overall thickness, and wherein the first layer has a first thickness which comprises a percentage of the overall thickness, with such percentage being within a range of from about 5% to about 95%.

31. The integrated assembly of claim 25 comprising an abrupt interface between the first and second layers.

32. The integrated assembly of claim 25 comprising a gradient between the first and second layers.

Assignees

• Micron Technology Inc

Inventors

• Pulugurtha Srinivas
• Yang Litao
• Liu Haitao
• Karda Kamal M

Classifications

• H10D64/691

  comprising metallic compounds, e.g. metal oxides or metal silicates  (insulators comprising nitrogen H10D64/693) · CPC title

• H10D64/667

  the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers (having lateral variation H10D64/671) · CPC title

• H10D30/6755

  Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate · CPC title

• H10D30/6739

  Conductor-insulator-semiconductor electrodes · CPC title

• H10D30/6728 Primary

  Vertical TFTs · CPC title