Contact structures having conductive portions in substrate in three-dimensional memory devices and methods for forming the same

Patent metadata

Field	Value
Publication number	US-11411014-B2
Application number	US-202016739681-A
Country	US
Kind code	B2
Filing date	Jan 10, 2020
Priority date	Nov 22, 2019
Publication date	Aug 9, 2022
Grant date	Aug 9, 2022

Abstract

Embodiments of structure and methods for forming a three-dimensional (3D) memory device are provided. In an example, a 3D memory device includes a substrate, a memory stack on the substrate; and a source contact structure extending vertically through the memory stack. The source contact structure includes a first source contact portion in the substrate and having a conductive material different from the substrate. The source contact structure also includes a second source contact portion above, in contact with, and conductively connected to the first source contact portion.

First claim

What is claimed is:

1. A three-dimensional (3D) memory device, comprising:
a substrate;
a memory stack on the substrate; and
a source contact structure extending vertically through the memory stack, wherein the source contact structure comprises:
a first source contact portion in the substrate and comprising a at least one of a metal or a silicide, and
a second source contact portion above, in contact with, and conductively connected to the first source contact portion.

2. The 3D memory device of claim 1 , wherein a bottom surface of the first source contact portion is below a top surface of the substrate and a top surface of the first source contact portion is coplanar with the top surface of the substrate.

3. The 3D memory device of claim 1 , wherein the first source contact portion comprises at least one of tungsten, cobalt, aluminum, or copper.

4. The 3D memory device of claim 3 , wherein the first source contact portion further comprises an adhesive layer in contact with the substrate and the at least one of the metal or the silicide.

5. The 3D memory device of claim 4 , wherein the adhesive layer comprises at least one of titanium, titanium nitride, tantalum, or tantalum nitride.

6. The 3D memory device of claim 3 , wherein the second source contact portion is in contact with the first source contact portion at an interface coplanar with a top surface of the substrate, the second source contact portion comprising at least one of tungsten, cobalt, aluminum, copper, silicides, or polysilicon.

7. The 3D memory device of claim 6 , wherein the second source contact portion comprises a first conductive material and a second conductive material, the first conductive material being above and in contact with the second conductive material, the second conductive material being in contact with the at least one of the metal or the silicide of the first source contact portion, the first conductive material being same as the at least one of the metal or the silicide, the second conductive material being different from the at least one of the metal or the silicide.

8. The 3D memory device of claim 6 , wherein the second source contact portion comprises a same material as the at least one of the metal or the silicide.

9. The 3D memory device of claim 1 , wherein the first source contact portion extends continuously along a lateral direction in which the source contact structure extends.

10. The 3D memory device of claim 9 , wherein the second source contact portion includes at least two sub-contacts disconnected from each other along the lateral direction.

11. The 3D memory device of claim 9 , wherein a lateral dimension of the first source contact portion is greater than a lateral dimension of the second source contact portion along a second lateral direction perpendicular to the lateral direction.

12. The 3D memory device of claim 1 , wherein the first source contact portion comprises metal.

13. The 3D memory device of claim 1 , further comprising a channel structure extending vertically through the memory stack, the channel structure being different from the source contact structure.

14. A three-dimensional (3D) memory device, comprising:
a substrate;
a memory stack on the substrate;
a memory string extending vertically through the memory stack;
a source contact extending vertically through the memory stack; and
a metal layer in the substrate, the metal layer being in contact with and conductively connected to the source contact.

15. The 3D memory device of claim 14 , wherein a bottom surface of the metal layer is below a top surface of the substrate and a top surface of the metal layer is coplanar with the top surface of the substrate.

16. The 3D memory device of claim 15 , wherein:
the metal layer extends continuously along a lateral direction the source contact extends; and
the metal layer comprises a first conductive material that comprises at least one of tungsten, cobalt, aluminum, or copper.

17. The 3D memory device of claim 16 , wherein the source contact includes at least two sub-contacts disconnected from each other along the lateral direction.

18. The 3D memory device of claim 16 , wherein
the source contact comprises a second conductive material in contact with the metal layer at an interface coplanar with the top surface of the substrate; and
the second conductive material is different from the first conductive material and comprises at least one of tungsten, cobalt, aluminum, copper, silicides, or polysilicon.

19. The 3D memory device of claim 18 , wherein the second conductive material comprises tungsten above and in contact with polysilicon.

20. The 3D memory device of claim 16 , wherein at least two sub-contacts are each in contact with and conductively connected to the metal layer.

Assignees

• Yangtze Memory Tech Co Ltd

Inventors

• Xia Ji
• Xu Wei
• Huang Pan
• Xu Wenxiang
• Wang Beihan

Classifications

• H10W20/4441

  the principal metal being a refractory metal · CPC title

• H10W20/4421

  the principal metal being copper · CPC title

• H10W20/4405

  the principal metal being aluminium · CPC title

• H10W20/43

  Layouts of interconnections · CPC title

• H10W20/031

  of conductive parts of the interconnections · CPC title