Composite member

Patent metadata

Field	Value
Publication number	US-11407201-B2
Application number	US-201816638752-A
Country	US
Kind code	B2
Filing date	Aug 13, 2018
Priority date	Aug 14, 2017
Publication date	Aug 9, 2022
Grant date	Aug 9, 2022

Abstract

A composite member (1) satisfies the following expressions. X/(E×|CTE(B)−CTE(A)|)≥50, X/(E×|CTE(B)−CTE(C)|)≥50, Y/|CTE(B)−CTE(A)|×L(BA)≤50, and Y/|CTE(B)−CTE(C)|×L(BC)≥50. X: shear bond strength (MPa) between the heat dissipating base substrate and heat generating member, Y: fracture elongation of the thermoconductive insulating adhesive film, E: modulus of elasticity (MPa) of the thermoconductive insulating adhesive film, CTE(A): linear expansion coefficient (° C.−1) of the heat dissipating base substrate, CTE(B): linear expansion coefficient (° C.−1) of the thermoconductive insulating adhesive film, CTE(C): linear expansion coefficient (° C.−1) of the material of the surface of the heat generating member in contact with the thermoconductive insulating adhesive film, L(BA): initial contact length (m) between the thermoconductive insulating adhesive film and the heat dissipating base substrate, and L(BC): initial contact length (m) between the thermoconductive insulating adhesive film and the heat generating member.

First claim

The invention claimed is:

1. A composite member,
wherein a heat dissipating base substrate is bonded to at least one surface of a heat generating member including a heat generating part capable of generating heat via a thermoconductive insulating adhesive film,
wherein a linear expansion coefficient of the thermoconductive insulating adhesive film is 15×10 −6 to 80×10 −6 (° C. −1 ), and
wherein the composite member satisfies Expressions (1-0) to Expressions (4-0), where |CTE(B)−CTE(A)|>0, |CTE(B)−CTE(C)|1>0,
X /( E×|CTE ( B )− CTE ( A )|)≥50  (1-0)

X /( E×|CTE ( B )− CTE ( C )|)≤50  (2-0)

Y/|CTE ( B )− CTE ( A )|× L ( BA )≥50  (3-0)

Y/|CTE ( B )− CTE ( C )|× L ( BC )≥50  (4-0)

and
the symbols in the above expressions indicate the following parameters:
X: shear bond strength (MPa) at 25° C. between the heat dissipating base substrate and the heat generating member which are bonded to each other via the thermoconductive insulating adhesive film,
Y: fracture elongation at 25° C. of the thermoconductive insulating adhesive film,
E: modulus of elasticity (MPa) at 25° C. of the thermoconductive insulating adhesive film,
CTE(A): linear expansion coefficient (° C. −1 ) of the heat dissipating base substrate,
CTE(B): linear expansion coefficient (° C. −1 ) of the thermoconductive insulating adhesive film,
CTE(C): linear expansion coefficient (° C. −1 ) of a material of a surface of the heat generating member in contact with the thermoconductive insulating adhesive film,
L(BA): initial maximum uniaxial length (m) of a region of the thermoconductive insulating adhesive film contact with the heat dissipating base substrate, and
L(BC): initial maximum uniaxial length (m) of a region of the thermoconductive insulating adhesive film in contact with the heat generating member.

2. The composite member according to claim 1 , which satisfies Expressions (1-1) to Expressions (4-1):
X /( E×|CTE ( B )− CTE ( A )|)≥100  (1-1)

X /( E×|CTE ( B )− CTE ( C )|)≥100  (2-1)

Y/|CTE ( B )− CTE ( A )|× L ( BA )≥100  (3-1)

Y/|CTE ( B )− CTE ( C )|× L ( BC )≥100  (4-1).

3. The composite member according to claim 1 , which satisfies Expressions (1-2) to Expressions (4-2):
X /( E×|CTE ( B )− CTE ( A )|)≥150  (1-2)

X /( E×|CTE ( B )− CTE ( C )|)≥150  (2-2)

Y/|CTE ( B )− CTE ( A )|× L ( BA )≥150  (3-2)

Y/|CTE ( B )− CTE ( C )|× L ( BC )≥150  (4-2).

4. The composite member according to claim 1 , which satisfies Expressions (1-3) to Expressions (4-3):
X /( E×|CTE ( B )− CTE ( A )|)≥200  (1-3)

X /( E×|CTE ( B )− CTE ( C )|)≥200  (2-3)

Y/|CTE ( B )− CTE ( A )|× L ( BA )≥200  (3-3)

Y/|CTE ( B )− CTE ( C )|× L ( BC )≥200  (4-3).

5. The composite member according to claim 1 , wherein the thermoconductive insulating adhesive film includes a thermoconductive insulating tiller and a binder resin.

6. The composite member according to claim 1 , wherein a material of the heat dissipating base substrate is a metal, and a material of a surface of the heat generating member in contact with the thermoconductive insulating adhesive film is a metal and/or a resin.

7. The composite member according to claim 1 , wherein a modulus of elasticity of the thermoconductive insulating adhesive film in a range of greater than or equal to −40° C. and less than 25° C. is 10 GPa or less, and a modulus of elasticity of the thermoconductive insulating adhesive film in a range of greater than or equal to 25° C. and less than or equal to 200° C. is 1 GPa or less.

8. The composite member according to claim 1 , wherein a fracture elongation of the thermoconductive insulating adhesive film is 0.02 or more at 25° C.

9. The composite member according to claim 1 , wherein the heat generating member includes a power semiconductor element.

10. The composite member according to claim 2 , wherein a modulus of elasticity of the thermoconductive insulating adhesive film in a range of greater than or equal to −40° C. and less than 25° C. is 10 GPa or less, and a modulus of elasticity of the thermoconductive insulating adhesive film in a range of greater than or equal to 25° C. and less than or equal to 200° C. is 1 GPa or less.

11. The composite member according to claim 3 , wherein a modulus of elasticity of the thermoconductive insulating adhesive film in a range of greater than or equal to −40° C. and less than 25° C. is 10 GPa or less, and a modulus of elasticity of the thermoconductive insulating adhesive film in a range of greater than or equal to 25° C. and less than or equal to 200° C. is 1 GPa or less.

12. The composite member according to claim 4 , wherein a modulus of elasticity of the thermoconductive insulating adhesive film in a range of greater than or equal to −40° C. and less than 25° C. is 10 GPa or less, and a modulus of elasticity of the thermoconductive insulating adhesive film in a range of greater than or equal to 25° C. and less than or equal to 200° C. is 1 GPa or less.

13. The composite member according to claim 2 , wherein a fracture elongation of the thermoconductive insulating adhesive film is 0.02 or more at 25° C.

14. The composite member according to claim 3 , wherein a fracture elongation of the thermoconductive insulating adhesive film is 0.02 or more at 25° C.

15. The composite member according to claim 4 , wherein a fracture elongation of the thermoconductive insulating adhesive film is 0.02 or more at 25° C.

Assignees

• Toyo Ink Sc Holdings Co Ltd
• Toyochem Co Ltd

Inventors

• SAWAGUCHI Toshiichi
• Tanaka Naohiro
• Sakaguchi Kaori
• Andou Kenji
• Kobayashi Hidenobu

Classifications

• H10W40/25

  characterised by their materials · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/30

  Die-attach connectors · CPC title

• H10W72/07336

  Soldering or alloying · CPC title