Electrical connection device, method for producing the same, and structure of flexible wiring board

Patent metadata

Field	Value
Publication number	US-11406014-B2
Application number	US-202117158439-A
Country	US
Kind code	B2
Filing date	Jan 26, 2021
Priority date	Mar 6, 2020
Publication date	Aug 2, 2022
Grant date	Aug 2, 2022

Abstract

In an electrical connection device in which a adhesive layer is disposed on a flexible base and a conductor pattern is provided on the adhesive layer, an elastomer pattern obtained by curing an ink containing an elastomer composition is formed on the adhesive layer, the conductor pattern obtained by curing an ink containing a conductive particle is formed on the elastomer pattern, and a longitudinal elastic modulus of the elastomer pattern is set to be larger than a longitudinal elastic modulus of the adhesive layer.

First claim

What is claimed is:

1. An electrical connection device comprising:
a flexible base;
an adhesive layer on the flexible base, the adhesive layer containing a pressure sensitive adhesive;
an elastomer pattern on the adhesive layer, the elastomer pattern being formed of a cured ink containing an elastomer composition; and
a conductor pattern on the elastomer pattern, the conductor pattern being formed of a cured ink containing conductive particles, wherein a longitudinal elastic modulus of the elastomer pattern is larger than a longitudinal elastic modulus of the adhesive layer.

2. The electrical connection device according to claim 1 , wherein the elastomer pattern and the conductor pattern have an identical pattern shape.

3. The electrical connection device according to claim 1 , wherein the longitudinal elastic modulus of the elastomer pattern is not greater than 1000 MPa.

Assignees

• Japan Aviation Electronics Ind Ltd

Inventors

• Sato Junya
• Mitsui Ryosuke
• Yamabayashi Yoshiaki
• Tanaka Atsushi

Classifications

• H05K3/12

  using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} · CPC title

• H05K1/118

  specially for flexible printed circuits, e.g. using folded portions · CPC title

• H05K2201/0133

  Elastomeric or compliant polymer · CPC title

• H05K3/207

  using a prefabricated paste pattern, ink pattern or powder pattern · CPC title

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title