Chemically amplified positive-type photosensitive resin composition, method for manufacturing substrate with template, and method for manufacturing plated article

US11402755B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11402755-B2
Application numberUS-201916294254-A
CountryUS
Kind codeB2
Filing dateMar 6, 2019
Priority dateMar 12, 2018
Publication dateAug 2, 2022
Grant dateAug 2, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A chemically amplified positive-type photosensitive resin composition capable of forming a resist pattern having excellent cross-sectional perpendicularity of a nonresist section even when a resist pattern is formed on a metal surface, and a method for manufacturing a substrate with a template and a method for manufacturing a plated article using the composition. The composition contains an acid generator, a resin, and a sulfur-containing compound including a sulfur-containing compound and a thiol compound that is different from the sulfur-containing compound.

First claim

Opening claim text (preview).

What is claimed is: 1. A chemically amplified positive-type photosensitive resin composition comprising: an acid generator (A) that produces an acid by irradiation with an active ray or radiation; a resin (B) whose solubility in alkali increases under an action of acid; and a sulfur-containing compound (C), wherein the sulfur-containing compound (C) comprises a sulfur-containing compound (C1), and a thiol compound (C2) that is different from the sulfur-containing compound (C1), and wherein the sulfur-containing compound (C1) is a compound represented by at least one of the following formulae (c1-1) and (c1-2): wherein in the formulae (c1-1) and (c1-2), a ring A is a monocyclic ring having 4 or more and 8 or less ring-forming atoms, or a polycyclic ring having 5 or more and 20 or less ring-forming atoms, X is —CR 1c R 2c —, —NR 3c —, —O—, —S—, —Se—, —Te—, ═CR 4c —, or ═N—, and R 1c , R 2c , R 3c , and R 4c each independently represents a hydrogen atom, a halogen atom, a nitro group, a cyano group, or an organic group, wherein the compound represented by the formula (c1-1) has one mercapto group in a molecule, and does not have a hydroxyl group; and the compound represented by the formula (c1-2) does not have a mercapto group and a hydroxyl group in the molecule, the composition comprises more than 0.05 and 2 parts by mass or less of the sulfur-containing compound (C) relative to 100 parts by mass of the resin (B), and the composition comprises 0.05 parts by mass or more and less than 2 parts by mass of the thiol compound (C2) relative to 100 parts by mass of the resin (B). 2. The chemically amplified positive-type photosensitive resin composition according to claim 1 , wherein a number of the ring-forming atoms in the ring A is 5 or more and 7 or less, and the ring A includes 1 or more and 3 or less nitrogen atoms as the ring-forming atoms. 3. The chemically amplified positive-type photosensitive resin composition according to claim 1 , further comprising an alkali soluble resin (D). 4. The chemically amplified positive-type photosensitive resin composition according to claim 3 , wherein the alkali soluble resin (D) comprises at least one resin selected from the group consisting of a novolak resin (D1), a polyhydroxystyrene resin (D2), and an acrylic resin (D3). 5. A method for manufacturing a substrate with a template, the method comprising: forming a photosensitive resin layer on a metal surface of a substrate having the metal surface, the photosensitive resin layer comprising the chemically amplified positive-type photosensitive resin composition according to claim 1 ; irradiating the photosensitive resin layer with an active ray or radiation to perform exposure; and developing the photosensitive resin layer after the exposure to create a template for forming a plated article. 6. A method for manufacturing a plated article, the method comprising plating the substrate with a template manufactured by the method according to claim 5 to form the plated article within the template. 7. The chemically amplified positive-type photosensitive resin composition according to claim 1 , wherein the thiol compound (C2) comprises at least one selected from the group consisting of a compound represented by the following formula (c2-2) and a benzene-polythiol compound: wherein R c5 and R c6 each independently represents a hydrogen atom or an alkyl group, R c7 represents a single bond or an alkylene group, R c8 represents an aliphatic group having a valence of u, which may include an atom other than a carbon atom, and u is an integer of 2 or more and 4 or less, wherein the thiol compound (C2) does not include any tautomer of the sulfur-containing compound (C1), and wherein the benzene-polythiol compound comprises at least one selected from the group consisting of 1,2-bis(mercaptomethyl)benzene, 1,3-bis(mercaptomethyl)benzene, 1,4-bis(mercaptomethyl)benzene, 1,2-bis(mercaptoethyl)benzene, 1,3-bis(mercaptoethyl)benzene, 1,4-bis(mercaptoethyl)benzene, 1,2,3-trimercaptobenzene, 1,2,4-trimercaptobenzene, 1,3,5-trimercaptobenzene, 1,2,3-tris(mercaptomethyl)benzene, 1,2,4-tris(mercaptomethyl)benzene, 1,3,5-tris(mercaptomethyl)benzene, 1,2,3-tris(mercaptoethyl)benzene, 1,2,4-tris(mercaptoethyl)benzene, 1,3,5-tris(mercaptoethyl)benzene, 2,5-toluenedithiol, 3,4-toluenedithiol, 1,3-di(p-methoxyphenyl)propane-2,2-dithiol, 1,3-diphenylpropane-2,2-dithiol, phenylmethane-1,1-dithiol, 2,4-di(p-mercaptophenyl)pentane, 1,2-bis(mercaptoethylthio)benzene, 1,3-bis(mercaptoethylthio)benzene, 1,4-bis(mercaptoethylthio)benzene, 1,2,3-tris(mercaptomethylthio)benzene, 1,2,4-tris(mercaptomethylthio)benzene, 1,3,5-tris(mercaptomethylthio)benzene, 1,2,3-tris(mercaptoethylthio)benzene, 1,2,4-tris(mercaptoethylthio)benzene, and 1,3,5-tris(mercaptoethylthio)benzene.

Assignees

Inventors

Classifications

  • Sulfur-, selenium-, or tellurium-containing compounds {(C08K5/0091 takes precedence)} · CPC title

  • Treatment before imagewise removal, e.g. prebaking {(G03F7/265 takes precedence)} · CPC title

  • Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen · CPC title

  • of aldehydes with phenols · CPC title

  • Imagewise removal using liquid means · CPC title

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What does patent US11402755B2 cover?
A chemically amplified positive-type photosensitive resin composition capable of forming a resist pattern having excellent cross-sectional perpendicularity of a nonresist section even when a resist pattern is formed on a metal surface, and a method for manufacturing a substrate with a template and a method for manufacturing a plated article using the composition. The composition contains an aci…
Who is the assignee on this patent?
Tokyo Ohka Kogyo Co Ltd, Tokyo Inst Tech
What technology area does this patent fall under?
Primary CPC classification G03F7/0392. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 02 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).