Chemically amplified positive-type photosensitive resin composition

Patent metadata

Field	Value
Publication number	US-10890845-B2
Application number	US-201715499026-A
Country	US
Kind code	B2
Filing date	Apr 27, 2017
Priority date	May 6, 2016
Publication date	Jan 12, 2021
Grant date	Jan 12, 2021

Abstract

A chemically amplified positive-type photosensitive resin composition capable of suppressing occurrence of footing in which the width of the bottom becomes narrower than that of the top in a nonresist section, denaturation of the surface of the metal substrate, and occurrence of a development residue, when a resist pattern serving as a template for a plated article is formed on a metal surface of the substrate having the metal surface by using the composition; a method for manufacturing a substrate with a template by using the composition; and a method for manufacturing a plated article using the substrate with the template. A mercapto compound having a specific structure is contained in the chemically resin composition which includes an acid generator, and a resin whose solubility in alkali increases under the action of acid.

First claim

What is claimed is:

1. A chemically amplified positive-type photosensitive resin composition, comprising:
(A) an acid generator that produces an acid when irradiated with an active ray or radiation;
(B) a resin whose solubility in alkali increases under an action of acid;
(C) a mercapto compound; and
(D1) a novolak resin as a (D) alkali-soluble resin, wherein the (C) mercapto compound is contained in an amount of 0.01 to 5 parts by mass relative to the total mass of 100 parts by mass of the (B) resin and the (D) alkali soluble resin, wherein the (C) mercapto compound is represented by the following formula (1):
HS—Y—(R) u   (1)

wherein R represents an acid decomposition group whose solubility in alkali increases under the action of acid; Y represents a linking group having a valency of u+1; and u represents an integer of 1 to 3.

2. The chemically amplified positive-type photosensitive resin composition according to claim 1 , wherein the (C) mercapto compound is a compound represented by the formula (2):

wherein R 1 , R 2 and R 3 each independently represent a linear or branched alkyl group; R 2 and R 3 may be bonded to each other to form a ring together with a carbon atom to which both are bonded; R 4 represents an aliphatic group having a valency of u+1 optionally containing an atom other than a carbon atom; and u represents an integer of 1 to 3.

3. A method for manufacturing a substrate with a template, comprising:
forming a photosensitive resin layer on a metal surface of a substrate having the metal surface, the photosensitive resin layer comprising the chemically amplified positive-type photosensitive resin composition according to claim 1 ;
irradiating the photosensitive resin layer with an active ray or radiation to perform exposure; and
developing the photosensitive resin layer after the exposure to create a template for forming a plated article.

4. A method for manufacturing a plated article, the method comprising: plating the substrate with the template manufactured by the method according to claim 3 to form the plated article within the template.

5. The chemically amplified positive-type photosensitive resin composition according to claim 1 , wherein an amount of the (C) mercapto compound is 0.05 to 2 parts by mass relative to the total mass of 100 parts by mass of the (B) resin and the (D) alkali soluble resin.

Assignees

• Tokyo Ohka Kogyo Co Ltd

Inventors

• Ebisawa Kazuaki
• Yamamoto Yuta

Classifications

• G03F7/32

  Liquid compositions therefor, e.g. developers · CPC title

• G03F7/26

  Processing photosensitive materials; Apparatus therefor (G03F7/12 - G03F7/24 take precedence) · CPC title

• G03F7/039 Primary

  Macromolecular compounds which are photodegradable, e.g. positive electron resists (G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023) · CPC title

• C23C18/1605

  by masking · CPC title

• C25D5/022

  using masking means · CPC title