Adsorptive temporary fixing sheet

Patent metadata

Field	Value
Publication number	US-11401448-B2
Application number	US-201816648044-A
Country	US
Kind code	B2
Filing date	Jun 11, 2018
Priority date	Sep 28, 2017
Publication date	Aug 2, 2022
Grant date	Aug 2, 2022

Abstract

Provided is an adsorption temporary fixing sheet having a sufficient shear adhesive strength in a direction parallel to its surface, having a weak adhesive strength in a direction vertical to the surface, and having excellent antistatic performance. The adsorption temporary fixing sheet includes a foam layer including an open-cell structure, and has a surface resistivity of from 1.0×104 to 1.0×1010Ω/□, wherein, when a silicon chip vertical adhesive strength of a surface of the foam layer after 18 hours at each of such different temperatures as −30° C., 23° C., or 80° C. is represented by V1, V2, or V3 (N/1 cm2), and when a silicon chip shearing adhesive strength of the surface of the foam layer after 18 hours at each of such different temperatures as −30° C., 23° C., or 80° C. is represented by H1, H2, or H3 (N/1 cm□), relationships of V1<H1, V2<H2, and V3<H3 are satisfied.

First claim

The invention claimed is:

1. An adsorption temporary fixing sheet, comprising a foam layer including an open-cell structure,
wherein the adsorption temporary fixing sheet has a surface resistivity of from 1.0×10 4 Ω/□ to 1.0×10 10 Ω/□, and
wherein, when a silicon chip vertical adhesive strength of a surface of the foam layer after 18 hours at −30° C. is represented by V1 (N/1 cm 2 ), a silicon chip vertical adhesive strength thereof after 18 hours at 23° C. is represented by V2 (N/1 cm 2 ), and a silicon chip vertical adhesive strength thereof after 18 hours at 80° C. is represented by V3 (N/1 cm 2 ), and
a silicon chip shearing adhesive strength of the surface of the foam layer after 18 hours at −30° C. is represented by H1 (N/1 cm 2 ), a silicon chip shearing adhesive strength thereof after 18 hours at 23° C. is represented by H2 (N/1 cm 2 ), and a silicon chip shearing adhesive strength thereof after 18 hours at 80° C. is represented by H3 (N/1 cm 2 ),
relationships of V1<H1, V2<H2, and V3<H3 are satisfied
where a silicon chip vertical adhesive strength is defined as follows: a surface opposite to an evaluation surface of the adsorption temporary fixing sheet is fixed onto a smooth stainless-steel plate with a silicone pressure-sensitive adhesive tape; a 2-kilogram roller is reciprocated once to bond a ground surface of a silicon chip having a thickness of 300 μm, which is obtained by grinding a silicon wafer with a grinder and singulating the silicon wafer into a 1 cm by 1 cm square with a dicing saw, to the adsorption temporary fixing sheet, and the resultant is aged at each of −30° C., 23° C., and 80° C. for 18 hours, and is left at rest at 23° C. for 2 hours; a mirror surface opposite to the ground surface of the silicon chip is compressed under a state in which a double-sided tape is bonded to a tip of an adapter of 20 mmΦ at a compression rate of 0.01 N/sec in a vertical direction until a load of 0.05 N is applied thereto, followed by peeling of the silicon chip at 10 mm/sec; and a maximum load at a time of the peeling is defined as the silicon chip vertical adhesive strength, and
a silicon chip shearing adhesive strength is a shear adhesive strength measured as follows: the surface opposite to the evaluation surface of the adsorption temporary fixing sheet is fixed onto a smooth stainless-steel plate with a silicone pressure-sensitive adhesive tape; a 2-kilogram roller is reciprocated once to bond a ground surface of a silicon chip having a thickness of 300 μm, which is obtained by grinding a silicon wafer with a grinder and singulating the silicon wafer into a 1 cm by 1 cm square with a dicing saw, to the adsorption temporary fixing sheet, and the resultant is aged at each of −30° C., 23° C., and 80° C. for 18 hours, and is left at rest at 23° C. for 2 hours; and a side surface of the silicon chip is pressed with a force gauge at a rate of 1 mm/sec, followed by the measurement of the shear adhesive strength.

2. The adsorption temporary fixing sheet according to claim 1 , wherein the V1 is 8 N/1 cm 2 or less.

3. The adsorption temporary fixing sheet according to claim 1 , wherein the H1 is 0.5 N/1 cm 2 or more.

4. The adsorption temporary fixing sheet according to claim 1 , wherein the V2 is 10 N/1 cm 2 or less.

5. The adsorption temporary fixing sheet according to claim 1 , wherein the H2 is 0.6 N/1 cm 2 or more.

6. The adsorption temporary fixing sheet according to claim 1 , wherein the V3 is 12 N/1 cm 2 or less.

7. The adsorption temporary fixing sheet according to claim 1 , wherein the H3 is 0.7 N/1 cm 2 or more.

8. The adsorption temporary fixing sheet according to claim 1 , wherein the foam layer has an apparent density of from 0.15 g/cm 3 to 0.90 g/cm 3 .

9. The adsorption temporary fixing sheet according to claim 1 , wherein the adsorption temporary fixing sheet has a surface resistivity of from 1.0×10 5 Ω/□ to 1.0×10 9 Ω/□.

10. The adsorption temporary fixing sheet according to claim 9 , wherein the adsorption temporary fixing sheet has a surface resistivity of from 5.0×10 5 Ω/□ to 5.0×10 8 Ω/□.

11. The adsorption temporary fixing sheet according to claim 10 , wherein the adsorption temporary fixing sheet has a surface resistivity of from 1.0×10 6 Ω/□ to 1.0×10 8 Ω/□.

12. The adsorption temporary fixing sheet according to claim 1 , wherein the thickness of the foam layer is 10 μm to 3,500 μm.

13. The adsorption temporary fixing sheet according to claim 1 , wherein the foam layer is a silicone foam layer.

14. The adsorption temporary fixing sheet according to claim 13 , wherein the silicone foam layer is formed by the heat curing of a silicone resin composition.

15. The adsorption temporary fixing sheet according to claim 14 , wherein the silicone resin composition includes at least: (A) 100 parts by weight of an organopolysiloxane having at least two alkenyl groups in a molecule thereof; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule thereof in such an amount that the number of moles of the silicon atom-bonded hydrogen atoms in the component (B) is from 0.4 mol to 20 mol with respect to 1 mol of the alkenyl groups in the component (A); (C) 100 parts by weight to 1,000 parts by weight of a mixture including water and an inorganic thickener; (D) 0.1 part by weight to 15 parts by weight of surfactants including (D-1) a nonionic surfactant having an HLB value of 3 or more and (D-2) a nonionic surfactant having an HLB value of less than 3, wherein the weight ratio of the component (D-1) to the component (D-2) is at least 1; (E) a hydrosilylation reaction catalyst; (F) 0.001 part by weight to 5 parts by weight of a curing retarder; and (G) a conductive substance having an amount of 0.1 part by weight to 100 parts by weight with respect to 100 parts by weight of the total amount of the component (A) and the component (B).

Assignees

• Nitto Denko Corp

Inventors

• Iseki Toru
• Kato Kazumichi
• Tokuyama Hideyuki
• Kanada Mitsuhiro

Classifications

• B32B15/046

  of foam · CPC title

• B32B27/32

  comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)} · CPC title

• C09J2301/312

  parameters being the characterizing feature · CPC title

• C08K2201/001

  Conductive additives · CPC title

• B32B2307/542

  Shear strength · CPC title