Thermoelectric cooler mount

Patent metadata

Field	Value
Publication number	US-11398573-B2
Application number	US-201916562785-A
Country	US
Kind code	B2
Filing date	Sep 6, 2019
Priority date	Oct 1, 2018
Publication date	Jul 26, 2022
Grant date	Jul 26, 2022

Abstract

An x-ray detector can be small and have efficient cooling. In one embodiment, the x-ray detector can comprise a thermoelectric cooler (TEC) with upper electrical connections, a support, a cap, and a silicon drift detector (SDD). A planar side of the support can be directly affixed to upper electrical connections of the TEC. The support can have a non-planar side, opposite of the planar side, with a raised structure. A bottom face of the cap can be affixed to the raised structure, forming a cavity between the cap and the non-planar side of the support. The SDD can be affixed to a top face of the cap. In another embodiment, the non-planar side of the support can face the TEC. In another embodiment, a PIN photodiode can be directly affixed to a plate and the plate directly affixed to upper electrical connections of the TEC.

First claim

What is claimed is:

1. An x-ray detector, comprising:
a thermoelectric cooler (TEC) comprising electrical components for thermoelectric cooling, including upper electrical connections in a top region, the upper electrical connections being electrically conductive;
a support carried by the TEC, the support including: a base with a planar side and a non-planar side opposite of the planar side, the planar side facing the TEC; and a raised structure on the non-planar side extending away from the base;
a cap carried by the support, being electrically insulative, and having a top face and a bottom face opposite the top face;
the bottom face of the cap affixed to the raised structure of the support, forming a cavity between the cap and the base of the support on the non-planar side of the support;
a silicon drift detector (SDD) affixed to the top face of the cap; and
the planar side of the support directly affixed to the upper electrical connections, the support being a single, solid, electrically insulative structure extending across the upper electrical connections and located between the upper electrical connections and the cap.

2. The x-ray detector of claim 1 , wherein the support is a blocking ceramic, the blocking ceramic including a metal blocking layer sandwiched between a pair of ceramic layers, the metal blocking layer adjoining the pair of ceramic layers.

3. The x-ray detector of claim 2 , wherein the pair of ceramic layers adjoin each other in a co-fired bond.

4. The x-ray detector of claim 1 , further comprising a channel at an outer perimeter of the support, the channel is in the raised structure, and the channel extends for an equivalent distance around the outer perimeter of the support.

5. The x-ray detector of claim 1 , further comprising:
an electronic component carried by the bottom face of the cap and extending into the cavity; and
a trace extending in a single plane along the bottom face of the cap from the electronic component to an outer perimeter of the cap.

6. The x-ray detector of claim 1 , wherein the support is free of electronic circuit traces.

7. The x-ray detector of claim 1 , wherein the raised structure comprises four separate posts with a post at each of four corners of the support.

8. The x-ray detector of claim 1 , wherein:
the raised structure extends upward from the base at an outer perimeter of the base; and
the raised structure is a rib extending around 75% of a perimeter of the support.

9. The x-ray detector of claim 1 , wherein:
the TEC further comprises elements extending between the top region and a bottom region, the top region is a top plane and the bottom region is a bottom plane;
the elements are electrically coupled in series by the upper electrical connections and by lower electrical connections in the bottom region, the lower electrical connections being electrically conductive;
alternating elements are made of a different material with respect to each other; and
alternating connections between adjacent elements are located alternately between the top region and the bottom region.

10. An x-ray detector comprising:
a thermoelectric cooler (TEC) comprising electrical components for thermoelectric cooling, including upper electrical connections in a top region, the upper electrical connections being electrically conductive;
a plate, a support, and a silicon drift detector (SDD) carried by the TEC with a sequence of the TEC, the plate, the support, then the SDD;
the plate: having a top side; having a bottom side opposite of the top side, the bottom side directly affixed to the upper electrical connections of the TEC; and being a single, solid, electrically insulative structure extending across the upper electrical connections;
the support comprising: a base with a planar side and a non-planar side opposite of the planar side; the planar side affixed to the SDD; the non-planar side facing the top side of the plate and including a raised structure extending towards the plate; and the raised structure including four separate posts with a post at each of four corners of the support or a rib extending around 25% and 95% of a perimeter of the support; and
the raised structure of the support directly affixed to the plate, forming a cavity between the plate and the base of the support on the non-planar side of the support.

11. The x-ray detector of claim 10 , wherein the plate is a blocking ceramic, the blocking ceramic including a metal blocking layer sandwiched between a pair of ceramic layers, the metal blocking layer adjoining the pair of ceramic layers.

12. The x-ray detector of claim 11 , wherein the pair of ceramic layers adjoin each other in a co-fired bond.

13. The x-ray detector of claim 10 , further comprising:
an electronic component carried by the non-planar side of the support and extending into the cavity; and
a trace, exposed to air, extending in a single plane along the non-planar side of the support from the electronic component, between the posts or through a gap in the rib, to an outer perimeter of the support.

14. The x-ray detector of claim 13 , wherein the plate is a single, solid, electrically insulative structure between the electrical connections in the top region of the TEC and the electronic component.

15. The x-ray detector of claim 10 , further comprising a channel at an outer perimeter of the support, a channel at an outer perimeter of the plate, or both.

16. An x-ray detector comprising:
a blocking ceramic sandwiched between an x-ray detection device and a cooling mechanism;
the blocking ceramic including a metal blocking layer sandwiched between a pair of ceramic layers, the metal blocking layer adjoining the pair of ceramic layers; and
the metal blocking layer comprises three layers of different metals including a layer closest to the x-ray detection device with a lowest atomic number of the three layers, a middle layer with an intermediate atomic number, and a layer farthest from the x-ray detection device with a largest atomic number of the three layers.

17. The x-ray detector of claim 16 , wherein:
the metal blocking layer includes a top face adjoining one of the pair of ceramic layers across all of the top face; and
the metal blocking layer includes a bottom face adjoining the other of the pair of ceramic layers across all of the bottom face.

18. The x-ray detector of claim 16 , wherein the pair of ceramic layers adjoin each other in a co-fired bond.

19. The x-ray detector of claim 16 , wherein the pair of ceramic layers adjoin each other at four outer corners.

20. An x-ray detector comprising:
a blocking ceramic sandwiched between an x-ray detection device and a cooling mechanism;
the blocking ceramic including a metal blocking layer sandwiched between a pair of ceramic layers, the metal blocking layer adjoining the pair of ceramic layers;
one of or both of the pair of ceramic layers include a cup facing the metal blocking layer;
the metal blocking layer is located in the cup;
the pair of ceramic layers adjoin each other in a co-fired bond at an entire outer perimeter of each of the pair of ceramic layers; and
a ground connection to the metal blocking layer through a hole in the blocking ceramic from a side of the blocking ceramic on which the x-ray detection device is located.

Assignees

• Moxtek Inc

Inventors

• Maynard Jason
• Chin Shawn S
• Barron Jonathan
• Hoffman David S

Classifications

• H10F77/93

  Interconnections · CPC title

• H10F30/29

  the devices being sensitive to radiation having very short wavelengths, e.g. X-rays, gamma-rays or corpuscular radiation · CPC title

• H10F77/60 Primary

  Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations · CPC title

• G01T1/244

  Auxiliary details, e.g. casings, cooling, damping or insulation against damage by, e.g. heat, pressure or the like · CPC title

• H01L31/115

  Electricity · mapped topic