Micromechanical pressure sensor system and method for manufacturing a micromechanical pressure sensor system

Patent metadata

Field	Value
Publication number	US-11397121-B2
Application number	US-201816620117-A
Country	US
Kind code	B2
Filing date	May 17, 2018
Priority date	Jun 8, 2017
Publication date	Jul 26, 2022
Grant date	Jul 26, 2022

Abstract

A micromechanical pressure sensor system, including: a substrate; a pressure sensor component connected to the substrate; and an essentially hollow frustum-shaped sleeve structure, which is connected to the substrate, which surrounds the pressure sensor component at least laterally and which has an opening at a side of the sleeve structure facing away from the substrate.

First claim

What is claimed is:

1. A micromechanical pressure sensor system, comprising:
a substrate;
a pressure sensor component connected to the substrate; and
an essentially hollow frustum-shaped sleeve structure connected to the substrate, the sleeve structure surrounding the pressure sensor component at least laterally and having an opening at a side of the sleeve structure facing away from the substrate, wherein a wider axial end of the sleeve structure faces the substrate and a narrower axial end of the sleeve structure faces away from substrate, and an interior of the sleeve structure bounded by jacket walls of the sleeve structure is narrower at the narrower axial end than at the wider axial end;
wherein the sleeve structure is filled with a gel.

2. The micromechanical pressure sensor system as recited in claim 1 , wherein the sleeve structure includes a closure structure which closes the opening.

3. The micromechanical pressure sensor system as recited in claim 2 , wherein the closure structure includes an oil-repelling layer.

4. The micromechanical pressure sensor system as recited in claim 1 , further comprising:
a housing, which, in a sealing area, is connected to the substrate and to the sleeve structure in a gas-tight manner using a sealing material, the sealing area being situated at the substrate and/or at the sleeve structure in an area between the substrate and an end of the sleeve structure facing away from the substrate.

5. The micromechanical pressure sensor system as recited in claim 4 , wherein the sealing area includes an area on a surface of the substrate which radially encloses the sleeve structure.

6. The micromechanical pressure sensor system as recited in claim 4 , wherein the sealing area includes a surface of a radially extending flange of the hollow frustum-shaped sleeve structure.

7. The micromechanical pressure sensor system as recited in claim 4 , wherein the sealing area includes at least a portion of a frustum jacket of the hollow frustum-shaped sleeve structure.

8. The micromechanical pressure sensor system as recited in claim 4 , wherein the housing, at an end of the housing facing the substrate, includes a recess in which the sealing material and/or a flange of the sleeve structure engages for forming a mechanical stop.

9. A method for manufacturing a micromechanical pressure sensor system, comprising the following steps:
providing a micromechanical pressure sensor system including a substrate, a pressure sensor component connected to the substrate, and an essentially hollow frustum-shaped sleeve structure connected to the substrate, the sleeve structure surrounding the pressure sensor component at least laterally and having an opening at a side of the sleeve structure facing away from the substrate, wherein a wider axial end of the sleeve structure faces the substrate and a narrower axial end of the sleeve structure faces away from substrate, and an interior of the sleeve structure bounded by jacket walls of the sleeve structure is narrower at the narrower axial end than at the wider axial end, and wherein the sleeve structure is filled with a gel;
providing a housing; and
connecting the housing to the substrate in a gas-tight manner and to the sleeve structure using a sealing material in a sealing area, which is situated at the substrate and/or at the sleeve structure in an area between the substrate and an end of the sleeve structure facing away from the substrate.

10. A micromechanical pressure sensor system, comprising:
a substrate;
a pressure sensor component connected to the substrate;
a sleeve structure which is connected to the substrate, the sleeve structure surrounding the pressure sensor component at least laterally and includes a circumferential groove at a lateral outer side of the sleeve structure facing away from the pressure sensor component;
wherein the sleeve structure is configured differently on two sides of the groove; and
a housing which encompasses the sleeve structure, the housing resting on the substrate and connecting to the sleeve structure in a gas-tight manner using a sealing ring in the groove.

11. The micromechanical pressure sensor system as recited in claim 10 , wherein the area of the sleeve structure is further removed from the substrate than the groove and has a lesser thickness in a radial direction than a section of the sleeve structure formed closer to the substrate.

12. The micromechanical pressure sensor system as recited in claim 11 , wherein the area of the sleeve structure which is further removed from the substrate than the groove has an outwardly directed chamfer.

13. The micromechanical pressure sensor system as recited in claim 10 , further comprising:
a housing; and
a sealing ring situated in the circumferential groove of the sleeve structure, the housing being connected to the sleeve structure in a gas-tight manner using the sealing ring.

14. A method for manufacturing a micromechanical pressure sensor system, comprising the following steps:
providing a micromechanical pressure sensor system including a substrate, a pressure sensor component connected to the substrate, and a sleeve structure which is connected to the substrate, the sleeve structure surrounding the pressure sensor component at least laterally and includes a circumferential groove at a lateral outer side of the sleeve structure facing away from the pressure sensor component, wherein the sleeve structure is configured differently on two sides of the groove; and
providing a housing which encompasses the sleeve structure, the housing resting on the substrate and connecting to the sleeve structure in a gas-tight manner using a sealing ring in the groove.

15. The micromechanical pressure sensor system as recited in claim 1 , wherein the sleeve structure is manufactured from deep drawn metal.

16. The micromechanical pressure sensor system as recited in claim 3 , wherein the closure structure includes an opaque layer.

Assignees

• Bosch Gmbh Robert

Inventors

• Schiller Uwe
• Haug Daniel
• Sodan Lars
• Knauss Michael
• Kuells Robert
• Schuler-Watkins Sebastian

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W72/347

  Dispositions of multiple die-attach connectors · CPC title