Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements

Patent metadata

Field	Value
Publication number	US-11394094-B2
Application number	US-201616328524-A
Country	US
Kind code	B2
Filing date	Sep 30, 2016
Priority date	Sep 30, 2016
Publication date	Jul 19, 2022
Grant date	Jul 19, 2022

Abstract

Generally, this disclosure provides apparatus and systems for coupling waveguides to a server package with a modular connector system, as well as methods for fabricating such a connector system. Such a system may be formed with connecting waveguides that turn a desired amount, which in turn may allow a server package to send a signal through a waveguide bundle in any given direction without bending waveguides.

First claim

What is claimed is:

1. A waveguide connector to operably couple one or more package excitation elements to at least one external waveguide, comprising:
a plurality of waveguides at least partially contained within a housing, each waveguide having a first end operably coupleable to a respective one of said one or more package excitation elements, and a second end operably coupleable to a respective one of said at least one external waveguides, said first and second ends being connected by walls, wherein:
said first end of each waveguide aligns with a first plane, and said second end of each waveguide aligns with a second plane disposed at an angle measured with respect to the first plane; and
the plurality of waveguides is arranged in a two-dimensional waveguide array comprising a plurality of vertically stacked one-dimensional waveguide arrays at least partially contained within the housing; and
wherein each of the plurality of vertically stacked one-dimensional arrays is offset horizontally from the waveguides of an adjacent one of the plurality of vertically stacked one-dimensional arrays.

2. A method of fabricating a waveguide connector, said method comprising:
forming a plurality of waveguides arranged in a two-dimensional waveguide array comprising a plurality of vertically stacked one-dimensional waveguide arrays at least partially contained within a housing, wherein any one of the plurality of vertically stacked one-dimensional arrays is offset horizontally from the waveguides of an adjacent one of the plurality of vertically stacked one-dimensional arrays, wherein each of the plurality of waveguides comprises a curved segment between a first straight segment and a second straight segment, the curved segment having a curvature, and wherein the first straight segment, the curved segment and the second straight segment are in the housing, said method of fabricating comprising:
depositing a conductive base layer;
subsequent to depositing the conductive base layer, depositing at least one sacrificial member comprising a sacrificial material adjacent to the conductive base layer, the at least one sacrificial member including at least:
a first end coincident with a first plane;
a second end coincident with a second plane, the second plane disposed at an angle measured with respect to the first plane; and
a peripheral surface on the conductive base layer, the peripheral surface being curved and coupling the first end with the second end; and

depositing a second conductive layer about at least a portion of the peripheral surface of the at least one sacrificial member thereby forming the plurality of waveguides.

3. The method of claim 2 , further comprising removing at least a portion of the sacrificial material and then at least partially filling at least one of the plurality of waveguides with a dielectric material.

4. The method of claim 2 , wherein said depositing the conductive base layer or the at least one sacrificial member is performed using three-dimensional (3D) printing or direct metal laminating.

5. A waveguide connector to operably couple one or more package excitation elements to at least one external waveguide, comprising:
a plurality of waveguides at least partially contained within a housing, each waveguide having a first end operably coupleable to a respective one of the one or more package excitation elements, and a second end operably coupleable to a respective one of said at least one external waveguides, said first and second ends being connected by walls, each waveguide comprising a curved segment between a first straight segment and a second straight segment, the curved segment having a curvature, and wherein the first straight segment, the curved segment and the second straight segment are in the housing, wherein:
the plurality of waveguides are arranged in a two-dimensional waveguide array comprising a plurality of vertically stacked one-dimensional waveguide arrays at least partially contained within the housing;
any one of the plurality of vertically stacked one-dimensional arrays is offset horizontally from the waveguides of an adjacent one of the plurality of vertically stacked one-dimensional arrays; and
said first end of each waveguide aligns with a first plane, and said second end of each waveguide aligns with a second plane disposed at an angle measured with respect to the first plane.

6. The waveguide connector of claim 5 , further comprising:
housing connection features enabling the waveguide connector to operably couple to at least one of a package or the at least one external waveguide; and
waveguide connection features enabling at least one waveguide of the plurality of waveguides to operably couple to at least one of the one or more package excitation elements or the at least one external waveguide.

7. The waveguide connector of claim 6 , wherein the housing connection features or the waveguide connection features comprise at least one of:
mechanical connection features;
chemical connection features;
thermal connection features; or
electromagnetic connection features.

8. The waveguide connector of claim 5 , wherein the walls of the plurality of waveguides are conductive and the walls comprise at least one of: metal walls or composite walls.

9. The waveguide connector of claim 5 , wherein the plurality of waveguides are configured to operate at a millimeter-wave or sub-Terahertz frequency.

10. The waveguide connector of claim 5 , wherein the housing comprises at least one of: a metal housing; a plastic housing; or a composite material housing.

11. A method of fabricating a waveguide connector, said method of fabricating the waveguide connector comprising:
forming a plurality of waveguides arranged in a two-dimensional waveguide array comprising a plurality of vertically stacked one-dimensional waveguide arrays at least partially contained within a housing, wherein any one of the plurality of vertically stacked one-dimensional arrays is offset horizontally from the waveguides of an adjacent one of the plurality of vertically stacked one-dimensional arrays, and wherein each waveguide comprises a curved segment between a first straight segment and a second straight segment, the curved segment having a curvature, and wherein the first straight segment, the curved segment and the second straight segment are in the housing, said method comprising:
forming a base housing layer, said base housing layer having a plurality of grooves formed therein, each of the plurality of grooves including at least:
a first end coincident with a first plane;
a second end coincident with a second plane, the second plane disposed at an angle measured with respect to the first plane; and

depositing a conductive material on at least a portion of curved surfaces forming the plurality of grooves;
at least partially filling each of the plurality of grooves with a sacrificial material;
depositing a conductive layer at least partially over the surface of the sacrificial material of each respective one of the plurality of grooves, each of the conductive layers conductively coupled to the conductive material deposited on the portion of the surfaces forming the respective grooves thereby forming the plurality of waveguides; and
forming a top housing layer.

12. The method of claim 11 , wherein forming the base housing layer comprises forming the base housing layer using three-dimensional (3D) printing.

13. The method of claim 11 , further comprising removing at least a portion of the sacrificial material.

14. The method of claim 13 , further comprising at least partially filling at least one of the plur

Assignees

• Intel Corp

Inventors

• Kamgaing Telesphor
• Oster Sasha
• Dogiamis Georgios
• Elsherbini Adel
• Liff Shawna
• Aleksov Aleksandar
• Swan Johanna
• Rawlings Brandon

Classifications

• H01P3/122

  Dielectric loaded (not air) · CPC title

• H01P3/12

  Hollow waveguides (H01P3/20 takes precedence) · CPC title

• H01P1/022

  in waveguides of polygonal cross-section (H01P1/065 takes precedence) · CPC title

• H01P3/121

  integrated in a substrate · CPC title

• H01P11/002

  Manufacturing hollow waveguides · CPC title