Electrically conductive adhesive film and dicing-die bonding film using the same
US-2019016928-A1 · Jan 17, 2019 · US
Sheet for heat bonding and sheet for heat bonding having dicing tape
US11390777B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11390777-B2 |
| Application number | US-201716326427-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 18, 2017 |
| Priority date | Aug 31, 2016 |
| Publication date | Jul 19, 2022 |
| Grant date | Jul 19, 2022 |
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- Title
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- Abstract
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Abstract
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A sheet for heat bonding, having a pre-sintering layer that becomes a sintered layer by being heated, and a component migration prevention layer.
First claim
Opening claim text (preview).
The invention claimed is: 1. A sheet for heat bonding comprising: a pre-sintering layer serving as a sintered layer after being heated; and a component migration prevention layer, wherein the pre-sintering layer contains metal fine particles and an organic binder; the organic binder contained in the pre-sintering layer contains a thermally decomposable binder; the thermally decomposable binder is polycarbonate; the component migration prevention layer contains at least an organic binder; and an amount of metal fine particles in the component migration prevention layer is less than an amount of metal fine particles in the pre-sintering layer. 2. The sheet for heat bonding according to claim 1 , wherein a content of the metal fine particles contained in the pre-sintering layer is within a range of 30 to 70% by volume based on the entire pre-sintering layer, and a content of the metal fine particles contained in the component migration prevention layer is within a range of 0 to 30% by volume based on the entire component migration prevention layer. 3. The sheet for heat bonding according to claim 1 , wherein the organic binder contained in the component migration prevention layer contains a thermally decomposable binder. 4. The sheet for heat bonding according to claim 1 , wherein the organic binder contained in the pre-sintering layer contains 20 to 80% by weight of an organic component having a molecular weight of 500 or less based on the entire organic binder of the pre-sintering layer, and the organic binder contained in the component migration prevention layer contains 0 to 20% by weight of an organic component having a molecular weight of 500 or less based on the entire organic binder of the component migration prevention layer. 5. The sheet for heat bonding according to claim 1 , wherein a thickness of the pre-sintering layer is within a range of 5 to 100 μm, and a thickness of the component migration prevention layer is within a range of 2 to 10 μm. 6. A sheet for heat bonding having dicing tape, comprising: a dicing tape; and the sheet for heat bonding according to claim 1 , wherein the sheet for heat bonding is laminated on the dicing tape in a state where the dicing tape and the component migration prevention layer are in contact with each other.
Assignees
Inventors
Classifications
used during dicing or grinding · CPC title
Wafer tapes, e.g. grinding or dicing support tapes · CPC title
Encapsulations, e.g. protective coatings · CPC title
Die-attach connectors and bond wires · CPC title
Connecting or disconnecting · CPC title
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Frequently asked questions
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- What does patent US11390777B2 cover?
- A sheet for heat bonding, having a pre-sintering layer that becomes a sintered layer by being heated, and a component migration prevention layer.
- Who is the assignee on this patent?
- Nitto Denko Corp
- What technology area does this patent fall under?
- Primary CPC classification C09J7/22. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jul 19 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).