Method for manufacturing a MEMS sensor

Patent metadata

Field	Value
Publication number	US-11390519-B2
Application number	US-201917267720-A
Country	US
Kind code	B2
Filing date	Sep 20, 2019
Priority date	Sep 25, 2018
Publication date	Jul 19, 2022
Grant date	Jul 19, 2022

Abstract

A method for manufacturing a MEMS sensor. The method includes: providing a substrate, applying a support layer onto a back side of the substrate, forming at least one cavity in the substrate in such a way that an access to the back side from the front side is formed, introducing a MEMS structure into the at least one cavity, and fixing the MEMS structure on the support layer.

First claim

What is claimed is:

1. A method for manufacturing a MEMS sensor, comprising the following steps:
providing a substrate;
applying a support layer onto a back side of the substrate;
forming at least one cavity in the substrate in such a way that an access to the back side from a front side of the substrate is formed;
introducing a MEMS structure into the at least one cavity; and
fixing the MEMS structure on the support layer.

2. The method as recited in claim 1 , wherein the support layer is a self-adhesive film layer, which is fixed at the substrate using adhesive bonding.

3. The method as recited in claim 1 , wherein the MEMS structure is provided with an access structure for a functional layer, and the MEMS structure is situated in such a way that the access structure is closed after the fixation of the MEMS structure on the support layer.

4. The method as recited in claim 1 , wherein, after the fixation of the MEMS structure, an ASIC element is positioned, using a die attach film and/or a liquid adhesive.

5. The method as recited in claim 4 , wherein the ASIC element is positioned on the MEMS structure.

6. The method as recited in claim 1 , wherein an overmolding of the substrate and at least the MEMS structure takes place using transfer or compression molding.

7. The method as recited in claim 4 , wherein contactings for the MEMS structure and/or for the ASIC element are situated on a front side of the substrate, and the MEMS structure and/or the ASIC element, is electrically contacted using wire bonding.

8. The method as recited in claim 6 , wherein the support layer is removed after the overmolding.

9. The method as recited in claim 8 , wherein the support layer is acted upon by light in a UV range and/or thermally in order to be removed.

10. The method as recited in claim 1 , wherein a plurality of cavities is formed, at least one MEMS structure being introduced into each of the cavities and, after an overmolding, a plurality of MEMS sensors are manufactured through separation according to the cavities, using mechanical sawing in a direction from the front side toward the back side of the substrate.

11. The method as recited in claim 4 , wherein at least one via is manufactured in the ASIC element, and the ASIC element and the MEMS structure are situated with respect to one another in such a way that the MEMS structure is electrically contacted using the at least one via of the ASIC element.

12. A MEMS sensor, comprising:
a substrate; and
a MEMS structure;
the MEMS sensor being formed by applying a support layer onto a back side of the substrate, forming at least one cavity in the substrate in such a way that an access to the back side from a front side of the substrate is formed, introducing the MEMS structure into the at least one cavity, and fixing the MEMS structure on the support layer.

Assignees

• Bosch Gmbh Robert

Inventors

• Schuler-Watkins Sebastian
• Haug Daniel
• Henn Tobias

Classifications

• G01L19/0069 Primary

  from the sensor to its support · CPC title

• B81C2203/0154

  Moulding a cap over the MEMS device · CPC title

• B81C3/001

  Bonding of two components · CPC title

• B81B2201/0264

  Pressure sensors · CPC title

• G01L19/06

  Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa · CPC title