Electronic apparatus, imaging apparatus, and mobile body

Patent metadata

Field	Value
Publication number	US-11382230-B2
Application number	US-201917041617-A
Country	US
Kind code	B2
Filing date	Mar 13, 2019
Priority date	Mar 27, 2018
Publication date	Jul 5, 2022
Grant date	Jul 5, 2022

Abstract

An electronic apparatus includes a first circuit board, a second circuit board, one or more electronic components, an enclosure portion, and a second housing. The electronic components are mounted on at least one of opposing surfaces of the first circuit board and the second circuit board that oppose each other. The enclosure portion supports a surface of each of the first circuit board and the second circuit board to oppose each other with a predetermined gap therebetween. The enclosure portion encloses a gap space that includes the one or more electronic components within a space between the first circuit board and the second circuit board. The second housing accommodates the first circuit board, the second circuit board, and the enclosure portion. The enclosure portion contacts the housing.

First claim

The invention claimed is:

1. An electronic apparatus comprising:
a first circuit board and a second circuit board;
one or more electronic components mounted on at least one of opposing surfaces of the first circuit board and the second circuit board;
an enclosure portion configured to support a surface of each of the first circuit board and the second circuit board to oppose each other and to enclose a gap space that includes the one or more electronic components, within the gap space defined by a predetermined gap between the first circuit board and the second circuit board;
a housing configured to accommodate the first circuit board, the second circuit board, and the enclosure portion, the enclosure portion contacting the housing; and
a partition wall that is fixed to the enclosure portion and partitions the gap space into a first circuit board space that includes an electronic component of the one or more electronic components that is mounted on the first circuit board and a second circuit board space that includes an electronic component of the one or more electronic components that is mounted on the second circuit board.

2. The electronic apparatus according to claim 1 ,
wherein the enclosure portion has heat conductivity and electrical conductivity and is grounded to a ground of at least one of the first circuit board and the second circuit board.

3. The electronic apparatus according to claim 1 ,
wherein the one or more electronic components include a first electronic component mounted on the first circuit board and a second electronic component mounted on the second circuit board, and
the first electronic component and the second electronic component are arranged in the gap space in a manner so as to not interfere with each other.

4. The electronic apparatus according to claim 1 ,
wherein the partition wall directly or indirectly contacts the one or more electronic components.

5. The electronic apparatus according to claim 4 ,
further comprising a heat conductor that contacts the partition wall and one of the one or more electronic components.

6. The electronic apparatus according to claim 1 ,
further comprising:
another electronic component mounted on a surface on an opposite side to one of the opposing surfaces of the first circuit board and the second circuit board; and
a shielding portion that shields the another electronic component and fixable to the enclosure portion.

7. An imaging apparatus comprising:
an electronic apparatus that includes:
a first circuit board and a second circuit board;
one or more electronic components mounted on at least one of opposing surfaces of the first circuit board and the second circuit board;
an enclosure portion configured to support a surface of each of the first circuit board and the second circuit board to oppose each other and to enclose a gap space that includes the one or more electronic components, within the gap space defined by a predetermined gap between the first circuit board and the second circuit board;
a housing configured to accommodate the first circuit board, the second circuit board, and the enclosure portion, the enclosure portion contacting the housing; and
a partition wall that is fixed to the enclosure portion and partitions the gap space into a first circuit board space that includes an electronic component of the one or more electronic components that is mounted on the first circuit board and a second circuit board space that includes an electronic component of the one or more electronic components that is mounted on the second circuit board.

8. A mobile body comprising:
an electronic apparatus that includes:
a first circuit board and a second circuit board;
one or more electronic components mounted on at least one of opposing surfaces of the first circuit board and the second circuit board;
an enclosure portion configured to support a surface of each of the first circuit board and the second circuit board to oppose each other and to enclose a gap space that includes the one or more electronic components, within the gap space defined by a predetermined gap between the first circuit board and the second circuit board;
a housing configured to accommodate the first circuit board, the second circuit board, and the enclosure portion, the enclosure portion contacting the housing; and
a partition wall that is fixed to the enclosure portion and partitions the gap space into a first circuit board space that includes an electronic component of the one or more electronic components that is mounted on the first circuit board and a second circuit board space that includes an electronic component of the one or more electronic components that is mounted on the second circuit board.

Assignees

• Kyocera Corp

Inventors

• Fujiwara Masaki
• Nakao Hiroshi

Classifications

• G03B17/55 Primary

  with provision for heating or cooling, e.g. in aircraft · CPC title

• H04N23/52 Primary

  Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements · CPC title

• H04N23/51

  Housings · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H05K7/04 Primary

  on conductive chassis · CPC title